Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
LPDDR3 512MX64 PLASTIC GREEN WFB
|
Paket: - |
Lager3.984 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 576MBIT 300MHZ 144BGA
|
Paket: 144-TFBGA |
Lager4.496 |
|
DRAM | DRAM | 576Mb (64M x 9) | Parallel | 300MHz | - | 20ns | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 144-TFBGA | 144-FCBGA (11x18.5) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 166MHZ 60BGA
|
Paket: 60-TFBGA |
Lager7.936 |
|
DRAM | SDRAM - Mobile DDR | 256Mb (16M x 16) | Parallel | 166MHz | 15ns | 5.5ns | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (8x10) |
||
ON Semiconductor |
IC FLASH 512KBIT 90NS 32DIP
|
Paket: 32-DIP (0.600", 15.24mm) |
Lager6.144 |
|
FLASH | FLASH | 512Kb (64K x 8) | Parallel | - | 90ns | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 8.5NS 165CABGA
|
Paket: 165-TBGA |
Lager6.624 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | - | - | 8.5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 512MBIT 133MHZ 90BGA
|
Paket: 90-LFBGA |
Lager7.824 |
|
DRAM | SDRAM | 512Mb (16M x 32) | Parallel | 133MHz | - | 6ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 90-LFBGA | 90-LFBGA (8x13) |
||
SII Semiconductor Corporation |
IC EEPROM 4KBIT 400KHZ 8DIP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager2.416 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 400kHz | 10ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
IC FLASH 4MBIT 90NS 32PLCC
|
Paket: 32-LCC (J-Lead) |
Lager4.000 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 50µs | 90ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 20NS 68PLCC
|
Paket: 68-LCC (J-Lead) |
Lager4.544 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (16K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 8.5NS 165CABGA
|
Paket: 165-TBGA |
Lager5.280 |
|
SRAM | SRAM - Synchronous | 9Mb (512K x 18) | Parallel | 87MHz | - | 8.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Cypress Semiconductor Corp |
IC FLASH 512MBIT 110NS 64BGA
|
Paket: 64-LBGA |
Lager4.816 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | 60ns | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Cypress Semiconductor Corp |
NAND
|
Paket: - |
Lager7.456 |
|
FLASH | FLASH - NAND | 2Gb (256M x 8) | Parallel | - | 45ns | 45ns | 1.7 V ~ 1.95 V | -40°C ~ 105°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 8.5NS 100TQFP
|
Paket: 100-LQFP |
Lager7.664 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (256K x 18) | Parallel | - | - | 8.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microchip Technology |
IC FLASH 16MBIT 70NS 48WFBGA
|
Paket: 48-WFBGA |
Lager5.840 |
|
FLASH | FLASH | 16Mb (1M x 16) | Parallel | - | 40µs | 70ns | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Microchip Technology |
IC SRAM 512KBIT 20MHZ 8DIP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager5.712 |
|
SRAM | SRAM | 512Kb (64K x 8) | SPI - Quad I/O | 20MHz | - | - | 1.7 V ~ 2.2 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Rohm Semiconductor |
IC EEPROM 1KBIT 10MHZ 8SOP
|
Paket: 8-SOIC (0.173", 4.40mm Width) |
Lager4.192 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 10MHz | 4ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ SOT23-5
|
Paket: SC-74A, SOT-753 |
Lager4.288 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Micron Technology Inc. |
IC DRAM 24G 1600MHZ FBGA
|
Paket: - |
Lager3.408 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (768M x 32) | - | 1600MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
Winbond Electronics |
IC FLASH 128M SPI 104MHZ 8WSON
|
Paket: 8-WDFN Exposed Pad |
Lager15.852 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Cypress Semiconductor Corp |
IC FLASH 512M PARALLEL 64BGA
|
Paket: 64-LBGA |
Lager2.864 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | 60ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-Fortified BGA (13x11) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64K PARALLEL 68PLCC
|
Paket: 68-LCC (J-Lead) |
Lager7.600 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 17ns | 17ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Micron Technology Inc. |
IC FLASH 2G PARALLEL FBGA
|
Paket: - |
Lager6.288 |
|
FLASH | FLASH - NAND | 2Gb (128M x 16) | Parallel | - | - | - | 1.7 V ~ 1.95 V | -40°C ~ 105°C (TA) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 256MBIT PAR 54TSOP II
|
Paket: - |
Request a Quote |
|
DRAM | SDRAM | 256Mbit | LVTTL | 143 MHz | - | 5.4 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Micron Technology Inc. |
DRAM LPDDR4 32G 1GX32 FBGA WT
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC DRAM 1GBIT PAR 96VFBGA
|
Paket: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 1Gbit | Parallel | 667 MHz | 15ns | 20 ns | 1.283V ~ 1.45V, 1.425V ~ 1.575V | 0°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) |
||
Cypress Semiconductor Corp |
IC FLASH 1GBIT PARALLEL 64FBGA
|
Paket: - |
Request a Quote |
|
FLASH | FLASH - NOR | 1Gbit | Parallel | - | 130ns | 130 ns | 1.65V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
Rohm Semiconductor |
IC EEPROM 32KBIT I2C 1MHZ 8TSSOP
|
Paket: - |
Lager7.269 |
|
EEPROM | EEPROM | 32Kbit | I2C | 1 MHz | 5ms | - | 1.6V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP-B |
||
GSI Technology Inc. |
IC SRAM 9MBIT PARALLEL 165FPBGA
|
Paket: - |
Request a Quote |
|
SRAM | SRAM - Synchronous, ZBT | 9Mbit | Parallel | 333 MHz | - | - | 2.3V ~ 2.7V, 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FPBGA (13x15) |
||
Micron Technology Inc. |
LPDDR5 128GBIT 64 441/441 TFBGA
|
Paket: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
TLC 4T 512GX8 LBGA 8DP
|
Paket: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 4Tbit | Parallel | - | - | - | 2.6V ~ 3.6V | 0°C ~ 70°C | Surface Mount | 132-BGA | 132-LBGA (12x18) |