Intel Produkte

NG80960KA16

Intel

IC MPU I960 16MHZ 132QFP

• Core Processor: i960
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 16MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 100°C (TC)
• Security Features: -
• Package / Case: 132-QFP
• Supplier Device Package: 132-QFP

Paket: 132-QFP

5CSEMA6F31C6N

Intel

IC FPGA 288 I/O 896FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 925MHz
• Primary Attributes: FPGA - 110K Logic Elements
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 896-BGA
• Supplier Device Package: 896-FBGA (31x31)

Paket: 896-BGA

EP2A70F1020C8

Intel

IC FPGA

• Number of LABs/CLBs: 6720
• Number of Logic Elements/Cells: 67200
• Total RAM Bits: 1146880
• Number of I/O: 735
• Number of Gates: 5250000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

Paket: 1020-BBGA

EP2A15F672C7AA

Intel

IC FPGA

• Number of LABs/CLBs: 1664
• Number of Logic Elements/Cells: 16640
• Total RAM Bits: 425984
• Number of I/O: 492
• Number of Gates: 1900000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

Paket: 672-BBGA, FCBGA

EP2A15F672I8

Intel

IC FPGA 492 I/O 672FBGA

• Number of LABs/CLBs: 1664
• Number of Logic Elements/Cells: 16640
• Total RAM Bits: 425984
• Number of I/O: 492
• Number of Gates: 1900000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

Paket: 672-BBGA, FCBGA

EP4CGX15BN11C7N

Intel

IC FPGA 72 I/O 148QFN

• Number of LABs/CLBs: 900
• Number of Logic Elements/Cells: 14400
• Total RAM Bits: 552960
• Number of I/O: 72
• Number of Gates: -
• Voltage - Supply: 1.16 V ~ 1.24 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 148-WFQFN Dual Rows, Exposed Pad
• Supplier Device Package: 148-QFN (11x11)

Paket: 148-WFQFN Dual Rows, Exposed Pad

EP1SGX10DF672I6N

Intel

IC FPGA 362 I/O 672FBGA

• Number of LABs/CLBs: 1057
• Number of Logic Elements/Cells: 10570
• Total RAM Bits: 920448
• Number of I/O: 362
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

Paket: 672-BBGA, FCBGA

EPF10K50EQC240-2

Intel

IC FPGA 189 I/O 240QFP

• Number of LABs/CLBs: 360
• Number of Logic Elements/Cells: 2880
• Total RAM Bits: 40960
• Number of I/O: 189
• Number of Gates: 199000
• Voltage - Supply: 2.3 V ~ 2.7 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 240-BQFP
• Supplier Device Package: 240-PQFP (32x32)

Paket: 240-BQFP

5SGXMBBR2H43I2N

Intel

IC FPGA 600 I/O 1760HBGA

• Number of LABs/CLBs: 359200
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 65561600
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-HBGA (45x45)

Paket: 1760-BBGA, FCBGA

10AX090U1F45E1SG

Intel

IC FPGA 480 I/O 1932FCBGA

• Number of LABs/CLBs: 339620
• Number of Logic Elements/Cells: 900000
• Total RAM Bits: 59234304
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

Paket: 1932-BBGA, FCBGA

EP4SGX360KF40C3

Intel

IC FPGA 744 I/O 1517FBGA

• Number of LABs/CLBs: 14144
• Number of Logic Elements/Cells: 353600
• Total RAM Bits: 23105536
• Number of I/O: 744
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

Paket: 1517-BBGA, FCBGA

5AGXMB5G4F35C4N

Intel

IC FPGA 544 I/O 1152FBGA

• Number of LABs/CLBs: 19811
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 23625728
• Number of I/O: 544
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA Exposed Pad
• Supplier Device Package: 1152-FBGA (35x35)

Paket: 1152-BBGA, FCBGA Exposed Pad

EP2S60F1020C5

Intel

IC FPGA 718 I/O 1020FBGA

• Number of LABs/CLBs: 3022
• Number of Logic Elements/Cells: 60440
• Total RAM Bits: 2544192
• Number of I/O: 718
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

Paket: 1020-BBGA

EP2AGX45DF25C5G

Intel

IC FPGA 252 I/O 572FBGA

• Number of LABs/CLBs: 1805
• Number of Logic Elements/Cells: 42959
• Total RAM Bits: 3517440
• Number of I/O: 252
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 572-BGA, FCBGA
• Supplier Device Package: 572-FBGA, FC (25x25)

Paket: 572-BGA, FCBGA

EP4CGX75CF23C8N

Intel

IC FPGA 290 I/O 484FBGA

• Number of LABs/CLBs: 4620
• Number of Logic Elements/Cells: 73920
• Total RAM Bits: 4257792
• Number of I/O: 290
• Number of Gates: -
• Voltage - Supply: 1.16 V ~ 1.24 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

Paket: 484-BGA

EP2C8T144C7

Intel

IC FPGA 85 I/O 144TQFP

• Number of LABs/CLBs: 516
• Number of Logic Elements/Cells: 8256
• Total RAM Bits: 165888
• Number of I/O: 85
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

Paket: 144-LQFP

EP4CE10E22C8LN

Intel

IC FPGA 91 I/O 144EQFP

• Number of LABs/CLBs: 645
• Number of Logic Elements/Cells: 10320
• Total RAM Bits: 423936
• Number of I/O: 91
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-EQFP (20x20)

Paket: 144-LQFP Exposed Pad

EP4CGX15BF14C8

Intel

IC FPGA 72 I/O 169FBGA

• Number of LABs/CLBs: 900
• Number of Logic Elements/Cells: 14400
• Total RAM Bits: 552960
• Number of I/O: 72
• Number of Gates: -
• Voltage - Supply: 1.16 V ~ 1.24 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 169-LBGA
• Supplier Device Package: 169-FBGA (14x14)

Paket: 169-LBGA

EPM9320RI208-20

Intel

IC CPLD 320MC 20NS 208RQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 20.0ns
• Voltage Supply - Internal: 4.5 V ~ 5.5 V
• Number of Logic Elements/Blocks: 20
• Number of Macrocells: 320
• Number of Gates: 6000
• Number of I/O: 132
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP Exposed Pad
• Supplier Device Package: 208-RQFP (28x28)

Paket: 208-BFQFP Exposed Pad

AGIB027R31B2I1VB

Intel

IC FPGA AGILEX-I 3184BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

Paket: -

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5SGXMA9K2H40I2G

Intel

IC FPGA 696 I/O 1517HBGA

• Number of LABs/CLBs: 317000
• Number of Logic Elements/Cells: 840000
• Total RAM Bits: 53248000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-HBGA (45x45)

Paket: -

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AGFD023R25A2E3V

Intel

IC FPGA AGILEX-F 2581FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

Paket: -

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5SGXMA3H1F35C2G

Intel

IC FPGA 600 I/O 1152FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 19456000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

Paket: -

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5SGXEB5R1F43C2LG

Intel

IC FPGA 600 I/O 1760FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 41984000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

Paket: -

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KC80526GY650256

Intel

IC MPU MOBIL PENT 650MHZ PBGA495

• Core Processor: Mobile Intel® Pentium® III
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 650MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.35V, 1.6V
• Operating Temperature: 100°C (TJ)
• Security Features: -
• Package / Case: 495-BGA
• Supplier Device Package: 495-PBGA

Paket: -

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5SGXMA3K3F35C2WN

Intel

IC FPGA 600 I/O 1152FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 19456000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

Paket: -

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5SGSMD6K2F40I3G

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 220000
• Number of Logic Elements/Cells: 583000
• Total RAM Bits: 46080000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

Paket: -

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5SGXMA7N3F45C2WN

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

Paket: -

Request a Quote