Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics |
IC SDRAM 2GBIT 400MHZ 60WBGA
|
Paket: 60-TFBGA |
Lager4.320 |
|
DRAM | SDRAM - DDR2 | 2Gb (256M x 8) | Parallel | 200MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 60-TFBGA | 60-WBGA (11x11.5) |
||
Micron Technology Inc. |
IC FLASH 32GBIT 48TSOP
|
Paket: 48-TFSOP (0.724", 18.40mm Width) |
Lager56.244 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Micron Technology Inc. |
IC FLASH 128GBIT 52VLGA
|
Paket: 52-VLGA |
Lager77.040 |
|
FLASH | FLASH - NAND | 128Gb (16G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 52-VLGA | 52-VLGA (18x14) |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 500MHZ 165FBGA
|
Paket: 165-LBGA |
Lager4.592 |
|
SRAM | SRAM - Synchronous, QDR II+ | 72Mb (2M x 36) | Parallel | 500MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
STMicroelectronics |
IC EEPROM 512KBIT 1MHZ 8SO
|
Paket: 8-SOIC (0.209", 5.30mm Width) |
Lager243.888 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 10ms | 500ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SO |
||
Microchip Technology |
IC OTP 4MBIT 150NS 40DIP
|
Paket: 40-DIP (0.600", 15.24mm) |
Lager6.720 |
|
EPROM | EPROM - OTP | 4Mb (256K x 16) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32PLCC
|
Paket: 32-LCC (J-Lead) |
Lager7.680 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 2MBIT 133MHZ 208QFP
|
Paket: 208-BFQFP |
Lager2.768 |
|
SRAM | SRAM - Dual Port, Synchronous | 2Mb (64K x 36) | Parallel | 133MHz | - | 4.2ns | 3.15 V ~ 3.45 V | 0°C ~ 70°C (TA) | Surface Mount | 208-BFQFP | 208-PQFP (28x28) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 2MBIT 133MHZ 256CABGA
|
Paket: 256-LBGA |
Lager3.344 |
|
SRAM | SRAM - Dual Port, Synchronous | 2Mb (64K x 36) | Parallel | 133MHz | - | 4.2ns | 3.15 V ~ 3.45 V | 0°C ~ 70°C (TA) | Surface Mount | 256-LBGA | 256-CABGA (17x17) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 144KBIT 15NS 100TQFP
|
Paket: 100-LQFP |
Lager3.200 |
|
SRAM | SRAM - Dual Port, Asynchronous | 144Kb (8K x 18) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Micron Technology Inc. |
IC SDRAM 24GBIT 1.8GHZ FBGA
|
Paket: - |
Lager4.432 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (384M x 64) | - | 1866MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
Fujitsu Electronics America, Inc. |
IC FRAM 2MBIT 40MHZ 8SOP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager2.768 |
|
FRAM | FRAM (Ferroelectric RAM) | 2Mb (256K x 8) | SPI | 25MHz | - | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Winbond Electronics |
IC FLASH 2GBIT 104MHZ WSON
|
Paket: 8-WDFN Exposed Pad |
Lager2.896 |
|
FLASH | FLASH - NAND (SLC) | 2Gb (256M x 8) | SPI | 104MHz | 700µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Cypress Semiconductor Corp |
F-RAM MEMORY SERIAL
|
Paket: - |
Lager3.152 |
|
FRAM | FRAM (Ferroelectric RAM) | 4Kb (512 x 8) | I2C | 3.4MHz | - | - | 3 V ~ 3.6 V | -40°C ~ 125°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 32MBIT 104MHZ 8USON
|
Paket: 8-UDFN Exposed Pad |
Lager5.968 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI | 104MHz | 5µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-USON (5x6) |
||
Adesto Technologies |
IC FLASH 8MBIT 104MHZ 8UDFN
|
Paket: 8-UDFN Exposed Pad |
Lager4.400 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 104MHz | 5µs, 5ms | - | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |
||
Cypress Semiconductor Corp |
IC NVSRAM 1MBIT 45NS 48FBGA
|
Paket: 48-TFBGA |
Lager7.072 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | Parallel | - | 45ns | 45ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-FBGA (6x10) |
||
Micron Technology Inc. |
IC FLASH 2GBIT 16SO
|
Paket: 16-SOIC (0.295", 7.50mm Width) |
Lager6.688 |
|
FLASH | FLASH - NAND | 2Gb (2G x 1) | SPI | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP |
||
Micron Technology Inc. |
IC FLASH 128MBIT 108MHZ 24TBGA
|
Paket: 24-TBGA |
Lager5.072 |
|
FLASH | FLASH - NOR | 128Mb (32M x 4) | SPI | 108MHz | 8ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-T-PBGA (6x8) |
||
Macronix |
IC FLASH 128MBIT 104MHZ 8WSON
|
Paket: 8-WDFN Exposed Pad |
Lager96.996 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 104MHz | 30µs, 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Microchip Technology |
IC EEPROM 1K SPI 10MHZ WAFER
|
Paket: Die |
Lager6.736 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Cypress Semiconductor Corp |
IC FLASH 128M PARALLEL 64BGA
|
Paket: 64-LBGA |
Lager6.112 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | - | 60ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Cypress Semiconductor Corp |
IC FLASH 1G PARALLEL 64BGA
|
Paket: 64-LBGA |
Lager23.898 |
|
FLASH | FLASH - NOR | 1Gb (64M x 16) | Parallel | - | 60ns | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Microchip Technology |
2MHZ AUTO GRADE 8-TSSOP
|
Paket: 8-TSSOP (0.173", 4.40mm Width) |
Lager4.000 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 1MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Winbond Electronics |
IC FLASH 2GBIT SPI/QUAD 24TFBGA
|
Paket: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 2Gbit | SPI - Quad I/O | 104 MHz | 700µs | 7 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (8x6) |
||
Winbond Electronics |
IC DRAM 1GBIT SSTL 15 78VFBGA
|
Paket: - |
Request a Quote |
|
DRAM | SDRAM - DDR3 | 1Gbit | SSTL_15 | 1.066 GHz | 15ns | 20 ns | 1.425V ~ 1.575V | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) |
||
Infineon Technologies |
IC FLASH 64MBIT SPI/QUAD 8WSON
|
Paket: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | SPI - Quad I/O, QPI | 108 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-WSON (5x6) |
||
ISSI, Integrated Silicon Solution Inc |
RLDRAM2 Memory, 288Mbit, x18, Se
|
Paket: - |
Request a Quote |
|
DRAM | RLDRAM 2 | 288Mbit | HSTL | 533 MHz | - | 15 ns | 1.7V ~ 1.9V | -40°C ~ 85°C (TA) | Surface Mount | 144-TFBGA | 144-TWBGA (11x18.5) |