TDK - Ceramic capacitors in modular flex-assembly technology | Heisener Electronics
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TDK - Ceramic capacitors in modular flex-assembly technology

Technology Cover
Nach Datum: 2019-01-16, TDK Corporation
TDK Corporation has expanded its lineup of CeraLink FA-type CeraLink capacitors in modular flexible assembly technology. This space-saving form is to add two, three, or ten identical capacitors in parallel on the same terminal to increase capacitance. The new FA types are available in 500VDC, 700VDC and 900VDC rated voltages. Depending on the voltage and number of capacitors, this results in a nominal capacitance value between 0.5 μF and 10 μF. A significant feature of these PLZT ceramic-based capacitors is that they allow a maximum operating temperature of 150C. The FA model has a width of 7.4 mm and a height of 9.1 mm. And the length is 6.3mm, 9.3mm or 30.3mm. Despite their small size, they provide up to 47ARMS of ripple current capability. A significant advantage of the parallel switch is the extremely low ESR value. In the high frequency range of 0.1MHz to 1MHz, the ESR value is significantly lower than 10mOhm. The lowest 3nH, the ESL value is also very low. Due to their low parasitics, these capacitors are well-suited for converter topologies through fast switching semiconductors such as GaN or SiC. The voltage overshoot during switching is particularly lower than traditional capacitor technology. These capacitors can also easily meet special requirements regarding size, current capacity and temperature.

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