Sockel für ICs, Transistoren

SIP1X04-011BLF

Amphenol FCI

CONN SOCKET SIP 4POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 4 (1 x 4)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
• Operating Temperature: -

Paket: -

643647-8

TE Connectivity AMP Connectors

CONN SOCKET SIP 15POS TIN

• Type: SIP
• Number of Positions or Pins (Grid): 15 (1 x 15)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Phosphor Bronze
• Housing Material: Thermoplastic, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paket: -

A-CCS32-G

Assmann WSW Components

CONN SOCKET PLCC 32POS GOLD

• Type: PLCC
• Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: -
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paket: -

558-10-652M35-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

• Type: BGA
• Number of Positions or Pins (Grid): 652 (35 x 35)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Surface Mount
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

Paket: -

181-PRS15003-16

Aries Electronics

CONN SOCKET PGA ZIF GOLD

• Type: PGA, ZIF (ZIP)
• Number of Positions or Pins (Grid): -
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Nickel Bronze
• Contact Finish Thickness - Post: 50µin (1.27µm)
• Contact Material - Post: Beryllium Copper
• Housing Material: Polyphenylene Sulfide (PPS)
• Operating Temperature: -65°C ~ 200°C

Paket: -

550-10-478M26-131166

Preci-Dip

BGA PIN ADAPTER 1.27MM SMD

• Type: BGA
• Number of Positions or Pins (Grid): 478 (26 x 26)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

Paket: -

550-10-356M26-001166

Preci-Dip

BGA PIN ADAPTER 1.27MM SMD

• Type: BGA
• Number of Positions or Pins (Grid): 356 (26 x 26)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

Paket: -

28-3554-18

Aries Electronics

CONN IC DIP SOCKET ZIF 24POS

• Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 24 (2 x 12)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Nickel Boron
• Contact Finish Thickness - Mating: 50µin (1.27µm)
• Contact Material - Mating: Beryllium Nickel
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Nickel Boron
• Contact Finish Thickness - Post: 50µin (1.27µm)
• Contact Material - Post: Beryllium Nickel
• Housing Material: Polyetheretherketone (PEEK), Glass Filled
• Operating Temperature: -55°C ~ 250°C

Paket: -

30-7970-10

Aries Electronics

CONN SOCKET SIP 30POS TIN

• Type: SIP
• Number of Positions or Pins (Grid): 30 (1 x 30)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: 200µin (5.08µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paket: -

24-6503-21

Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 24 (2 x 12)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paket: -

110-93-322-41-801000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 22POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 22 (2 x 11)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame, Decoupling Capacitor
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paket: -

614-93-422-31-007000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 22POS GOLD

• Type: DIP, 0.4" (10.16mm) Row Spacing
• Number of Positions or Pins (Grid): 22 (2 x 11)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paket: -

346-93-161-41-013000

Mill-Max Manufacturing Corp.

CONN SOCKET SIP 61POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 61 (1 x 61)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Press-Fit
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin-Lead
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paket: -

09-7XXXX-10

Aries Electronics

CONN SOCKET SIP 9POS TIN

• Type: SIP
• Number of Positions or Pins (Grid): 9 (1 x 9)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: 200µin (5.08µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paket: -

01-0518-00

Aries Electronics

CONN SOCKET SIP 1POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 1 (1 x 1)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -

Paket: -

10-6503-31

Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

• Type: DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 10 (2 x 5)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paket: -

714-43-126-31-018000

Mill-Max Manufacturing Corp.

CONN SOCKET SIP 26POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 26 (1 x 26)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 30µin (0.76µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paket: -

18-820-90T

Aries Electronics

CONN IC DIP SOCKET 18POS TIN

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 18 (2 x 9)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: 200µin (5.08µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole, Right Angle, Horizontal
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6
• Operating Temperature: -

Paket: -

510-83-088-12-051101

Preci-Dip

CONN SOCKET PGA 88POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 88 (12 x 12)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paket: -

04-7500-10

Aries Electronics

CONN SOCKET SIP 4POS TIN

• Type: SIP
• Number of Positions or Pins (Grid): 4 (1 x 4)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: 200µin (5.08µm)
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Through Hole
• Features: Elevated
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paket: -

299-83-316-11-001101

Preci-Dip

CONN IC DIP SOCKET 16POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 16 (2 x 8)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole, Right Angle, Horizontal
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paket: -

714-43-101-31-018000

Mill-Max Manufacturing Corp.

CONN SOCKET SIP 1POS GOLD

• Type: SIP
• Number of Positions or Pins (Grid): 1 (1 x 1)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: -
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 30µin (0.76µm)
• Contact Material - Post: Brass Alloy
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature: -55°C ~ 125°C

Paket: -

116-83-428-41-003101

Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

• Type: DIP, 0.4" (10.16mm) Row Spacing
• Number of Positions or Pins (Grid): 28 (2 x 14)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Elevated, Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paket: -

215-1-20-003

CNC Tech

CONN IC DIP SOCKET 20POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 20 (2 x 10)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polybutylene Terephthalate (PBT)
• Operating Temperature: -55°C ~ 105°C

Paket: -

115-83-320-41-003101

Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 20 (2 x 10)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paket: -

10-823-90C

Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 10 (2 x 5)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole, Right Angle, Horizontal
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Brass
• Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature: -55°C ~ 105°C

Paket: -

232-1291-00-0602J

3M

CONN IC DIP SOCKET ZIF 32POS GLD

• Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid): 32 (2 x 16)
• Pitch - Mating: 0.070" (1.78mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 30µin (0.76µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Connector
• Features: Closed Frame
• Termination: Press-Fit
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 30µin (0.76µm)
• Contact Material - Post: Beryllium Copper
• Housing Material: Polysulfone (PSU), Glass Filled
• Operating Temperature: -55°C ~ 125°C

Paket: -

AR 16 HZW/TN

Assmann WSW Components

CONN IC DIP SOCKET 16POS GOLD

• Type: DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid): 16 (2 x 8)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Wire Wrap
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: 200µin (5.08µm)
• Contact Material - Post: Beryllium Copper
• Housing Material: Thermoplastic, Polyester
• Operating Temperature: -40°C ~ 105°C

Paket: -