Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Advantech Corp |
IC PROCESSOR PENTIUM
|
Paket: - |
Lager3.376 |
|
1 Core, 32-Bit | 3.4GHz | - | - | - | - | - | - | - | - | - | - | - | 775-LGA |
||
NXP |
IC MPU MPC85XX 1.2GHZ 783FCBGA
|
Paket: 783-BBGA, FCBGA |
Lager6.672 |
|
1 Core, 32-Bit | 1.2GHz | Signal Processing; SPE | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU Q OR IQ 1.2GHZ 689TEBGA
|
Paket: 689-BBGA Exposed Pad |
Lager4.768 |
|
1 Core, 32-Bit | 1.2GHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC85XX 1.5GHZ 1023FCBGA
|
Paket: 1023-BFBGA, FCBGA |
Lager7.136 |
|
2 Core, 32-Bit | 1.5GHz | Signal Processing; SPE | DDR2, DDR3 | No | - | 10/100/1000 Mbps (4) | - | - | 1.5V, 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 1023-BFBGA, FCBGA | 1023-FCPBGA (33x33) |
||
NXP |
IC MPU MPC85XX 1.067GHZ 1023BGA
|
Paket: 1023-BFBGA, FCBGA |
Lager5.712 |
|
2 Core, 32-Bit | 1.067GHz | Signal Processing; SPE | DDR2, DDR3 | No | - | 10/100/1000 Mbps (4) | - | - | 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BFBGA, FCBGA | 1023-FCPBGA (33x33) |
||
NXP |
IC MPU MPC85XX 600MHZ 783FCBGA
|
Paket: 783-BBGA, FCBGA |
Lager3.472 |
|
1 Core, 32-Bit | 600MHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 (3) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC86XX 1.0GHZ 1023FCCBGA
|
Paket: 1023-BCBGA, FCCBGA |
Lager5.312 |
|
2 Core, 32-Bit | 1.0GHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BCBGA, FCCBGA | 1023-FCCBGA (33x33) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
Paket: 620-BBGA Exposed Pad |
Lager6.176 |
|
1 Core, 32-Bit | 400MHz | Security; SEC | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC6XX 200MHZ 255FCCBGA
|
Paket: 255-BCBGA Exposed Pad |
Lager5.920 |
|
1 Core, 32-Bit | 200MHz | - | - | No | - | - | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 255-BCBGA Exposed Pad | 255-FCCBGA (21x21) |
||
NXP |
IC MPU MPC82XX 200MHZ 408TBGA
|
Paket: 480-LBGA |
Lager3.616 |
|
1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC74XX 1.4GHZ 360FCCBGA
|
Paket: 360-BCBGA, FCCBGA |
Lager6.432 |
|
1 Core, 32-Bit | 1.4GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-BCBGA, FCCBGA | 360-FCCBGA (25x25) |
||
NXP |
IC MPU M683XX 25MHZ 357BGA
|
Paket: 357-BGA |
Lager4.544 |
|
1 Core, 32-Bit | 25MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 357-BGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
Paket: 357-BBGA |
Lager3.472 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4) | - | - | 3.3V | -40°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Paket: 425-FBGA |
Lager4.400 |
|
1 Core, 32-Bit | 1.0GHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | -40°C ~ 105°C (TA) | - | 425-FBGA | 425-TEPBGA I (19x19) |
||
NXP |
IC MPU MPC83XX 400MHZ 689TEBGA
|
Paket: 689-BBGA Exposed Pad |
Lager5.888 |
|
1 Core, 32-Bit | 400MHz | Security; SEC 3.0 | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
NO EPDC, 1 ETH, CAN, 1 OTG 1 HSI
|
Paket: 488-TFBGA |
Lager2.576 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | 1.8V, 3.3V | -20°C ~ 105°C (TJ) | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | 488-TFBGA | 488-FBGA (12x12) |
||
NXP |
IC MPU MPC83XX 333MHZ 369BGA
|
Paket: 369-LFBGA |
Lager6.368 |
|
1 Core, 32-Bit | 333MHz | Communications; QUICC Engine | DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 1.8V, 3.3V | -40°C ~ 105°C (TA) | - | 369-LFBGA | 369-PBGA (19x19) |
||
Zilog |
IC MPU ZIP 20MHZ 100VQFP
|
Paket: 100-LQFP |
Lager3.488 |
|
1 Core, 8-Bit | 20MHz | - | DRAM | No | - | - | - | - | 5.0V | -40°C ~ 105°C (TA) | - | 100-LQFP | 100-VQFP (14x14) |
||
NXP |
IC MPU I.MC6UL 528MHZ 272BGA
|
Paket: - |
Lager6.032 |
|
1 Core, 32-Bit | 528MHz | Multimedia; NEON? SIMD | LPDDR2, DDR3, DDR3L | No | LCD, LVDS | 10/100 Mbps (2) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | 0°C ~ 95°C (TJ) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | - | - |
||
NXP |
IC MPU MPC8XX 133MHZ 256BGA
|
Paket: 256-BBGA |
Lager14.808 |
|
1 Core, 32-Bit | 133MHz | Communications; CPM, Security; SEC | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 95°C (TA) | Cryptography | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU I.MX25 400MHZ 400MAPBGA
|
Paket: 400-LFBGA |
Lager6.600 |
|
1 Core, 32-Bit | 400MHz | - | LPDDR, DDR, DDR2 | No | Keypad, LCD, Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -20°C ~ 70°C (TA) | - | 400-LFBGA | 400-MAPBGA (17x17) |
||
NXP |
QORIQ 2XCPU 64-BIT ARM ARCH 1.
|
Paket: - |
Lager7.696 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Intersil |
ENGINE KNOCK SIGNAL PROCESSOR
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Intel |
MOBILE CELERON PROCESSOR
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Intersil |
MICROPROCESSOR, 16-BIT, 5MHZ
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU FS32V23 1GHZ 621FCPBGA
|
Paket: - |
Request a Quote |
|
4 Core, 32/64-Bit | 1GHz | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | -40°C ~ 125°C (TJ) | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | 621-FBGA, FCBGA | 621-FCPBGA (17x17) |
||
Rochester Electronics, LLC |
IBM25PPC750FX - IBM25PPC750 - PO
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Freescale Semiconductor |
IC MPU MPC85XX 1.0GHZ 783FCPBGA
|
Paket: - |
Request a Quote |
|
1 Core, 32-Bit | 1.0GHz | Security; SEC | DDR2, DDR3 | No | - | 10/100/1000Mbps (2) | SATA 3Gbps (1) | USB 2.0 (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |