Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Logic |
MODULE FIRE ENGINE
|
Paket: - |
Lager5.328 |
|
ColdFire V4e, MCF5485 | - | 200MHz | 16MB (NOR), 2MB (Boot) | 64MB | - | 3.7" x 4.5" (95mm x 114mm) | -40°C ~ 85°C |
||
Digi International |
MODULE 9C 64MB SDRAM 128MB FLASH
|
Paket: - |
Lager7.232 |
|
ARM926EJ-S, NS9360 | - | 155MHz | 128MB | 64MB | SO-DIMM-144 | 3.59" x 2.06" (91.2mm x 52.2mm) | -40°C ~ 85°C |
||
Logic |
SYSTEM ON MODULE AM3517
|
Paket: - |
Lager4.448 |
|
ARM? Cortex?-A8, AM3517 | - | 600MHz | 512MB | 256MB | Board-to-Board (BTB) Socket - 300 | 1.61" x 2.02" (40.9mm x 51.2mm) | -20°C ~ 70°C |
||
NXP |
MODULE FIRE ENGINE
|
Paket: - |
Lager7.424 |
|
ColdFire V4e, MCF5475 | - | 266MHz | 16MB | 64MB | - | 3.7" x 4.5" (93.4mm x 114.3mm) | 0°C ~ 70°C |
||
Rohm Semiconductor |
IC BIOMETRIX MODULE SCREW IN
|
Paket: - |
Lager5.840 |
|
- | - | - | - | - | - | - | - |
||
DLP Design Inc. |
MODULE USB-MCU FT2232D W/16F877A
|
Paket: - |
Lager6.992 |
|
PIC16F877A | FT2232D | 20MHz | 8KB | 368KB | USB - B, Pin Header | 2.8" x 1" (71.1mm x 25.4mm) | - |
||
Digi International |
MODULE XP 128MB SDRAM 32MB FLSH
|
Paket: - |
Lager5.104 |
|
- | - | - | - | - | - | - | - |
||
Digi International |
MODULE RABBITCORE RCM2130
|
Paket: - |
Lager6.080 |
|
Rabbit 2000 | - | 22.1MHz | 256KB | 128KB | 2 IDC Headers 2x20 | 2" x 3.5" (51mm x 89mm) | -40°C ~ 85°C |
||
Digi International |
MODULE
|
Paket: - |
Lager5.344 |
|
- | - | - | - | - | - | - | - |
||
Digi International |
MODULE 9P 64MB SDRAM 16MB FLASH
|
Paket: - |
Lager5.936 |
|
- | - | - | - | - | - | - | - |
||
Trenz Electronic GmbH |
SOM GIGABEE 2X512MB REV. 3
|
Paket: - |
Lager4.800 |
|
Spartan-6 LX-150 | - | 125MHz | 16MB | 1GB | Samtec LSHM | 1.97" x 1.57" (50mm x 40mm) | -40°C ~ 85°C |
||
Digi International |
MOD ME 9210 8MB SDRAM 4MB FLASH
|
Paket: - |
Lager6.560 |
|
ARM926EJ-S, NS9210 | - | 75MHz | 4MB | 8MB | RJ45 | 1.45" x 0.75" (36.7mm x 19.1mm) | -40°C ~ 80°C |
||
Zilog |
MODULE EZ80F91 512K 50MHZ
|
Paket: - |
Lager3.584 |
|
eZ80F91 | - | 50MHz | 256KB | 8KB (Internal), 128KB (External) | Mini-Headers 2x56 | 2" x 1.9" (50.8mm x 48.3mm) | 0°C ~ 70°C |
||
Trenz Electronic GmbH |
SOM ARDUZYNQ ZYNQ Z-7007S
|
Paket: - |
Lager6.560 |
|
ARM Cortex-A9 | Zynq-7000 (Z-7007S) | 766MHz | 16MB | 512MB | B2B | - | 0°C ~ 70°C |
||
Trenz Electronic GmbH |
SOM ZYNQ XA7Z020-1Q 1GB DDR3
|
Paket: - |
Lager6.372 |
|
ARM Cortex-A9 | Zynq-7000 (Z-7020) | - | 32MB | 1GB | Samtec LSHM | 1.97" x 1.57" (50mm x 40mm) | - |
||
Lantronix, Inc. |
XPORT DIRECT PLUS DEVICE NETWORK
|
Paket: - |
Lager5.968 |
|
- | - | - | - | - | - | - | - |
||
Trenz Electronic GmbH |
IC MODULE
|
Paket: - |
Lager5.232 |
|
- | - | - | - | - | - | - | - |
||
GHI Electronics, LLC |
IC MOD CORTEX-M4 100MHZ 320KB
|
Paket: - |
Lager5.824 |
|
ARM® Cortex®-M4 | - | 100MHz | 1MB (Internal), 4MB (External) | 320KB | - | 2.67" x 1.25" (67.7mm x 31.7mm) | - |
||
Trenz Electronic GmbH |
IC MODULE GIGABEE
|
Paket: - |
Request a Quote |
|
Spartan-6 LX-45 | - | 125MHz | 16MB | 256MB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
||
Trenz Electronic GmbH |
MPSOC MODULE WITH XILINX ZYNQ UL
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Critical Link LLC |
TEXAS INSTRUMENTS AM5729 SOM (32
|
Paket: - |
Request a Quote |
|
ARM® Cortex®-A15 | - | 1.5GHz | 32MB | 1GB | Board-to-Board (BTB) - 100, Edge Connector - 310 | 3.460" L x 2.730" W (87.88mm x 69.34mm) | 0°C ~ 70°C |
||
Trenz Electronic GmbH |
SOC MODULE WITH XILINX ZYNQ 7030
|
Paket: - |
Request a Quote |
|
Zynq™ XC7Z030-3SBG485E | ARM Cortex-A9 | - | 32MB | 1GB | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
||
Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
|
Paket: - |
Request a Quote |
|
Zynq UltraScale+ XCZU4CG-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 85°C |
||
Trenz Electronic GmbH |
ULTRASOM+ MPSOC MODULE WITH ZYNQ
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Trenz Electronic GmbH |
ULTRASOM+ MPSOC MODULE WITH AMD
|
Paket: - |
Request a Quote |
|
Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
||
Trenz Electronic GmbH |
MOD SOM DDR3L 1GB
|
Paket: - |
Request a Quote |
|
ARM Cortex-A9 | Zynq-7000 (Z-7045) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
||
Trenz Electronic GmbH |
IC SOC MODULE 1GB DDR3L
|
Paket: - |
Request a Quote |
|
ARM Cortex-A9 | Zynq-7000 (Z-7030) | 125MHz | 32MB | 1GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
||
Trenz Electronic GmbH |
MPSOC MODULE WITH XILINX ZYNQ UL
|
Paket: - |
Request a Quote |
|
Zynq™ UltraScale+™ ZU5EV-1I | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket | 2.220" L x 1.575" W (56.40mm x 40.00mm) | -40°C ~ 85°C |