Page 5 - 3M Produkte - Sockel für ICs, Transistoren

ICO-083-S8A-T

3M

CONN IC DIP SOCKET 8POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Polyester, Glass Filled
Operating Temperature: -65°C ~ 105°C

Paket: -

Lager4.140

8 (2 x 4)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Polyester, Glass Filled

-65°C ~ 105°C

268-5401-52-1102JH

3M

CONN SOCKET CLCC 68POS GOLD

Type: CLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager5.364

68 (4 x 17)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-55°C ~ 105°C

268-5401-50-1102JH

3M

CONN SOCKET CLCC 68POS GOLD

Type: CLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager7.830

68 (4 x 17)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-55°C ~ 105°C

268-5401-11-1102JH

3M

CONN SOCKET CLCC 68POS GOLD

Type: CLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager7.200

68 (4 x 17)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-55°C ~ 105°C

2100-7243-00-1807

3M

CONN SOCKET PQFP 100POS TIN-LEAD

Type: QFP
Number of Positions or Pins (Grid): 100 (4 x 25)
Pitch - Mating: -
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyethersulfone (PES), Glass Filled
Operating Temperature: 0°C ~ 105°C

Paket: -

Lager6.462

100 (4 x 25)

-

Tin-Lead

200µin (5.08µm)

Beryllium Copper

Through Hole

Open Frame

Solder

-

Tin-Lead

200µin (5.08µm)

Beryllium Copper

Polyethersulfone (PES), Glass Filled

0°C ~ 105°C

240-4846-00-3303

3M

CONN IC DIP SOCKET ZIF 40POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 250µin (6.35µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 250µin (6.35µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyether Imide (PEI), Glass Filled
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager6.192

40 (2 x 20)

0.100" (2.54mm)

Gold

250µin (6.35µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

250µin (6.35µm)

Beryllium Copper

Polyether Imide (PEI), Glass Filled

-55°C ~ 105°C

220-4842-00-3303

3M

CONN IC DIP SOCKET ZIF 20POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 250µin (6.35µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 250µin (6.35µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyether Imide (PEI), Glass Filled
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager2.520

20 (2 x 10)

0.100" (2.54mm)

Gold

250µin (6.35µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

250µin (6.35µm)

Beryllium Copper

Polyether Imide (PEI), Glass Filled

-55°C ~ 105°C

260-5204-01

3M

CONN SOCKET QFN 60POS GOLD

Type: QFN
Number of Positions or Pins (Grid): 60 (4 x 15)
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.020" (0.50mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polyethersulfone (PES)
Operating Temperature: -

Paket: -

Lager3.276

60 (4 x 15)

0.020" (0.50mm)

Gold

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.020" (0.50mm)

Gold

-

Beryllium Copper

Polyethersulfone (PES)

-

251-5949-51-0602

3M

CONN ZIG-ZAG ZIF 51POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 51 (1 x 25, 1 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager5.022

51 (1 x 25, 1 x 26)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

251-5949-52-0602

3M

CONN ZIG-ZAG ZIF 51POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 51 (1 x 25, 1 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager5.904

51 (1 x 25, 1 x 26)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

235-3019-02-0602

3M

CONN ZIG-ZAG ZIF 35POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager3.276

35 (1 x 17, 1 x 18)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

235-3019-01-0602

3M

CONN ZIG-ZAG ZIF 35POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager5.778

35 (1 x 17, 1 x 18)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

235-3019-52-0602

3M

CONN ZIG-ZAG ZIF 35POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager4.680

35 (1 x 17, 1 x 18)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

235-3019-51-0602

3M

CONN ZIG-ZAG ZIF 35POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 35 (1 x 17, 1 x 18)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager5.004

35 (1 x 17, 1 x 18)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

234-3034-02-0602

3M

CONN ZIG-ZAG ZIF 34POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 34 (2 x 17)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager2.898

34 (2 x 17)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

234-3034-01-0602

3M

CONN ZIG-ZAG ZIF 34POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 34 (1 x 34)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager6.228

34 (1 x 34)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

234-3034-52-0602

3M

CONN ZIG-ZAG ZIF 34POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 34 (2 x 17)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager7.254

34 (2 x 17)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

234-3034-51-0602

3M

CONN ZIG-ZAG ZIF 34POS GOLD

Type: Zig-Zag, ZIF (ZIP)
Number of Positions or Pins (Grid): 34 (2 x 17)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager2.988

34 (2 x 17)

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

236-6225-50-0602

3M

SOCKET ZIP IN-LINE 36POS

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paket: -

Lager5.778

-

239-5605-02-0602

3M

CONN ZIG-ZAG 39POS GOLD

Type: Zig-Zag
Number of Positions or Pins (Grid): 39 (1 x 19, 1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 150°C

Paket: -

Lager3.472

39 (1 x 19, 1 x 20)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 150°C

232-2601-50-0602

3M

IN-LINE ZIP STRIP POCKETS 32 CON

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paket: -

Lager4.680

-

239-5605-01-0602

3M

CONN ZIG-ZAG 39POS GOLD

Type: Zig-Zag
Number of Positions or Pins (Grid): 39 (1 x 19, 1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 150°C

Paket: -

Lager3.960

39 (1 x 19, 1 x 20)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 150°C

239-5605-52-0602

3M

CONN SOCKET 39POS ZIP STRIP

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paket: -

Lager3.526

-

232-1270-52-0602

3M

STAGGERED ZIP STRIP POCKETS 32 C

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paket: -

Lager3.042

-

232-1270-51-0602

3M

STAGGERED ZIP STRIP POCKETS 32 C

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paket: -

Lager4.230

-

232-1270-02-0602

3M

CONN SOCKET PGA ZIF 32POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager3.472

32 (2 x 16)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

232-1270-01-0602

3M

CONN SOCKET PGA ZIF 32POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polysulfone (PSU), Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager8.046

32 (2 x 16)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Polysulfone (PSU), Glass Filled

-55°C ~ 125°C

239-5605-51-0602

3M

CONN SOCKET 39POS ZIP STRIP

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paket: -

Lager6.876

-

284-1273-00-1102JH

3M

CONN SOCKET PLCC 84POS GOLD

Type: PLCC
Number of Positions or Pins (Grid): 84 (4 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager8.406

84 (4 x 21)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-55°C ~ 105°C

232-1297-00-3303

3M

CONN IC DIP SOCKET ZIF 32POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 250µin (6.35µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 250µin (6.35µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyether Imide (PEI), Glass Filled
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager5.580

32 (2 x 16)

0.100" (2.54mm)

Gold

250µin (6.35µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

250µin (6.35µm)

Beryllium Copper

Polyether Imide (PEI), Glass Filled

-55°C ~ 105°C