Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC PROM SERIEAL 10K 8-SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager4.464 |
|
100kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC EEPROM FLASH 32MBIT 44-PLCC
|
Paket: 44-LCC (J-Lead) |
Lager7.152 |
|
32Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC FLASH CONFIG 8M 32TQFP
|
Paket: 32-TQFP |
Lager4.752 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M LV 8DIP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager3.968 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC 3V PROM SER 10K 8-SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager5.440 |
|
100kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 8-DIP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager37.620 |
|
100kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM PROG 50K 8-SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager7.600 |
|
50kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 3.3V 8-SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager169.584 |
|
65kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC 3V SER CFG PROM 256K 8-SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager133.584 |
|
256Kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Altera |
IC CONFIG DEVICE 88UBGA
|
Paket: 88-LFBGA |
Lager19.776 |
|
16Mb | ± 2.25 V ~ 6 V | -40°C ~ 85°C | 88-LFBGA | 88-UBGA (11x8) |
||
Altera |
IC CONFIG DEVICE 16MBIT 88UBGA
|
Paket: 88-LFBGA |
Lager25.452 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Altera |
IC CONFIG DEVICE 4MBIT 100QFP
|
Paket: 100-BQFP |
Lager14.124 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 32TQFP
|
Paket: 32-TQFP |
Lager5.792 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Altera |
IC CONFIG DEVICE 20PLCC
|
Paket: 20-LCC (J-Lead) |
Lager16.020 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 1.6MBIT 20PLCC
|
Paket: 20-LCC (J-Lead) |
Lager186.480 |
|
1.6Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 16MBIT 100QFP
|
Paket: 100-BQFP |
Lager4.352 |
|
16Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 16MBIT 100QFP
|
Paket: 100-BQFP |
Lager13.476 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 256MBIT 16SOIC
|
Paket: 16-SOIC (0.295", 7.50mm Width) |
Lager23.040 |
|
256Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Intel |
IC CONFIG DEVICE 100QFP
|
Paket: 100-BQFP |
Lager3.360 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 128MBIT 16SOIC
|
Paket: 16-SOIC (0.295", 7.50mm Width) |
Lager8.808 |
|
128Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Intel |
IC CONFIG DEVICE 4MBIT 100QFP
|
Paket: 100-BQFP |
Lager6.960 |
|
4MB | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 16MBIT 100QFP
|
Paket: 100-BQFP |
Lager12.480 |
|
16Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 1.6MBIT 20PLCC
|
Paket: 20-LCC (J-Lead) |
Lager5.392 |
|
1.6Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |