Xilinx Inc. Produkte

XC17V01VO8I

Xilinx Inc.

IC PROM SER 1M 8-SOIC

• Programmable Type: OTP
• Memory Size: 1Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-TSOP

Paket: 8-SOIC (0.154", 3.90mm Width)

XCF01SVOG20C

Xilinx Inc.

IC PROM SRL FOR 1M GATE 20-TSSOP

• Programmable Type: In System Programmable
• Memory Size: 1Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

Paket: 20-TSSOP (0.173", 4.40mm Width)

XC7Z100-L2FFG900I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 444K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

Paket: 900-BBGA, FCBGA

XC7K325T-1FFG900CES

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

• Number of LABs/CLBs: 25475
• Number of Logic Elements/Cells: 326080
• Total RAM Bits: 16404480
• Number of I/O: 500
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

Paket: 900-BBGA, FCBGA

XC2V250-4FGG256C

Xilinx Inc.

IC FPGA 172 I/O 256FBGA

• Number of LABs/CLBs: 384
• Number of Logic Elements/Cells: -
• Total RAM Bits: 442368
• Number of I/O: 172
• Number of Gates: 250000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

Paket: 256-BGA

XCV600-6BG432C

Xilinx Inc.

IC FPGA 316 I/O 432MBGA

• Number of LABs/CLBs: 3456
• Number of Logic Elements/Cells: 15552
• Total RAM Bits: 98304
• Number of I/O: 316
• Number of Gates: 661111
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 432-LBGA, Metal
• Supplier Device Package: 432-MBGA (40x40)

Paket: 432-LBGA, Metal

XCV150-4BG256I

Xilinx Inc.

IC FPGA 180 I/O 256BGA

• Number of LABs/CLBs: 864
• Number of Logic Elements/Cells: 3888
• Total RAM Bits: 49152
• Number of I/O: 180
• Number of Gates: 164674
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (27x27)

Paket: 256-BBGA

XCV1000E-8HQ240C

Xilinx Inc.

IC FPGA 158 I/O 240HQFP

• Number of LABs/CLBs: 6144
• Number of Logic Elements/Cells: 27648
• Total RAM Bits: 393216
• Number of I/O: 158
• Number of Gates: 1569178
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

Paket: 240-BFQFP Exposed Pad

XC7VX980T-1FFG1926C

Xilinx Inc.

IC FPGA 720 I/O 1926FCBGA

• Number of LABs/CLBs: 76500
• Number of Logic Elements/Cells: 979200
• Total RAM Bits: 55296000
• Number of I/O: 720
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1926-FCBGA (45x45)

Paket: 1924-BBGA, FCBGA

XCVU3P-1FFVC1517I

Xilinx Inc.

IC FPGA 520 I/O 1517FCBGA

• Number of LABs/CLBs: 49260
• Number of Logic Elements/Cells: 862050
• Total RAM Bits: 118067200
• Number of I/O: 520
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

Paket: 1517-BBGA, FCBGA

XC7VX690T-3FFG1157E

Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

• Number of LABs/CLBs: 54150
• Number of Logic Elements/Cells: 693120
• Total RAM Bits: 54190080
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1157-FCBGA (35x35)

Paket: 1156-BBGA, FCBGA

XC6VHX380T-1FFG1924C

Xilinx Inc.

IC FPGA 640 I/O 1924FCBGA

• Number of LABs/CLBs: 29880
• Number of Logic Elements/Cells: 382464
• Total RAM Bits: 28311552
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

Paket: 1924-BBGA, FCBGA

XC7VX485T-1FFG1930I

Xilinx Inc.

IC FPGA 700 I/O 1930FCBGA

• Number of LABs/CLBs: 37950
• Number of Logic Elements/Cells: 485760
• Total RAM Bits: 37969920
• Number of I/O: 700
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1930-FCBGA (45x45)

Paket: 1924-BBGA, FCBGA

XC6VHX255T-2FF1923I

Xilinx Inc.

IC FPGA 480 I/O 1923FCBGA

• Number of LABs/CLBs: 19800
• Number of Logic Elements/Cells: 253440
• Total RAM Bits: 19021824
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

Paket: 1924-BBGA, FCBGA

XQ4VLX100-11FF1148I

Xilinx Inc.

IC FPGA VIRTEX-4 100K 1148-FBGA

• Number of LABs/CLBs: 12288
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 4423680
• Number of I/O: 768
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1148-BBGA, FCBGA
• Supplier Device Package: 1148-FCPBGA (35x35)

Paket: 1148-BBGA, FCBGA

XC5VLX110-3FF1760C

Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 4718592
• Number of I/O: 800
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

Paket: 1760-BBGA, FCBGA

XQL4VFX40-9FF672I4095

Xilinx Inc.

IC FPGA VIRTEX-4FX 40K 672BGA

• Number of LABs/CLBs: 4656
• Number of Logic Elements/Cells: 41904
• Total RAM Bits: 2654208
• Number of I/O: 352
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FCBGA (27x27)

Paket: 672-BBGA, FCBGA

XC5VLX85-1FFG676C

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

• Number of LABs/CLBs: 6480
• Number of Logic Elements/Cells: 82944
• Total RAM Bits: 3538944
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

Paket: 676-BBGA, FCBGA

XC4VSX35-11FFG668C

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

• Number of LABs/CLBs: 3840
• Number of Logic Elements/Cells: 34560
• Total RAM Bits: 3538944
• Number of I/O: 448
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 668-BBGA, FCBGA
• Supplier Device Package: 668-FCBGA (27x27)

Paket: 668-BBGA, FCBGA

XC6SLX150T-3FGG900C

Xilinx Inc.

IC FPGA 540 I/O 900FBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 540
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 900-BBGA
• Supplier Device Package: 900-FBGA (31x31)

Paket: 900-BBGA

XC6SLX100-L1FG484C

Xilinx Inc.

IC FPGA 326 I/O 484FBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 326
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paket: 484-BBGA

XC3S1500-4FG320I

Xilinx Inc.

IC FPGA 221 I/O 320FBGA

• Number of LABs/CLBs: 3328
• Number of Logic Elements/Cells: 29952
• Total RAM Bits: 589824
• Number of I/O: 221
• Number of Gates: 1500000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 320-BGA
• Supplier Device Package: 320-FBGA (19x19)

Paket: 320-BGA

XC3S1400A-4FGG484I

Xilinx Inc.

IC FPGA 375 I/O 484FBGA

• Number of LABs/CLBs: 2816
• Number of Logic Elements/Cells: 25344
• Total RAM Bits: 589824
• Number of I/O: 375
• Number of Gates: 1400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

Paket: 484-BBGA

XC2S200-5FG256I

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

• Number of LABs/CLBs: 1176
• Number of Logic Elements/Cells: 5292
• Total RAM Bits: 57344
• Number of I/O: 176
• Number of Gates: 200000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

Paket: 256-BGA

XC6SLX100T-3CSG484I

Xilinx Inc.

IC FPGA 296 I/O 484CSBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

Paket: 484-FBGA, CSPBGA

XCR3512XL-12FGG324C

Xilinx Inc.

IC CPLD 512MC 10.8NS 324BGA

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 10.8ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 32
• Number of Macrocells: 512
• Number of Gates: 12000
• Number of I/O: 260
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 324-BBGA
• Supplier Device Package: 324-FBGA (23x23)

Paket: 324-BBGA

XCR3256XL-10FTG256C

Xilinx Inc.

IC CPLD 256MC 9NS 256BGA

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.1ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 6000
• Number of I/O: 164
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

Paket: 256-LBGA

XAZU2EG-L1SFVC784I

Xilinx Inc.

XAZU2EG-L1SFVC784I

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

Paket: -