Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC COMPONENT QUADFALC 160-LBGA
|
Paket: 160-LBGA |
Lager2.128 |
|
E1, J1, SCI, SPI, T1 | 4 | 1.8V, 3.3V | - | 150mW | -40°C ~ 85°C | Surface Mount | 160-LBGA | PG-LBGA-160 |
||
Infineon Technologies |
IC COMM CTRLR 2CH SER TQFP-100
|
Paket: 100-LQFP |
Lager3.280 |
|
ASYNC, BISYNC, HDLC, PPP | 2 | 3 V ~ 3.6 V | 50mA | 150mW | -40°C ~ 85°C | Surface Mount | 100-LQFP | P-TQFP-100 |
||
Infineon Technologies |
IC LINE INTERFACE SLIC PDSO-24
|
Paket: 24-SOIC (0.295", 7.50mm Width) |
Lager5.808 |
|
- | 1 | 5V | 2.8mA | 730mW | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | PG-DSO-24 |
||
Microsemi Corporation |
IC CESOP PROCESSOR 64CH 324BGA
|
Paket: 324-BGA |
Lager4.624 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microsemi Corporation |
IC SLIC 1CH P RV 32PLCC
|
Paket: 32-LCC (J-Lead) |
Lager5.616 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microsemi Corporation |
IC SLIC SGL 63DB LGBAL 32PLCC
|
Paket: 32-LCC (J-Lead) |
Lager4.960 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Silicon Labs |
IC PROSLIC LINE FEED 135V 40QFN
|
Paket: 40-VFQFN Exposed Pad |
Lager4.880 |
|
PCM | 2 | - | - | - | - | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
Paket: 144-BGA, CSPBGA |
Lager7.360 |
|
LIU | 2 | 3.3V | 150mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CSBGA
|
Paket: 144-BGA, CSPBGA |
Lager2.496 |
|
LIU | 2 | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC MICRODAA PCM HWY 32QFN
|
Paket: 32-VFQFN Exposed Pad |
Lager6.560 |
|
PCM, SPI | 1 | 3 V ~ 3.6 V | - | - | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN Exposed Pad (5x5) |
||
Maxim Integrated |
IC MICRODAA VOICE 32QFN
|
Paket: 32-VFQFN Exposed Pad |
Lager3.232 |
|
Serial | 1 | 3 V ~ 3.6 V | - | - | 0°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (8x8) |
||
Silicon Labs |
IC SLIC/CODEC 125V LINE 16SOIC
|
Paket: 16-SOIC (0.154", 3.90mm Width) Exposed Pad |
Lager20.880 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 110µA | 941mW | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) Exposed Pad | 16-SOIC |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II QUAD 256LBGA
|
Paket: 256-LBGA Exposed Pad |
Lager7.376 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 900mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II QUAD 256LBGA
|
Paket: 256-LBGA Exposed Pad |
Lager5.328 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 900mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Maxim Integrated |
IC TXRX LIU 256CSBGA
|
Paket: 256-LBGA, CSBGA |
Lager2.784 |
|
LIU | 16 | 3.135 V ~ 3.465 V | 500mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
Paket: 38-TFSOP (0.173", 4.40mm Width) |
Lager4.736 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Silicon Labs |
IC SLIC/CODEC PROG 1CH 38TSSOP
|
Paket: 38-TFSOP (0.173", 4.40mm Width) |
Lager27.540 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
NXP |
IC ATM CELL PROCESSOR 256BGA
|
Paket: 256-BBGA |
Lager7.040 |
|
JTAG, PHY, UTOPIA | 1 | 3 V ~ 3.6 V | 300mA | - | -40°C ~ 85°C | Surface Mount | 256-BBGA | 256-PBGA |
||
Texas Instruments |
IC TXRX INTERFACE DEVICE 20-PLCC
|
Paket: 20-LCC (J-Lead) |
Lager7.936 |
|
ISDN | - | 4.75 V ~ 5.25 V | - | - | - | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microsemi Corporation |
IC DIGITAL SWITCH 16K CH 272BGA
|
Paket: 272-BBGA |
Lager5.232 |
|
- | 1 | 1.71 V ~ 1.89 V | 240mA | - | -40°C ~ 85°C | Surface Mount | 272-BBGA | 272-PBGA (27x27) |
||
NXP |
IC C2K 900MHZ 16CH VOIP 625BGA
|
Paket: - |
Lager4.784 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC VOICEPORT 2CH FXS 4KHZ 80LQFP
|
Paket: 80-LQFP |
Lager2.480 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Silicon Labs |
IC ISOMODEM LINE-SIDE DAA 16SOIC
|
Paket: 16-SOIC (0.154", 3.90mm Width) |
Lager7.472 |
|
Parallel, SPI, UART | 1 | 3 V ~ 3.6 V | 8.5mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 145V 40QFN
|
Paket: - |
Lager2.592 |
|
Serial | 2 | 3.3V | - | - | - | Surface Mount | - | 40-QFN |
||
Silicon Labs |
IC VOICE DAA GCI/PCM/SPI 16SOIC
|
Paket: 16-SOIC (0.154", 3.90mm Width) |
Lager200.316 |
|
PCM, Serial, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC RECEIVER DTMF 18SOIC
|
Paket: 18-SOIC (0.295", 7.50mm Width) |
Lager172.044 |
|
- | 1 | 2.7 V ~ 3.6 V | 2mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microsemi Corporation |
IC SIGNAL COND 4X4 69-BGA
|
Paket: 69-FBGA |
Lager4.608 |
|
TTL/CMOS | 4 | 2.5V, 3.3V | - | 1.5W | 0°C ~ 110°C | Surface Mount | 69-FBGA | 69-BGA |
||
Microchip Technology |
6-PORT GE SWITCH WITH CUPHY
|
Paket: - |
Lager2.272 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MULTI LAYER SWITCH
|
Paket: - |
Lager4.912 |
|
PCI Express | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MULTI LAYER SWITCH - 1588 DISA
|
Paket: - |
Lager5.280 |
|
- | - | - | - | - | - | - | - | - |