|
|
NXP |
MOSFET N-CH 55V 75A D2PAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 55V
- Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 60nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds: 4633pF @ 25V
- Vgs (Max): ±15V
- FET Feature: -
- Power Dissipation (Max): 211W (Tc)
- Rds On (Max) @ Id, Vgs: 8 mOhm @ 25A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: D2PAK
- Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
|
Paket: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Lager3.680 |
|
|
|
NXP |
MOSFET N-CH 30V QFN3333
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 30V
- Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
- Vgs(th) (Max) @ Id: 2.15V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 24nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 1316pF @ 15V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 55W (Tc)
- Rds On (Max) @ Id, Vgs: 5.8 mOhm @ 10A, 10V
- Operating Temperature: -55°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: 8-DFN3333 (3.3x3.3)
- Package / Case: 8-VDFN Exposed Pad
|
Paket: 8-VDFN Exposed Pad |
Lager7.696 |
|
|
|
NXP |
FET RF 65V 2.69GHZ NI780S
- Transistor Type: LDMOS
- Frequency: 2.69GHz
- Gain: 15.6dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 900mA
- Power - Output: 28W
- Voltage - Rated: 65V
- Package / Case: NI-780S
- Supplier Device Package: NI-780S
|
Paket: NI-780S |
Lager7.776 |
|
|
|
NXP |
FET RF 68V 2.6GHZ TO270-2 GW
- Transistor Type: LDMOS
- Frequency: 2.6GHz
- Gain: 14dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 160mA
- Power - Output: 3W
- Voltage - Rated: 68V
- Package / Case: TO-270-2 Gull Wing
- Supplier Device Package: TO-270-2 GULL
|
Paket: TO-270-2 Gull Wing |
Lager11.100 |
|
|
|
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP
- Applications: System Basis Chip
- Current - Supply: 4.5mA
- Voltage - Supply: 5.5 V ~ 18 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
|
Paket: 32-LQFP |
Lager6.080 |
|
|
|
NXP |
IC LED DRVR RGLTR DIM 2.6A 24QFN
- Type: DC DC Regulator
- Topology: Step-Up (Boost)
- Internal Switch(s): Yes
- Number of Outputs: 6
- Voltage - Supply (Min): 5V
- Voltage - Supply (Max): 21V
- Voltage - Output: 8 V ~ 60 V
- Current - Output / Channel: 2.6A (Switch)
- Frequency: 300kHz
- Dimming: PWM
- Applications: Backlight
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 24-UFQFN Exposed Pad
- Supplier Device Package: 24-QFN-EP (4x4)
|
Paket: 24-UFQFN Exposed Pad |
Lager3.728 |
|
|
|
NXP |
IC MPU MPC85XX 1.067GHZ 783BGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.067GHz
- Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
- RAM Controllers: DDR2, DDR3, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (8), 1 Gbps (4)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
|
Paket: 783-BBGA, FCBGA |
Lager9.060 |
|
|
|
NXP |
IC PROCESSOR DUAL CORE
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.2GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: GbE (3)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (1), USB 3.0 + PHY
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: Secure Boot, TrustZone?
- Package / Case: 625-BFBGA, FCBGA
- Supplier Device Package: 625-FCBGA (21x21)
|
Paket: 625-BFBGA, FCBGA |
Lager3.152 |
|
|
|
NXP |
IC MPU MPC83XX 400MHZ 516BGA
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 516-BBGA Exposed Pad
- Supplier Device Package: 516-TEPBGA (27x27)
|
Paket: 516-BBGA Exposed Pad |
Lager4.752 |
|
|
|
NXP |
IC PROCESSOR DUAL CORE 625BGA
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.2GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: GbE (3)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (1), USB 3.0 + PHY
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: Secure Boot, TrustZone?
- Package / Case: 625-BFBGA, FCBGA
- Supplier Device Package: 625-FCBGA (21x21)
|
Paket: 625-BFBGA, FCBGA |
Lager5.152 |
|
|
|
NXP |
IC MCU 8BIT 64KB FLASH 64LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 50MHz
- Connectivity: I2C, LIN, SCI, SPI
- Peripherals: LVD, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 22x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
|
Paket: 64-LQFP |
Lager6.512 |
|
|
|
NXP |
IC MCU 8BIT 32KB FLASH 44PLCC
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 33MHz
- Connectivity: I2C, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 32
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
|
Paket: 44-LCC (J-Lead) |
Lager2.640 |
|
|
|
NXP |
IC MCU 8BIT 32KB FLASH 64QFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: SCI, SPI
- Peripherals: POR, PWM
- Number of I/O: 51
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 512 x 8
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-QFP
- Supplier Device Package: 64-QFP (14x14)
|
Paket: 64-QFP |
Lager6.512 |
|
|
|
NXP |
IC MCU 8BIT 32KB FLASH 64QFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 64-QFP
- Supplier Device Package: 64-QFP (14x14)
|
Paket: 64-QFP |
Lager3.760 |
|
|
|
NXP |
IC MCU 8BIT 4KB FLASH 16QFN
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 12
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 16-VQFN Exposed Pad
- Supplier Device Package: 16-QFN-EP (5x5)
|
Paket: 16-VQFN Exposed Pad |
Lager29.700 |
|
|
|
NXP |
IC DSP 24BIT AUD 100MHZ 100-LQFP
- Type: Audio Processor
- Interface: Host Interface, I2C, SAI, SPI
- Clock Rate: 100MHz
- Non-Volatile Memory: ROM (24 kB)
- On-Chip RAM: 11.25kB
- Voltage - I/O: 3.30V
- Voltage - Core: 3.30V
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
|
Paket: 100-LQFP |
Lager5.712 |
|
|
|
NXP |
IC CLK BUFFER 1:18 250MHZ 32LQFP
- Type: Fanout Buffer (Distribution)
- Number of Circuits: 1
- Ratio - Input:Output: 1:18
- Differential - Input:Output: No/No
- Input: LVCMOS, LVTTL
- Output: LVCMOS
- Frequency - Max: 250MHz
- Voltage - Supply: 2.375 V ~ 3.465 V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 32-LQFP
- Supplier Device Package: 32-LQFP (7x7)
|
Paket: 32-LQFP |
Lager6.800 |
|
|
|
NXP |
MIFARE DESFIRE EV2
- Type: RFID Reader
- Frequency: 13.56MHz
- Standards: ISO 14443
- Interface: -
- Voltage - Supply: -
- Operating Temperature: -25°C ~ 70°C
- Package / Case: Die
- Supplier Device Package: Die
|
Paket: Die |
Lager8.748 |
|
|
|
NXP |
IC RF TXRX+MCU 802.15.4 56-VFQFN
- Type: TxRx + MCU
- RF Family/Standard: 802.15.4
- Protocol: Zigbee?
- Modulation: O-QPSK
- Frequency: 2.4GHz
- Data Rate (Max): 667kbps
- Power - Output: 2.75dBm
- Sensitivity: -96.5dBm
- Memory Size: 128kB ROM, 128kB RAM
- Serial Interfaces: I2C, JTAG, SPI, UART
- GPIO: 21
- Voltage - Supply: 2 V ~ 3.6 V
- Current - Receiving: 17.5mA
- Current - Transmitting: 15mA
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 56-VFQFN Exposed Pad
|
Paket: 56-VFQFN Exposed Pad |
Lager2.430 |
|
|
|
NXP |
IC MMIC AMP LNA WLCSP6
- Frequency: 1.559GHz ~ 1.61GHz
- P1dB: -
- Gain: 19dB
- Noise Figure: 0.6dB
- RF Type: Galileo, GLONASS, GPS
- Voltage - Supply: 1.5 V ~ 3.1 V
- Current - Supply: 7.5mA
- Test Frequency: -
- Package / Case: 6-XFBGA, WLCSP
- Supplier Device Package: 6-WLCSP (0.65x0.44)
|
Paket: 6-XFBGA, WLCSP |
Lager2.682 |
|
|
|
NXP |
528MHZETHERNET X1 USB OTG X1
- Core Processor: ARM® Cortex®-A7
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 528MHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: LPDDR2, DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: Electrophoretic, LCD
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 2.0 OTG + PHY (2)
- Voltage - I/O: 1.8V, 2.8V, 3.3V
- Operating Temperature: 0°C ~ 95°C (TJ)
- Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
- Package / Case: 272-LFBGA
- Supplier Device Package: 272-MAPBGA (9x9)
|
Paket: 272-LFBGA |
Lager8.256 |
|
|
|
NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 123
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 36x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
|
Paket: 144-LQFP |
Lager3.792 |
|
|
|
NXP |
HIGH-VOLTAGE I2C CONTROLLED OVER
- Switch Type: USB Switch
- Number of Outputs: 1
- Ratio - Input:Output: 1:1
- Output Configuration: -
- Output Type: P-Channel
- Interface: I2C
- Voltage - Load: 2.8V ~ 20V
- Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
- Current - Output (Max): 5.6A
- Rds On (Typ): 16mOhm
- Input Type: Non-Inverting
- Features: Slew Rate Controlled
- Fault Protection: Over Temperature, Over Voltage, UVLO
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 20-UFBGA, WLCSP
- Supplier Device Package: 20-WLCSP (2.16x1.7)
|
Paket: - |
Request a Quote |
|
|
|
NXP |
IC MCU 32BIT 512KB FLASH 100LQFP
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit Single-Core
- Speed: 75MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: DMA, LCD, RNG, WDT
- Number of I/O: 72
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
- Data Converters: A/D 12x16b SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
|
Paket: - |
Lager270 |
|
|
|
NXP |
IC MCU 32BIT EXT MEM 196LFBGA
- Core Processor: ARM® Cortex®-M7
- Core Size: 32-Bit Single-Core
- Speed: 600MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
- Number of I/O: 127
- Program Memory Size: -
- Program Memory Type: External Program Memory
- EEPROM Size: -
- RAM Size: 1M x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
- Data Converters: A/D 20x12b
- Oscillator Type: External, Internal
- Operating Temperature: 0°C ~ 95°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 196-LFBGA
- Supplier Device Package: 196-LFBGA (10x10)
|
Paket: - |
Lager1.440 |
|
|
|
NXP |
IC MCU 32BIT 256KB FLASH 64LQFP
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O: 50
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 36K x 8
- Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
- Data Converters: A/D 10x12b SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
|
Paket: - |
Request a Quote |
|
|
|
NXP |
IC MCU 32BIT ROMLESS 100TFBGA
- Core Processor: ARM® Cortex®-M4
- Core Size: 32-Bit Single-Core
- Speed: 180MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O: 64
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 360K x 8
- Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
- Data Converters: A/D 12x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-TFBGA
- Supplier Device Package: 100-TFBGA (9x9)
|
Paket: - |
Request a Quote |
|
|
|
NXP |
S32K118, M0+, FLASH 256K, RAM 25
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
|
Paket: - |
Request a Quote |
|