Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU Q OR IQ 1.333GHZ 1295BGA
|
Paket: 1295-BBGA, FCBGA |
Lager4.864 |
|
4 Core, 32-Bit | 1.333GHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (5), 10 Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.5V, 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
Paket: 783-BBGA, FCBGA |
Lager2.832 |
|
1 Core, 32-Bit | 1.0GHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
Paket: 783-BBGA, FCBGA |
Lager6.496 |
|
1 Core, 32-Bit | 1.0GHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC83XX 533MHZ 672TBGA
|
Paket: 672-LBGA |
Lager7.296 |
|
1 Core, 32-Bit | 533MHz | Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU MPC83XX 400MHZ 672TBGA
|
Paket: 672-LBGA |
Lager3.568 |
|
1 Core, 32-Bit | 400MHz | Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
Paket: 357-BBGA |
Lager7.616 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 115°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 66MHZ 256BGA
|
Paket: 256-BBGA |
Lager6.736 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | 0°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
Paket: 516-BBGA |
Lager6.256 |
|
1 Core, 32-Bit | 400MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU M680X0 25MHZ 184CQFP
|
Paket: 184-BCQFP |
Lager7.520 |
|
1 Core, 32-Bit | 25MHz | - | - | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 184-BCQFP | 184-CQFP (31.3x31.3) |
||
NXP |
IC MPU M680X0 20MHZ 64QFP
|
Paket: 64-QFP |
Lager6.848 |
|
1 Core, 32-Bit | 20MHz | - | - | No | - | - | - | - | 5.0V | -40°C ~ 85°C (TA) | - | 64-QFP | 64-QFP (14x14) |
||
NXP |
IC MPU M683XX 33MHZ 241PGA
|
Paket: 241-BEPGA |
Lager6.928 |
|
1 Core, 32-Bit | 33MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 241-BEPGA | 241-PGA (47.24x47.24) |
||
NXP |
IC MPU M680X0 166MHZ 128PGA
|
Paket: 128-BPGA |
Lager3.504 |
|
1 Core, 32-Bit | 166MHz | - | - | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 128-BPGA | 128-PGA (35x35) |
||
NXP |
IC MPU M683XX 33MHZ 357BGA
|
Paket: 357-BBGA |
Lager5.712 |
|
1 Core, 32-Bit | 33MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
Microchip Technology |
IC MPU SIAP 40MHZ 208QFP
|
Paket: 208-BFQFP |
Lager7.424 |
|
1 Core, 32-Bit | 40MHz | Signal Processing; OakDSP | SDRAM | No | - | 10/100 Mbps (2) | - | - | 3.3V | - | - | 208-BFQFP | 208-PQFP (28x28) |
||
NXP |
IC MPU MPC85XX 1.2GHZ 1023FCBGA
|
Paket: 1023-BBGA, FCBGA |
Lager6.640 |
|
2 Core, 32-Bit | 1.2GHz | Signal Processing; SPE | DDR2, DDR3 | No | - | 10/100/1000 Mbps (4) | - | - | 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 1023-BBGA, FCBGA | 1023-FCPBGA (33x33) |
||
NXP |
IC MPU Q OR IQ 800MHZ 457TEBGA
|
Paket: 457-LFBGA |
Lager3.360 |
|
1 Core, 32-Bit | 800MHz | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 457-LFBGA | 457-TEPBGA-1 (19x19) |
||
NXP |
IC MPU I.MC6UL 528MHZ 272BGA
|
Paket: 272-LFBGA |
Lager7.200 |
|
1 Core, 32-Bit | 528MHz | Multimedia; NEON? SIMD | LPDDR2, DDR3, DDR3L | No | LCD, LVDS | 10/100 Mbps (2) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 105°C (TJ) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | 272-LFBGA | 272-MAPBGA (9x9) |
||
NXP |
IC MPU I.MX51 800MHZ 529BGA
|
Paket: 529-LFBGA |
Lager51.276 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR, DDR2 | Yes | Keypad, LCD | 10/100 Mbps (1) | - | USB 2.0 (3), USB 2.0 + PHY (1) | 1.2V, 1.875V, 2.775V, 3.0V | -20°C ~ 85°C (TC) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 529-LFBGA | 529-BGA Case 2017 (19x19) |
||
NXP |
LS1084A 1600/2100 REV A
|
Paket: - |
Lager5.760 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
Paket: - |
Lager6.320 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
Paket: - |
Lager3.936 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC I.MX 7ULP MAPBGA 393
|
Paket: - |
Lager7.452 |
|
1 Core, 32-Bit | 720MHz | ARM® Cortex®-M4 | LPDDR2, LPDDR3 | Yes | MIPI-DSI | - | - | USB 2.0 (2) | - | 0°C ~ 95°C | Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot | - | - |
||
Harris Corporation |
HIGH PERFORMANCE MICROPROCESSOR,
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
S32G233A ARM CORTEX-M7 AND -A53,
|
Paket: - |
Request a Quote |
|
1 Core, 64-Bit/2 Core, 32-Bit | 400MHz, 1GHz | Multimedia; NEON | DDR3L, LPDDR4 | No | - | GbE (4) | - | USB 2.0 OTG (1) | 1.2V, 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | 525-FBGA, FCBGA | 525-FCPBGA (19x19) |
||
NXP |
MIMX8QX6CVLFZAC
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU 1.5GHZ/750MHZ 486LFBGA
|
Paket: - |
Request a Quote |
|
5 Core, 64-Bit | 1.5GHz, 750MHz | Multimedia; NEON™ MPE | DDR3L, DDR4, LPDDR4 | Yes | MIPI-CSI, MIPI-DSI, LCD | GbE | - | USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 95°C (TJ) | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | 486-LFBGA, FCBGA | 486-LFBGA (14x14) |
||
Texas Instruments |
IC MPU DRA74X CORTEX-A15 760BGA
|
Paket: - |
Request a Quote |
|
2 Core, 32-Bit | 1.5GHz | ARM® Cortex®-M4, BB2D, GPU, IVA | DDR2, DDR3, DDR3L | Yes | HDMI, LCD | 10/100/1000Mbps (1), 1Gbps (2) | SATA | USB 2.0 (3), USB 3.0 (1) | 1.35V, 1.8V, 3.3V | -40°C ~ 125°C (TJ) | Cryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection | 760-BFBGA, FCBGA | 760-FCBGA (23x23) |
||
IBM |
IC MPU 200MHZ 278FCPBGA
|
Paket: - |
Request a Quote |
|
1 Core, 32-Bit | 200MHz | - | - | No | - | - | - | - | 2.5V, 3.3V | 0°C ~ 105°C (TJ) | - | 278-BBGA, FCBGA | 278-FCPBGA (21x21) |