Samsung says it will begin volume production of a 10nm Exynos AP in H2.
Toshiba has launched a new series of 600V planar MOSFETs known as “π-MOS IX”.
Eliminate the need for pin inserting and stitching equipment in automotive manufacturing
Gas sensor evaluation kit designed to be simple and cost-efficient (Sensirion SEK-SGP30)
HVC module provides very fast recognition speed (Omron HVC-P2)
The new power MOSFETs provide low resistance, increasing efficiency and power density
New range of power devices offers complete power solutions with enhanced energy efficiency
Panasonic introduced a Wi-Fi module(PAN9420) with 2.4GHz 802.11 b / g / n Wi-Fi that integrates stack and API to minimize firmware development and includes a complete security suite.
Vicor has introduced the highest current output ZVS buck regulator for 24V / 28V applications, delivering up to 20A regulated 5V output.
The A3941 is an H-bridge device that complements the existing automotive-grade MOSFET pre-integrated circuit product line.
16-bit ADC for digital communication
Toshiba introduced the first product in the TCR3UG family of small package LDO regulators with an output current of 300mA for power management of IoT modules, wearable devices and smartphones.
With 5G mobile communications expected to run on networks operating in the 60GHz millimetre-wave band, Jean Pierre Guillemet describes a technique for testing multi-port broadband components up to 145GHz
Flyback controller includes primary-side regulation and peak power mode (UCC28634)
Renesas aims at car radar with 32bit MCUs
On-chip metal-to-metal tunnelling makes light without lasers
Xilinx, Inc. announced availability of the automotive qualified Zynq® UltraScale+™ MPSoC family, enabling development of safety critical ADAS and Autonomous Driving Systems.
