Page 18 - Eingebettet - Mikrocontroller, Mikroprozessor, FPGA-Module | Integrierte Schaltungen (ICs) | Heisener Electronics
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Eingebettet - Mikrocontroller, Mikroprozessor, FPGA-Module

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Bild
Teilenummer
Hersteller
Beschreibung
Paket
Lager
Anzahl
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
M5485BFEE-E
Logic

MODULE FIRE ENGINE

  • Module/Board Type: MPU Core
  • Core Processor: ColdFire V4e, MCF5485
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 16MB (NOR), 2MB (Boot)
  • RAM Size: 64MB
  • Connector Type: -
  • Size / Dimension: 3.7" x 4.5" (95mm x 114mm)
  • Operating Temperature: -40°C ~ 85°C
Paket: -
Lager5.328
ColdFire V4e, MCF5485
-
200MHz
16MB (NOR), 2MB (Boot)
64MB
-
3.7" x 4.5" (95mm x 114mm)
-40°C ~ 85°C
CC-9C-V237-Z1-B
Digi International

MODULE 9C 64MB SDRAM 128MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9360
  • Co-Processor: -
  • Speed: 155MHz
  • Flash Size: 128MB
  • RAM Size: 64MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
  • Operating Temperature: -40°C ~ 85°C
Paket: -
Lager7.232
ARM926EJ-S, NS9360
-
155MHz
128MB
64MB
SO-DIMM-144
3.59" x 2.06" (91.2mm x 52.2mm)
-40°C ~ 85°C
SOMAM3517-10-1780RJXR
Logic

SYSTEM ON MODULE AM3517

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, AM3517
  • Co-Processor: -
  • Speed: 600MHz
  • Flash Size: 512MB
  • RAM Size: 256MB
  • Connector Type: Board-to-Board (BTB) Socket - 300
  • Size / Dimension: 1.61" x 2.02" (40.9mm x 51.2mm)
  • Operating Temperature: -20°C ~ 70°C
Paket: -
Lager4.448
ARM? Cortex?-A8, AM3517
-
600MHz
512MB
256MB
Board-to-Board (BTB) Socket - 300
1.61" x 2.02" (40.9mm x 51.2mm)
-20°C ~ 70°C
M5475CFE
NXP

MODULE FIRE ENGINE

  • Module/Board Type: MPU Core
  • Core Processor: ColdFire V4e, MCF5475
  • Co-Processor: -
  • Speed: 266MHz
  • Flash Size: 16MB
  • RAM Size: 64MB
  • Connector Type: -
  • Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm)
  • Operating Temperature: 0°C ~ 70°C
Paket: -
Lager7.424
ColdFire V4e, MCF5475
-
266MHz
16MB
64MB
-
3.7" x 4.5" (93.4mm x 114.3mm)
0°C ~ 70°C
MK67Q5250V-0101YC
Rohm Semiconductor

IC BIOMETRIX MODULE SCREW IN

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paket: -
Lager5.840
-
-
-
-
-
-
-
-
DLP-2232PB-G
DLP Design Inc.

MODULE USB-MCU FT2232D W/16F877A

  • Module/Board Type: MCU, USB Core
  • Core Processor: PIC16F877A
  • Co-Processor: FT2232D
  • Speed: 20MHz
  • Flash Size: 8KB
  • RAM Size: 368KB
  • Connector Type: USB - B, Pin Header
  • Size / Dimension: 2.8" x 1" (71.1mm x 25.4mm)
  • Operating Temperature: -
Paket: -
Lager6.992
PIC16F877A
FT2232D
20MHz
8KB
368KB
USB - B, Pin Header
2.8" x 1" (71.1mm x 25.4mm)
-
FS-387
Digi International

MODULE XP 128MB SDRAM 32MB FLSH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paket: -
Lager5.104
-
-
-
-
-
-
-
-
101-0446
Digi International

MODULE RABBITCORE RCM2130

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 2000
  • Co-Processor: -
  • Speed: 22.1MHz
  • Flash Size: 256KB
  • RAM Size: 128KB
  • Connector Type: 2 IDC Headers 2x20
  • Size / Dimension: 2" x 3.5" (51mm x 89mm)
  • Operating Temperature: -40°C ~ 85°C
Paket: -
Lager6.080
Rabbit 2000
-
22.1MHz
256KB
128KB
2 IDC Headers 2x20
2" x 3.5" (51mm x 89mm)
-40°C ~ 85°C
CC-9C-V223-RJ-25
Digi International

MODULE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paket: -
Lager5.344
-
-
-
-
-
-
-
-
CC-9P-V534-LX-B
Digi International

MODULE 9P 64MB SDRAM 16MB FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paket: -
Lager5.936
-
-
-
-
-
-
-
-
TE0600-03IMVF
Trenz Electronic GmbH

SOM GIGABEE 2X512MB REV. 3

  • Module/Board Type: FPGA
  • Core Processor: Spartan-6 LX-150
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
Paket: -
Lager4.800
Spartan-6 LX-150
-
125MHz
16MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
-40°C ~ 85°C
DC-ME-Y402-LX-JT
Digi International

MOD ME 9210 8MB SDRAM 4MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9210
  • Co-Processor: -
  • Speed: 75MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 80°C
Paket: -
Lager6.560
ARM926EJ-S, NS9210
-
75MHz
4MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 80°C
EZ80F915005MODG
Zilog

MODULE EZ80F91 512K 50MHZ

  • Module/Board Type: MCU, Ethernet Core
  • Core Processor: eZ80F91
  • Co-Processor: -
  • Speed: 50MHz
  • Flash Size: 256KB
  • RAM Size: 8KB (Internal), 128KB (External)
  • Connector Type: Mini-Headers 2x56
  • Size / Dimension: 2" x 1.9" (50.8mm x 48.3mm)
  • Operating Temperature: 0°C ~ 70°C
Paket: -
Lager3.584
eZ80F91
-
50MHz
256KB
8KB (Internal), 128KB (External)
Mini-Headers 2x56
2" x 1.9" (50.8mm x 48.3mm)
0°C ~ 70°C
TE0723-03-07S-1C
Trenz Electronic GmbH

SOM ARDUZYNQ ZYNQ Z-7007S

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7007S)
  • Speed: 766MHz
  • Flash Size: 16MB
  • RAM Size: 512MB
  • Connector Type: B2B
  • Size / Dimension: -
  • Operating Temperature: 0°C ~ 70°C
Paket: -
Lager6.560
ARM Cortex-A9
Zynq-7000 (Z-7007S)
766MHz
16MB
512MB
B2B
-
0°C ~ 70°C
TE0720-03-1QF
Trenz Electronic GmbH

SOM ZYNQ XA7Z020-1Q 1GB DDR3

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7020)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -
Paket: -
Lager6.372
ARM Cortex-A9
Zynq-7000 (Z-7020)
-
32MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
-
XPDNC200S-01
Lantronix, Inc.

XPORT DIRECT PLUS DEVICE NETWORK

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paket: -
Lager5.968
-
-
-
-
-
-
-
-
TEC0850-03-015EG1E
Trenz Electronic GmbH

IC MODULE

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paket: -
Lager5.232
-
-
-
-
-
-
-
-
UC2550-13NNN
GHI Electronics, LLC

IC MOD CORTEX-M4 100MHZ 320KB

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-M4
  • Co-Processor: -
  • Speed: 100MHz
  • Flash Size: 1MB (Internal), 4MB (External)
  • RAM Size: 320KB
  • Connector Type: -
  • Size / Dimension: 2.67" x 1.25" (67.7mm x 31.7mm)
  • Operating Temperature: -
Paket: -
Lager5.824
ARM® Cortex®-M4
-
100MHz
1MB (Internal), 4MB (External)
320KB
-
2.67" x 1.25" (67.7mm x 31.7mm)
-
TE0600-03-52I11-A
Trenz Electronic GmbH

IC MODULE GIGABEE

  • Module/Board Type: FPGA Core
  • Core Processor: Spartan-6 LX-45
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 256MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paket: -
Request a Quote
Spartan-6 LX-45
-
125MHz
16MB
256MB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0820-05-3AE81MA
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paket: -
Request a Quote
-
-
-
-
-
-
-
-
5729-PX-4AA-RC
Critical Link LLC

TEXAS INSTRUMENTS AM5729 SOM (32

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM® Cortex®-A15
  • Co-Processor: -
  • Speed: 1.5GHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310
  • Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
  • Operating Temperature: 0°C ~ 70°C
Paket: -
Request a Quote
ARM® Cortex®-A15
-
1.5GHz
32MB
1GB
Board-to-Board (BTB) - 100, Edge Connector - 310
3.460" L x 2.730" W (87.88mm x 69.34mm)
0°C ~ 70°C
TE0715-05-73E33-A
Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ 7030

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ XC7Z030-3SBG485E
  • Co-Processor: ARM Cortex-A9
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
Paket: -
Request a Quote
Zynq™ XC7Z030-3SBG485E
ARM Cortex-A9
-
32MB
1GB
Board-to-Board (BTB) Socket
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 85°C
TE0803-04-4AE11-A
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: 0°C ~ 85°C
Paket: -
Request a Quote
Zynq UltraScale+ XCZU4CG-1SFVC784E
-
-
128MB
2GB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
0°C ~ 85°C
TE0808-05-6BE81-A
Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
Paket: -
Request a Quote
-
-
-
-
-
-
-
-
TE0818-02-BBE81-A
Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH AMD

  • Module/Board Type: MPU Core
  • Core Processor: Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 4 x 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
Paket: -
Request a Quote
Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E
-
-
128MB
4GB
Board-to-Board (BTB) Socket - 4 x 240
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
TE0745-02-93E11-KA
Trenz Electronic GmbH

MOD SOM DDR3L 1GB

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7045)
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paket: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7045)
-
64MB
1GB
Board-to-Board (BTB) Socket - 480
2.050" L x 2.990" W (52.00mm x 76.00mm)
-40°C ~ 85°C
TE0715-04-71I33-A
Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7030)
  • Speed: 125MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paket: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7030)
125MHz
32MB
1GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
AM0010-02-5DI21MA
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq™ UltraScale+™ ZU5EV-1I
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
Paket: -
Request a Quote
Zynq™ UltraScale+™ ZU5EV-1I
-
-
128MB
4GB
Board-to-Board (BTB) Socket
2.220" L x 1.575" W (56.40mm x 40.00mm)
-40°C ~ 85°C