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NXP Produkte - PMIC - Leistungsmanagement - spezialisiert

Aufzeichnungen 1.370
Page  4/46
Bild
Teilenummer
Hersteller
Beschreibung
Paket
Lager
Anzahl
Current - Supply
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
TEA2209T-1Y
NXP

TEA2209T

  • Applications: Power Supplies
  • Current - Supply: 2mA
  • Voltage - Supply: 0.4 ~ 14V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
Paket: -
Request a Quote
2mA
0.4 ~ 14V
-40°C ~ 125°C (TJ)
Surface Mount
16-SOIC (0.154", 3.90mm Width)
16-SO
TEA2209T-1J
NXP

IC ACTIVE BRIDGE CTRL SO16

  • Applications: Desktop, Notebook PCs
  • Current - Supply: 2mA
  • Voltage - Supply: 440V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
Paket: -
Request a Quote
2mA
440V
-40°C ~ 125°C (TJ)
Surface Mount
16-SOIC (0.154", 3.90mm Width)
16-SO
MC32PF8121F1EPR2
NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

  • Applications: Industrial, IoT
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
Paket: -
Request a Quote
-
2.5V ~ 5.5V
-40°C ~ 85°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS6515NAER2
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
Paket: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33PT2001AER2
NXP

SOLENOID CONTROLLER 6 64LQFP

  • Applications: Solenoid Controller
  • Current - Supply: -
  • Voltage - Supply: 0V ~ 72V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-HLQFP (10x10)
Paket: -
Request a Quote
-
0V ~ 72V
-40°C ~ 125°C (TA)
Surface Mount
64-LQFP Exposed Pad
64-HLQFP (10x10)
MFS8612BMBA0ES
NXP

IC FS86 SYSTEM BASIS CHIP ASIL

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 4.5V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
Paket: -
Request a Quote
-
4.5V ~ 60V
-40°C ~ 125°C (TA)
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC33FS8510A2ESR2
NXP

SYSTEM BASIS CHIP FS8500

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
Paket: -
Request a Quote
-
-
-
-
-
-
MC35FS6508CAER2
NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
Paket: -
Request a Quote
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MFS8613BMBA0ESR2
NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
Paket: -
Request a Quote
-
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MFS5600AMMA0ES
NXP

IC FS56 SYSTEM BASIS

  • Applications: -
  • Current - Supply: 140µA
  • Voltage - Supply: 2.7V ~ 36V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
Paket: -
Lager4.140
140µA
2.7V ~ 36V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
32-VFQFN Exposed Pad
32-HVQFN (5x5)
MC34PF4210A4ESR2
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8V ~ 4.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
Paket: -
Request a Quote
-
2.8V ~ 4.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC33FS6526CAER2
NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 2.7V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
Paket: -
Request a Quote
-
2.7V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33VR5500V1ESR2
NXP

VR5500

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
Paket: -
Request a Quote
-
-
-
-
-
-
MFS8632BMBA0ESR2
NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 36V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
Paket: -
Request a Quote
-
36V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MC33FS8415GYKSR2
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
Paket: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MFS2620AMBA0AD
NXP

AUTO SBC

  • Applications: -
  • Current - Supply: 30µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
Paket: -
Request a Quote
30µA
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MPF5020AMBA0ESR2
NXP

POWER MANAGEMENT IC, PRE-PROG, 3

  • Applications: Microcontroller, MCU
  • Current - Supply: 40µA
  • Voltage - Supply: 2.7V ~ 5.5V
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (6x6)
Paket: -
Request a Quote
40µA
2.7V ~ 5.5V
-40°C ~ 150°C (TJ)
Surface Mount, Wettable Flank
40-VFQFN Exposed Pad
40-HVQFN (6x6)
MC33FS8425G0KSR2
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
Paket: -
Request a Quote
15mA
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MFS5600AMMA8ES
NXP

IC BUCK QM 3.3V / 5.0V 32-QFN

  • Applications: -
  • Current - Supply: 140µA
  • Voltage - Supply: 2.7V ~ 36V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
Paket: -
Lager3.810
140µA
2.7V ~ 36V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
32-VFQFN Exposed Pad
32-HVQFN (5x5)
MFS5600AMMA7ES
NXP

IC BUCK QM 5.0V / 3.3V 32-QFN

  • Applications: -
  • Current - Supply: 140µA
  • Voltage - Supply: 2.7V ~ 36V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
Paket: -
Lager996
140µA
2.7V ~ 36V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
32-VFQFN Exposed Pad
32-HVQFN (5x5)
MFS2623AMDA0AD
NXP

SAFETY SYSTEM BASIS CHIP WITH LO

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
Paket: -
Request a Quote
-
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MFS8621BMDA0ES
NXP

IC FS86 SYSTEM BASIS CHIP ASIL

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 4.5V ~ 36V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
Paket: -
Request a Quote
-
4.5V ~ 36V
-40°C ~ 125°C (TA)
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC33PF8200DMESR2
NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
Paket: -
Request a Quote
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MFS8613BMBA0ES
NXP

IC FS86 SYSTEM BASIS CHIP ASIL

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 4.5V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
Paket: -
Request a Quote
-
4.5V ~ 60V
-40°C ~ 125°C (TA)
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MWCT2016SGVPA
NXP

MWCT2016S,MAXQFP100

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
Paket: -
Request a Quote
-
-
-
-
-
-
MWCT2D17SHVPBR
NXP

MWCT2D17S,MAXQFP172

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
Paket: -
Request a Quote
-
-
-
-
-
-
MFS2301BMBA0EPR2
NXP

IC

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
Paket: -
Request a Quote
-
-
-
-
-
-
MFS2630AMDA0AD
NXP

SAFETY SYSTEM BASIS CHIP WITH LO

  • Applications: -
  • Current - Supply: 29µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
Paket: -
Request a Quote
29µA
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MVR5510AVMA6EPR2
NXP

IC PMIC VR5510 QM

  • Applications: -
  • Current - Supply: 15mA
  • Voltage - Supply: 2.7V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
Paket: -
Request a Quote
15mA
2.7V ~ 60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MFS2630AMDA0ADR2
NXP

SAFETY SYSTEM BASIS CHIP WITH LO

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
Paket: -
Request a Quote
-
-
-
-
-
-