Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
|
Paket: 783-BBGA, FCBGA |
Lager3.984 |
|
1 Core, 32-Bit | 800MHz | Signal Processing; SPE | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (2) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 1.2GHZ 1023FCBGA
|
Paket: 1023-BFBGA, FCBGA |
Lager4.848 |
|
2 Core, 32-Bit | 1.2GHz | Signal Processing; SPE | DDR2, DDR3 | No | - | 10/100/1000 Mbps (4) | - | - | 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BFBGA, FCBGA | 1023-FCPBGA (33x33) |
||
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
Paket: 689-BBGA Exposed Pad |
Lager5.280 |
|
1 Core, 32-Bit | 667MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC74XX 1.4GHZ 360FCCBGA
|
Paket: 360-CBGA, FCCBGA |
Lager4.352 |
|
1 Core, 32-Bit | 1.4GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-CBGA, FCCBGA | 360-FCCBGA (25x25) |
||
NXP |
IC MPU MPC83XX 266MHZ 740TBGA
|
Paket: 740-LBGA |
Lager6.288 |
|
1 Core, 32-Bit | 266MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 740-LBGA | 740-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC8XX 133MHZ 357BGA
|
Paket: 357-BBGA |
Lager5.248 |
|
1 Core, 32-Bit | 133MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC82XX 266MHZ 352TBGA
|
Paket: 352-LBGA |
Lager4.112 |
|
1 Core, 32-Bit | 266MHz | - | SDRAM | No | - | - | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 352-LBGA | 352-TBGA (35x35) |
||
Zilog |
IC MPU SCC 10MHZ 40DIP
|
Paket: 40-DIP (0.620", 15.75mm) |
Lager4.992 |
|
1 Core, 16-Bit | 10MHz | - | - | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 40-DIP (0.620", 15.75mm) | 40-PDIP |
||
NXP |
IC MPU MPC82XX 266MHZ 408TBGA
|
Paket: 480-LBGA |
Lager4.144 |
|
1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC8XX 100MHZ 357BGA
|
Paket: 357-BBGA |
Lager2.112 |
|
1 Core, 32-Bit | 100MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU Q OR IQ 800MHZ 520FCBGA
|
Paket: 520-FBGA, FCBGA |
Lager7.760 |
|
1 Core, 32-Bit | 800MHz | Signal Processing; SC3850 | DDR3, DDR3L | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 520-FBGA, FCBGA | 520-FCBGA (21x21) |
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
Paket: 256-BBGA |
Lager2.720 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | -40°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC8XX 50MHZ 357BGA
|
Paket: 357-BBGA |
Lager3.600 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 100°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC52XX 400MHZ 272BGA
|
Paket: 272-BBGA |
Lager7.008 |
|
1 Core, 32-Bit | 400MHz | - | DDR, SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | 2.5V, 3.3V | -40°C ~ 85°C (TA) | - | 272-BBGA | 272-PBGA (27x27) |
||
NXP |
LS1084A 1600/2100 XT RVA
|
Paket: - |
Lager7.344 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
QORIQ 2XCPU 64-BIT PWR ARCH 1.
|
Paket: - |
Lager2.496 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Advantech Corp |
XEON 2G 11M 3647P 8C 4109T -SILV
|
Paket: - |
Lager2.704 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX 32-BIT MPU ARM CORTEX-A7 C
|
Paket: 289-LFBGA |
Lager6.416 |
|
1 Core, 32-Bit | 528MHz | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100 Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | -40°C ~ 105°C (TJ) | A-HAB, ARM TZ, CSU, SJC, SNVS | 289-LFBGA | 289-MAPBGA (14x14) |
||
NXP |
IC MPU I.MX6QP ENHAN 624FCBGA
|
Paket: 624-FBGA, FCBGA |
Lager6.480 |
|
4 Core, 32-Bit | 800MHz | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 105°C (TA) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
Rochester Electronics, LLC |
IC MPU I186 16MHZ
|
Paket: - |
Request a Quote |
|
1 Core, 16-Bit | 16MHz | - | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | - | - |
||
Renesas Electronics Corporation |
IC MCU 32BIT RZ/G2E HDMI OFF
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Intel |
IC MPU I960 100MHZ 324BGA
|
Paket: - |
Request a Quote |
|
1 Core, 32-Bit | 100MHz | - | DRAM | No | - | - | - | - | 3.3V | 0°C ~ 95°C (TC) | - | 324-BGA | 324-BGA |
||
Advanced Micro Devices |
IC MPU 40MHZ 100QFP
|
Paket: - |
Request a Quote |
|
1 Core, 32-Bit | 40MHz | Math Engine; 387SX | - | No | - | - | - | - | 5V | 0°C ~ 100°C (TC) | - | 100-BQFP Bumpered | 100-PQFP (19.05x19.05) |
||
Texas Instruments |
IC MPU DRA71X
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
SOC RZ/G2H HDMI ON (BULK)
|
Paket: - |
Request a Quote |
|
4, 4 Core, 64-Bit | 1.2GHz, 1.5GHz | ARM® Cortex®-R7 | LPDDR4 | Yes | LVDS, MIPI-CSI | 10/100Mbps (1) | SATA 16Gbps (1) | USB 2.0 OTG (2), USB 3.0 (1) | 3.3V | -40°C ~ 85°C | AES, ARM TZ, Hash, RSA, Secure Boot, TRNG | 1022-BFBGA, FCBGA | 1022-FCBGA (29x29) |
||
Texas Instruments |
SINGLE-CORE 64-BIT ARM CORTEX-A5
|
Paket: - |
Request a Quote |
|
1 Core, 64-Bit | 1GHz | ARM® Cortex®-M4F, ARM® Cortex®-R5F, Multimedia; NEON™ SIMD, PRU-ICSS | DDR4, LPDDR4 | No | - | 10/100 Mbps (2), 10/100/1000 Mbps (2) | - | USB 3.1 (1) | 1.1V, 1.2V, 1.8V, 3.3V | -40°C ~ 105°C (TJ) | 3DES, AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA-1/2 | 441-BFBGA, FCBGA | 441-FCBGA (17.2x17.2) |
||
Texas Instruments |
IC
|
Paket: - |
Lager13.485 |
|
2 Core, 64-Bit | 1GHz | ARM® Cortex®-M4F | DDR4, LPDDR4 | Yes | LVDS, MIPI/CSI, MIPI-DPI, OLDI | 10/100/1000Mbps (2) | - | USB 2.0 (2) | 1.1V, 1.2V, 1.8V, 3.3V | -40°C ~ 125°C (TJ) | AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS | 441-BFBGA, FCBGA | 441-FCBGA (17.2x17.2) |
||
Texas Instruments |
PROTOTYPE
|
Paket: - |
Request a Quote |
|
1 Core, 32-Bit | 456MHz | Signal Processing; C674x, System Control; CP15 | DDR2, LPDDR | No | LCD | 10/100Mbps (1) | SATA 3Gbps (1) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1.8V, 3.3V | - | Boot Security, Cryptography | 361-LFBGA | 361-NFBGA (13x13) |