Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LINE INTERFACE SLIC PLCC-28
|
Paket: 28-LCC (J-Lead) |
Lager3.056 |
|
- | 1 | 5V | 2.8mA | 730mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | P/PG-LCC-28 |
||
Exar Corporation |
IC LIU LH/SH T1/E1 SGL 64SQFP
|
Paket: 64-LQFP |
Lager3.872 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
NXP |
IC VOIP PROCESSOR 8CH 672BGA
|
Paket: 672-BGA |
Lager3.360 |
|
- | - | - | - | - | - | Surface Mount | 672-BGA | 672-TEPBGA (27x27) |
||
NXP |
IC C1K 450MHZ VOIP 448BGA
|
Paket: - |
Lager3.824 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC DGTL SWITCH QDX QUAD 160BGA
|
Paket: 160-BGA |
Lager5.680 |
|
- | 4 | 3 V ~ 3.6 V | 64mA | - | -40°C ~ 85°C | Surface Mount | 160-BGA | 160-PBGA (23x23) |
||
Microsemi Corporation |
IC SLIC 2CH 58 DB LG BAL 44PLCC
|
Paket: - |
Lager68.712 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
Paket: - |
Lager4.512 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Maxim Integrated |
IC FRAMER OCTAL T1/E1 CSBGA
|
Paket: 256-LBGA, CSBGA |
Lager6.672 |
|
WAN | 8 | 3.135 V ~ 3.465 V | 275mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 QUAD SHORT 144-TQFP
|
Paket: 144-LQFP |
Lager6.432 |
|
LIU | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
Paket: - |
Lager7.488 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Microsemi Corporation |
IC TXRX SGL E1 W/LIU 68PLCC
|
Paket: 68-LCC (J-Lead) |
Lager17.940 |
|
- | 1 | 4.75 V ~ 5.25 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.23x24.23) |
||
Microsemi Corporation |
IC RECEIVER DTMF 18SOIC
|
Paket: 18-SOIC (0.295", 7.50mm Width) |
Lager162.504 |
|
- | 1 | 2.7 V ~ 3.6 V | 2mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Maxim Integrated |
IC MUX TEMPE T3/E3 256-BGA
|
Paket: 256-BGA |
Lager7.120 |
|
Parallel/Serial | - | 3.135 V ~ 3.465 V | 150mA | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-PBGA (27x27) |
||
Microsemi Corporation |
FOUR CHANNEL COMBINED T1/E1/J1 T
|
Paket: 256-BGA |
Lager6.336 |
|
E1, J1, SPI, T1 | 4 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-CABGA (17x17) |
||
Microsemi Corporation |
VS9802:7% OH 100G CI-BCH-3
|
Paket: - |
Lager3.936 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC SLIC UNIVERSAL LP 28-PLCC
|
Paket: 28-LCC (J-Lead) |
Lager5.488 |
|
- | 1 | 4.75 V ~ 5.25 V | 2.25mA | 1.5W | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microsemi Corporation |
ARROW-2X192
|
Paket: 1292-BGA, FCBGA |
Lager6.560 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | 1292-BGA, FCBGA | 1292-FCBGA |
||
Microchip Technology |
10GBE WAN/LAN/BACKPLANE XAUI TO
|
Paket: - |
Lager5.088 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
COMBINED T1/E1 FRAMER/TRANSCEIVE
|
Paket: 81-LFBGA |
Lager3.472 |
|
E1, J1, T1 | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 81-LFBGA | 81-CABGA (9x9) |
||
Microchip Technology |
IC TXRX ETHERNET OCTAL 444BGA
|
Paket: - |
Lager7.536 |
|
Ethernet | 1 | - | - | - | - | Surface Mount | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
Paket: - |
Lager7.632 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TXRX DTMF 3V 24DIP
|
Paket: 24-DIP (0.300", 7.62mm) |
Lager4.880 |
|
- | 1 | 2.7V ~ 3.6V | 3.1mA | - | -40°C ~ 85°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Microchip Technology |
ARROW 2488, PB FREE
|
Paket: - |
Lager3.664 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SYNCHRONIZER T1/E1 28PLCC
|
Paket: 28-LCC (J-Lead) |
Lager4.816 |
|
- | - | 4.5V ~ 5.5V | 60mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC DSIC SUBSCRIBER NETWRK 24SSOP
|
Paket: 24-SSOP (0.209", 5.30mm Width) |
Lager5.968 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Harris Corporation |
SLIC, 2-4 CONVERSION, BIPOLAR, P
|
Paket: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -36V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V | - | 550 mW | 0°C ~ 75°C | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Infineon Technologies |
TELEPHONY INTERFACE CIRCUIT
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SPECTRA 4X155 SONET/SDH Payload
|
Paket: - |
Request a Quote |
|
Bus | 1 | 3.14V ~ 3.47V | 860mA | - | -40°C ~ 85°C | Surface Mount | 520-LBGA Exposed Pad | 520-SBGA (40x40) |
||
IXYS Integrated Circuits Division |
IC TELECOM INTERFACE 16SOIC
|
Paket: - |
Request a Quote |
|
Logic | 1 | 4.5V ~ 5.5V | 2mA | 10 mW | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Zarlink |
ZARLINK UCC81174D
|
Paket: - |
Request a Quote |
|
- | - | 3.75V | 0.063mA | - | -30°C ~ 85°C | Surface Mount | - | 28-SOP |