Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC SRAM 18MBIT 167MHZ 165FBGA
|
Paket: 165-LBGA |
Lager16.932 |
|
SRAM | SRAM - Synchronous, DDR II | 18Mb (512K x 36) | Parallel | 167MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager9.540 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 15NS 84PLCC
|
Paket: 84-LCC (J-Lead) |
Lager4.464 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
||
Winbond Electronics |
IC SDRAM 64MBIT 166MHZ 90BGA
|
Paket: 90-TFBGA |
Lager3.600 |
|
DRAM | SDRAM | 64Mb (2M x 32) | Parallel | 166MHz | - | 5ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
Adesto Technologies |
IC FLASH 4MBIT 85MHZ 8WLCSP
|
Paket: 8-UFBGA, WLCSP |
Lager3.824 |
|
FLASH | FLASH | 4Mb (256 Bytes x 2048 pages) | SPI | 85MHz | 8µs, 3ms | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UFBGA, WLCSP | 8-WLCSP |
||
ON Semiconductor |
IC FLASH 4MBIT 40MHZ 8VSON
|
Paket: 8-WDFN Exposed Pad |
Lager24.000 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 40MHz | 5ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-VSON (5x6) |
||
Microchip Technology |
IC EEPROM 4KBIT 400KHZ 8SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager4.960 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8DIP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager7.452 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 2MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Rohm Semiconductor |
IC EEPROM 32KBIT 400KHZ 8DIP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager18.948 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP-T |
||
Alliance Memory, Inc. |
IC SRAM 1MBIT 12NS 32SOJ
|
Paket: 32-BSOJ (0.400", 10.16mm Width) |
Lager6.588 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-BSOJ (0.400", 10.16mm Width) | 32-SOJ |
||
Alliance Memory, Inc. |
IC SDRAM 512MBIT 133MHZ 54TSOP
|
Paket: 54-TSOP (0.400", 10.16mm Width) |
Lager17.712 |
|
DRAM | SDRAM | 512Mb (64M x 8) | Parallel | 133MHz | 15ns | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP |
||
STMicroelectronics |
IC NVSRAM 64KBIT 100NS 28DIP
|
Paket: 28-DIP Module (0.600", 15.24mm) |
Lager5.856 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 64Kb (8K x 8) | Parallel | - | 100ns | 100ns | 4.75 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP Module (0.600", 15.24mm) | 28-PCDIP, CAPHAT? |
||
Micron Technology Inc. |
IC DRAM 16G 2133MHZ
|
Paket: - |
Lager4.640 |
|
DRAM | SDRAM - Mobile LPDDR4 | 16Gb (256M x 64) | - | 2133MHz | - | - | 1.1V | -30°C ~ 105°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 1M SPI 20MHZ WAFER
|
Paket: Die |
Lager5.760 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | SPI | 20MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Micron Technology Inc. |
IC GDDR5 4G 128MX32 FBGA
|
Paket: - |
Lager5.520 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Macronix |
IC FLASH SERIAL NOR 512M 8WSON
|
Paket: 8-WDFN Exposed Pad |
Lager22.092 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | SPI | 166MHz | 60µs, 750µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Cypress Semiconductor Corp |
IC FLASH 64M PARALLEL 64FBGA
|
Paket: 64-LBGA |
Lager3.312 |
|
FLASH | FLASH - NOR | 64Mb (4M x 16) | Parallel | - | 60ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
Cypress Semiconductor Corp |
IC NOR
|
Paket: 8-WDFN Exposed Pad |
Lager3.280 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O, QPI | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
Adesto Technologies |
8-SOIC-W IND TEMP 2.3V
|
Paket: 8-SOIC (0.209", 5.30mm Width) |
Lager5.184 |
|
FLASH | FLASH | 16M (4096 pages x 512 bytes) | SPI | 85MHz | 8µs, 4ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC DRAM 16G 1866MHZ
|
Paket: - |
Lager7.328 |
|
DRAM | SDRAM - Mobile LPDDR4 | 16Gb (512M x 32) | - | 1866MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
1Mb, Serial SRAM, 2.7V-3.6V, 45M
|
Paket: - |
Request a Quote |
|
SRAM | SRAM - Synchronous | 1Mbit | SPI - Quad I/O, SDI | 45 MHz | - | 15 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Infineon Technologies |
IC FLASH 64MBIT PARALLEL 48TSOP
|
Paket: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | Parallel | - | 110ns | 110 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Winbond Electronics |
IC FLASH 256MBIT SPI/QUAD 8WSON
|
Paket: - |
Request a Quote |
|
FLASH | FLASH - NOR | 256Mbit | SPI - Quad I/O | 133 MHz | 5ms | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Infineon Technologies |
IC GATE NOR
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 512GBIT PAR 132VBGA
|
Paket: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 512Gbit | Parallel | - | - | - | 2.6V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 132-VBGA | 132-VBGA (12x18) |
||
GigaDevice Semiconductor (HK) Limited |
1GBIT, 3.3V, SOP16 300MIL, INDUS
|
Paket: - |
Lager2.727 |
|
FLASH | FLASH - NOR (SLC) | 1Gbit | SPI - Quad I/O, QPI, DTR | 133 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP |
||
Winbond Electronics |
IC FLASH 2MBIT SPI/QUAD 104MHZ
|
Paket: - |
Request a Quote |
|
FLASH | FLASH - NOR | 2Mbit | SPI - Quad I/O | 104 MHz | 30µs, 800µs | 6 ns | 1.65V ~ 1.95V | - | - | - | - |
||
Winbond Electronics |
IC DRAM 1GBIT SSTL 15 78VFBGA
|
Paket: - |
Request a Quote |
|
DRAM | SDRAM - DDR3 | 1Gbit | SSTL_15 | 1.066 GHz | 15ns | 20 ns | 1.425V ~ 1.575V | -40°C ~ 105°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) |