Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Channel Type | Number of Circuits | Channels per Circuit | Voltage - VCCA | Voltage - VCCB | Input Signal | Output Signal | Output Type | Data Rate | Operating Temperature | Features | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Nexperia USA Inc. |
BUFFER 1 O-DRN XSON8U
|
Paket: - |
Lager6.192 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
TXRX 20BIT TRANSLATNG 60HXQFN
|
Paket: 60-XFQFN Dual Rows, Exposed Pad |
Lager7.200 |
|
Bidirectional | 2 | 10 | 0.8V ~ 3.6V | 0.8V ~ 3.6V | - | - | Tri-State, Non-Inverted | 380Mbps | -40°C ~ 125°C (TA) | - | Surface Mount | 60-XFQFN Dual Rows, Exposed Pad | 60-HXQFN (4x6) |
||
Maxim Integrated |
IC XLATR BIDIR L-LVL 2CH 8WLP
|
Paket: 8-WFBGA, WLBGA |
Lager2.480 |
|
Bidirectional | 1 | 2 | 0.9V ~ 5.5V | 1.65V ~ 5.5V | - | - | Open Drain, Push-Pull | 16Mbps | -40°C ~ 85°C (TA) | Thermal-Shutdown Protection, Tri-State Input | Surface Mount | 8-WFBGA, WLBGA | 8-WLP |
||
Microchip Technology |
IC TRANSLATOR TQFP
|
Paket: - |
Lager7.936 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TRANSLATOR TQFP
|
Paket: - |
Lager7.344 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Maxim Integrated |
IC LEVEL TRANSLATOR 14-TDFN
|
Paket: 14-WFDFN Exposed Pad |
Lager7.536 |
|
Bidirectional | 1 | 4 | 1.62V ~ 3.2V | 2.2V ~ 3.6V | - | - | Open Drain, Push-Pull | 100Mbps | -40°C ~ 85°C (TA) | Power Supply Decoupling | Surface Mount | 14-WFDFN Exposed Pad | 14-TDFN-EP (3x3) |
||
Microchip Technology |
IC TRANSLATOR UNIDIR 8SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager5.376 |
|
Unidirectional | 1 | 1 | - | - | HSTL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS, LVTTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC XLATOR PECL-TTL DIFF 8-SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager2.784 |
|
Unidirectional | 1 | 2 | - | - | TTL | PECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSLATOR TRIPLE 20-SOIC
|
Paket: 20-SOIC (0.295", 7.50mm Width) |
Lager5.184 |
|
Unidirectional | 1 | 3 | - | - | LVPECL | ECL, LVECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC TRANSLATOR 3.3/5V 8-SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager19.872 |
|
Unidirectional | 1 | 1 | - | - | LVCMOS, LVTTL | LVPECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSLATOR 3.3V DIFF 8-SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager4.640 |
|
Unidirectional | 1 | 1 | - | - | PECL | TTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
TXRX TRANSLATING DUAL 12WLCSP
|
Paket: 12-UFBGA, WLCSP |
Lager2.560 |
|
Bidirectional | 1 | 4 | 1.65V ~ 3.6V | 2.3V ~ 5.5V | - | - | Open Drain, Push-Pull | 50Mbps | -40°C ~ 125°C (TA) | Auto-Direction Sensing | Surface Mount | 12-UFBGA, WLCSP | 12-WLCSP (1.20x1.60) |
||
Maxim Integrated |
IC LEVEL TRANSLATOR 8CH 28QFN
|
Paket: 28-WFQFN Exposed Pad |
Lager6.192 |
|
Bidirectional | 1 | 8 | 1.62V ~ 3.2V | 2.2V ~ 3.6V | - | - | Open Drain, Push-Pull | 100Mbps | -40°C ~ 85°C (TA) | Power Supply Decoupling | Surface Mount | 28-WFQFN Exposed Pad | 28-TQFN-EP (3.5x5.5) |
||
Microchip Technology |
IC TRANSLATOR UNIDIR 8SOIC
|
Paket: 8-SOIC (0.173", 4.40mm Width) |
Lager4.816 |
|
Unidirectional | 1 | 1 | - | - | HSTL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS, LVTTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOIC |
||
ON Semiconductor |
IC XLATOR LVTTL/CMOS-PECL 32-QFN
|
Paket: 32-VFQFN Exposed Pad |
Lager2.848 |
|
Unidirectional | 1 | 10 | - | - | LVCMOS, LVTTL | LVPECL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
ON Semiconductor |
IC XLATOR TTL-DIFF ECL
|
Paket: 8-VFDFN Exposed Pad |
Lager2.480 |
|
Unidirectional | 1 | 1 | - | - | TTL | ECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x2) |
||
CTS-Frequency Controls |
DIFF PECL TO TRANSLATOR CMOS/TTL
|
Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Lager2.400 |
|
Unidirectional | 1 | 2 | - | - | PECL | CMOS, TTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
CTS-Frequency Controls |
DIFF PECL TO TRANSLATOR CMOS/TTL
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager6.320 |
|
Unidirectional | 1 | 2 | - | - | PECL | CMOS, TTL | Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
CTS-Frequency Controls |
CMOS/TTL TO DIFF PECL TRANSLATOR
|
Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Lager5.088 |
|
Unidirectional | 1 | 2 | - | - | CMOS, TTL | PECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
CTS-Frequency Controls |
CMOS/TTL TO DIFF PECL TRANSLATOR
|
Paket: 8-SOIC (0.173", 4.40mm Width) |
Lager7.952 |
|
Unidirectional | 1 | 2 | - | - | CMOS, TTL | PECL | Differential | - | -40°C ~ 85°C (TA) | - | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOIC |
||
Toshiba Semiconductor and Storage |
IC BUS BUFFER UNI CST6C
|
Paket: 6-XFDFN Exposed Pad |
Lager60.000 |
|
Unidirectional | 1 | 1 | 1.1V ~ 2.7V | 1.65V ~ 3.6V | - | - | Tri-State, Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 6-XFDFN Exposed Pad | CST6C |
||
Toshiba Semiconductor and Storage |
DUAL SUPPLY BUS BUFFER UNI CST6C
|
Paket: 6-XFDFN Exposed Pad |
Lager6.880 |
|
Unidirectional | 1 | 1 | 1.1V ~ 2.7V | 1.65V ~ 3.6V | - | - | Tri-State, Non-Inverted | - | -40°C ~ 85°C (TA) | - | Surface Mount | 6-XFDFN Exposed Pad | CST6C |
||
Toshiba Semiconductor and Storage |
BUS TRANCEIVER 8WCSP
|
Paket: 8-UFBGA, WLCSP |
Lager3.264 |
|
Bidirectional | 1 | 2 | 1.2V ~ 3.6V | 1.2V ~ 3.6V | - | - | - | 200Mbps | -40°C ~ 85°C (TA) | Auto-Direction Sensing | Surface Mount | 8-UFBGA, WLCSP | 8-WCSP (0.80x1.6) |
||
Toshiba Semiconductor and Storage |
BUS TRANCEIVER WCSP6
|
Paket: 6-UFBGA, WLCSP |
Lager2.976 |
|
Bidirectional | 1 | 1 | 1.2V ~ 3.6V | 1.2V ~ 3.6V | - | - | Non-Inverted | 180Mbps | -40°C ~ 85°C (TA) | Auto-Direction Sensing | Surface Mount | 6-UFBGA, WLCSP | 6-WCSPB (0.80x1.2) |
||
NXP |
IC TXRX 4BIT TRANSLATNG 16XQFN
|
Paket: - |
Lager5.408 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Analog Devices Inc. |
IC SW LLT 1.65/3.6 LV SOT23-6
|
Paket: SOT-23-6 |
Lager36.000 |
|
Unidirectional | 1 | 1 | 1.65V ~ 3.6V | 1.65V ~ 3.6V | - | - | Non-Inverted | 10Mbps | -40°C ~ 85°C (TA) | Short Circuit Protection | Surface Mount | SOT-23-6 | SOT-23-6 |
||
NXP |
IC TRANSLATOR/TXRX SGL 6XSON
|
Paket: 6-TSSOP, SC-88, SOT-363 |
Lager5.760 |
|
Bidirectional | 1 | 1 | 0.8V ~ 3.6V | 0.8V ~ 3.6V | - | - | Tri-State, Non-Inverted | 500Mbps | -40°C ~ 125°C (TA) | - | Surface Mount | 6-TSSOP, SC-88, SOT-363 | 6-TSSOP |
||
Maxim Integrated |
IC LEVEL TRANSLATOR 16MBPS UCSP
|
Paket: 12-WFBGA, WLCSP |
Lager40.800 |
|
Bidirectional | 1 | 4 | 1.2V ~ 5.5V | 1.65V ~ 5.5V | - | - | Open Drain, Tri-State | 16Mbps | -40°C ~ 85°C (TA) | Power Supply Decoupling, Thermal-Shutdown Protection | Surface Mount | 12-WFBGA, WLCSP | 12-UCSP |
||
STMicroelectronics |
IC LEVEL TRANSLATOR 36-TFBGA
|
Paket: 36-TFBGA |
Lager32.196 |
|
Bidirectional | 2 | 4 | 1.4V ~ 3.6V | 1.4V ~ 3.6V | - | - | Non-Inverted | 104Mbps | -40°C ~ 85°C (TA) | Power-Off Protection | Surface Mount | 36-TFBGA | 36-uTFBGA (3.6x3.6) |
||
Maxim Integrated |
IC XLATR BIDIR L-LVL 2CH 8WLP
|
Paket: 8-UFBGA |
Lager2.848 |
|
Bidirectional | 1 | 2 | 0.9V ~ 5.5V | 1.65V ~ 5.5V | - | - | Open Drain, Push-Pull | 16Mbps | -40°C ~ 85°C (TA) | Thermal-Shutdown Protection, Tri-State Input | Surface Mount | 8-UFBGA | 8-WLP |