Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC VOICE ACCESS CODEC TQFP64
|
Paket: 64-LQFP |
Lager6.144 |
|
- | 1 | - | - | - | 0°C ~ 70°C | Surface Mount | 64-LQFP | P-TQFP-64 |
||
Microsemi Corporation |
IC FRAMER/INTERFACE CEPT 28DIP
|
Paket: 28-DIP (0.600", 15.24mm) |
Lager3.552 |
|
PCM | 1 | 4.5 V ~ 5.5 V | 8mA | - | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Silicon Labs |
IC LINEFEED INTRFC SI321X 16SOIC
|
Paket: 16-SOIC (0.154", 3.90mm Width) Exposed Pad |
Lager3.088 |
|
PCM, Serial, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 800mW | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) Exposed Pad | 16-SOIC |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
Paket: 144-BGA, CSPBGA |
Lager4.752 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 80mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Cirrus Logic Inc. |
IC LIU DUAL T1/E1 64LQFP
|
Paket: 64-LQFP |
Lager5.968 |
|
E1, T1 | 2 | 3.135 ~ 5.25 V | - | 350mW | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 3CH 128LQFP
|
Paket: 128-LQFP Exposed Pad |
Lager6.208 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 480mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP Exposed Pad | 128-LQFP (14x20) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 3CH 128LQFP
|
Paket: 128-LQFP Exposed Pad |
Lager7.920 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 480mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP Exposed Pad | 128-LQFP (14x20) |
||
Exar Corporation |
IC JITTER ATTENUATOR SGL 32TQFP
|
Paket: 32-LQFP |
Lager5.504 |
|
Serial | 1 | 3.135 V ~ 5.25 V | 65mA | - | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Silicon Labs |
IC SYSTEM-SIDE DAA 16SOIC
|
Paket: 16-SOIC (0.154", 3.90mm Width) |
Lager219.996 |
|
DSP, Serial | 1 | 3 V ~ 3.6 V | 15mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Maxim Integrated |
IC BUFFER RECEIVE T1 28-PLCC
|
Paket: 28-LCC (J-Lead) |
Lager4.416 |
|
TDM | 1 | - | 5mA | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microsemi Corporation |
IC CESOP PROC 1024CH 552BGA
|
Paket: 552-BGA |
Lager9.816 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
IDT, Integrated Device Technology Inc |
IC LINE INTERFACE UNIT 208BGA
|
Paket: 208-BGA |
Lager7.024 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 208-BGA | 208-PBGA (17x17) |
||
Microsemi Corporation |
IC SLAC 4CH GCI/PCM 4IO 80LQFP
|
Paket: 80-LQFP |
Lager605.316 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-LQFP (12x12) |
||
Silicon Labs |
IC LINE-SIDE DAA 16SOIC
|
Paket: 16-SOIC (0.154", 3.90mm Width) |
Lager265.548 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-DFN
|
Paket: 28-VDFN Exposed Pad |
Lager5.232 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-VDFN Exposed Pad | 28-DFN |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8SMD
|
Paket: 8-SMD, Gull Wing |
Lager5.792 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-SMD |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 5V LP 44-PLCC
|
Paket: 44-LCC (J-Lead) |
Lager5.632 |
|
T1 | 1 | 4.75 V ~ 5.25 V | 65mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Maxim Integrated |
IC TDM OVER PACKET 676-BGA
|
Paket: 676-BGA |
Lager8.172 |
|
TDMoP | 1 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 676-BGA | 676-PBGA (27x27) |
||
Microsemi Corporation |
IC HDLC PROTOCOL CTLR 28SOIC
|
Paket: 28-SOIC (0.295", 7.50mm Width) |
Lager6.944 |
|
- | 1 | 4.75 V ~ 5.25 V | 1µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Broadcom Limited |
MULTI LAYER SWITCH 10G
|
Paket: - |
Lager6.784 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TIMING-OVER-PACKET 324BGA
|
Paket: 324-BGA |
Lager3.536 |
|
- | 1 | 3V ~ 3.6V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC CODEC/FILTER 4CH 16IO 44PLCC
|
Paket: 44-LCC (J-Lead) |
Lager3.104 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Microchip Technology |
IC FXS 1CH 100V BORSCHT 48QFN
|
Paket: 48-VQFN Exposed Pad |
Lager2.864 |
|
PCM | 1 | 3.135V ~ 3.465V | - | - | -40°C ~ 85°C | Surface Mount | 48-VQFN Exposed Pad | 48-QFN (7x7) |
||
Harris Corporation |
ITU LOW COST, PABX SLIC WITH 40M
|
Paket: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V | - | 550 mW | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.58x16.58) |
||
Broadcom Limited |
4P G.FAST 212
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
PMB7728HV DECT IC
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
E1 SINGLE CHIP TRANSCEIVER
|
Paket: - |
Request a Quote |
|
E1, HDLC, J1, T1 | 1 | 3.135V ~ 3.465V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Lantiq |
GEMINAX-A8+ XXS 8 CHANNEL ADSL2+
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |