Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC85XX 1.067GHZ 1023BGA
|
Paket: 1023-BFBGA, FCBGA |
Lager6.816 |
|
2 Core, 32-Bit | 1.067GHz | Signal Processing; SPE | DDR2, DDR3 | No | - | 10/100/1000 Mbps (4) | - | - | 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BFBGA, FCBGA | 1023-FCPBGA (33x33) |
||
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
|
Paket: 783-BBGA, FCBGA |
Lager2.928 |
|
1 Core, 32-Bit | 800MHz | Signal Processing; SPE | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC7XX 400MHZ 360FCBGA
|
Paket: 360-BBGA, FCCBGA |
Lager4.208 |
|
1 Core, 32-Bit | 400MHz | - | - | No | - | - | - | - | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 360-BBGA, FCCBGA | 360-FCPBGA (25x25) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
Paket: 783-BBGA, FCBGA |
Lager6.384 |
|
1 Core, 32-Bit | 1.0GHz | Signal Processing; SPE | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
IDT, Integrated Device Technology Inc |
IC MPU MIPS32 133MHZ 144TQFP
|
Paket: 144-LQFP |
Lager5.488 |
|
1 Core, 32-Bit | 133MHz | System Control; CP0 | SDRAM | No | - | - | - | - | 3.3V | 0°C ~ 70°C (TA) | - | 144-LQFP | 144-TQFP (20x20) |
||
IDT, Integrated Device Technology Inc |
IC MPU INTERPRISE 150MHZ 208QFP
|
Paket: 208-BFQFP |
Lager3.120 |
|
1 Core, 32-Bit | 150MHz | - | SDRAM | No | - | - | - | - | 3.3V | 0°C ~ 70°C (TA) | - | 208-BFQFP | 208-PQFP (28x28) |
||
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
|
Paket: 783-BBGA, FCBGA |
Lager6.336 |
|
1 Core, 32-Bit | 800MHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (2) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC86XX 1.25GHZ 1023BGA
|
Paket: 1023-BCBGA, FCCBGA |
Lager5.040 |
|
2 Core, 32-Bit | 1.25GHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BCBGA, FCCBGA | 1023-FCCBGA (33x33) |
||
NXP |
IC MPU MPC86XX 1.333GHZ 1023BGA
|
Paket: 1023-BCBGA, FCCBGA |
Lager5.824 |
|
2 Core, 32-Bit | 1.333GHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BCBGA, FCCBGA | 1023-FCCBGA (33x33) |
||
NXP |
IC MPU MPC83XX 667MHZ 740TBGA
|
Paket: 740-LBGA |
Lager7.296 |
|
1 Core, 32-Bit | 667MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 740-LBGA | 740-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC83XX 667MHZ 740TBGA
|
Paket: 740-LBGA |
Lager4.560 |
|
1 Core, 32-Bit | 667MHz | Communications; QUICC Engine, Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 740-LBGA | 740-TBGA (37.5x37.5) |
||
Zilog |
IC MPU SCC 10MHZ 144QFP
|
Paket: 144-QFP |
Lager2.112 |
|
1 Core, 32-Bit | 10MHz | - | - | No | - | - | - | - | 3.3V | 0°C ~ 70°C (TA) | - | 144-QFP | 144-QFP (28x28) |
||
Zilog |
IC MPU Z180 10MHZ 64DIP
|
Paket: 64-DIP (0.750", 19.05mm) |
Lager3.424 |
|
1 Core, 8-Bit | 10MHz | - | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 64-DIP (0.750", 19.05mm) | 64-DIP |
||
Advantech Corp |
CORE 2.4G 8M 35W
|
Paket: - |
Lager4.336 |
|
4 Core, 64-Bit | 2.4GHz | - | - | Yes | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU Q OR IQ 1.2GHZ 689TEBGA
|
Paket: 689-BBGA Exposed Pad |
Lager3.424 |
|
2 Core, 32-Bit | 1.2GHz | Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC82XX 266MHZ 516BGA
|
Paket: 516-BBGA |
Lager4.032 |
|
1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Paket: 624-LFBGA |
Lager7.200 |
|
1 Core, 32-Bit | 1.0GHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-LFBGA | 624-MAPBGA (21x21) |
||
Microchip Technology |
IC MCU 32BIT 196TFBGA
|
Paket: 196-TFBGA, CSBGA |
Lager6.192 |
|
1 Core, 32-Bit | 500MHz | Multimedia; NEON™ MPE | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Yes | Keyboard, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + HSIC | 3.3V | -40°C ~ 105°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 196-TFBGA, CSBGA | 196-TFBGA (11x11) |
||
NXP |
I.MXRT1020 100LQFP
|
Paket: - |
Lager20.772 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Intel |
IC MPU INTEL XEON 2GHZ 603MPGA
|
Paket: - |
Request a Quote |
|
1 Core, 32-Bit | 2GHz | - | - | No | - | - | - | - | 1.5V | 70°C (TC) | - | 603-BFCPGA | 603-mPGA (53.34x53.34) |
||
IBM |
IBM25PPC750 - POWERPC 750CL RISC
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU QORIQ 800MHZ 448FBGA
|
Paket: - |
Request a Quote |
|
2 Core, 64-Bit | 800MHz | - | DDR3L SDRAM, DDR4 SDRAM | - | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | - | - | -40°C ~ 105°C (TA) | - | 448-BFBGA | 448-FBGA (17x17) |
||
Advanced Micro Devices |
IC MPU 68PLCC
|
Paket: - |
Request a Quote |
|
1 Core, 16-Bit | - | - | - | No | - | - | - | - | 5V | 0°C ~ 70°C (TA) | - | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
NXP |
IC MPU QORIQ 1.3GHZ 448FBGA
|
Paket: - |
Request a Quote |
|
2 Core, 64-Bit | 1.3GHz | - | DDR3L SDRAM, DDR4 SDRAM | - | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | - | - | -40°C ~ 105°C (TA) | - | 448-BFBGA | 448-FBGA (17x17) |
||
NXP |
IC MPU QORIQ 1.3GHZ 448FBGA
|
Paket: - |
Request a Quote |
|
2 Core, 64-Bit | 1.3GHz | - | DDR3L SDRAM, DDR4 SDRAM | - | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | - | - | -40°C ~ 105°C (TA) | - | 448-BFBGA | 448-FBGA (17x17) |
||
Texas Instruments |
IC MPU SITARA 667MHZ 538FCBGA
|
Paket: - |
Request a Quote |
|
1 Core, 32-Bit | 667MHz | ARM® Cortex®-M4, C66x | DDR3, DDR3L | Yes | HDMI, Video | 10/100/1000Mbps (2) | - | USB 2.0 (2), USB 3.0 (2) | 1.35V, 1.5V, 1.8V, 3.3V | 0°C ~ 90°C (TJ) | ARM TZ, Secure Debug, System JTAG | 538-LFBGA, FCBGA | 538-FCBGA (17x17) |
||
Nuvoton Technology Corporation |
IC MPU 300MHZ 216LQFP
|
Paket: - |
Lager54 |
|
1 Core, 32-Bit | 300MHz | - | DDR2, LVDDR, SDRAM | Yes | LCD | 10/100Mbps (1) | - | USB 2.0 (3) | 3.3V | -40°C ~ 85°C (TA) | AES, ECC, SHA, TRNG | 216-LQFP | 216-LQFP (24x24) |
||
STMicroelectronics |
IC MPU 533MHZ 361LFBGA
|
Paket: - |
Request a Quote |
|
2 Core, 32-Bit | 533MHz | ARM® Cortex®-M3 | SDRAM | No | LCD | - | - | USB 2.0 (2) | 3.3V | -40°C ~ 85°C (TA) | JTAG | 361-LFBGA | 361-LFBGA (16x16) |