Intel Produkte

NG80386DX20

Intel

IC MPU I386 20MHZ 132QFP

• Core Processor: Intel386 DX
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 20MHz
• Co-Processors/DSP: Math Engine; Intel387 DX
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 85°C (TC)
• Security Features: -
• Package / Case: 132-QFP
• Supplier Device Package: 132-QFP

Paket: 132-QFP

10AS048H3F34E2LG

Intel

1152-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 480K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

Paket: -

10AS027E2F29E2LG

Intel

780-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 270K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

Paket: -

5CSXFC2C6U23A7N

Intel

IC FPGA 188 I/O 672UBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 700MHz
• Primary Attributes: FPGA - 25K Logic Elements
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 672-FBGA
• Supplier Device Package: 672-UBGA (23x23)

Paket: 672-FBGA

10CL016YU484I7G

Intel

IC FPGA 340 I/O 484 FBGA

• Number of LABs/CLBs: 963
• Number of Logic Elements/Cells: 15408
• Total RAM Bits: 516096
• Number of I/O: 340
• Number of Gates: -
• Voltage - Supply: 1.2V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 484-UBGA (19x19)

Paket: 484-FBGA

10M40DAF672I6G

Intel

IC FPGA 500 I/O 672FBGA

• Number of LABs/CLBs: 2500
• Number of Logic Elements/Cells: 40000
• Total RAM Bits: 1290240
• Number of I/O: 500
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 672-BGA
• Supplier Device Package: 672-FBGA (27x27)

Paket: 672-BGA

10AX115N4F45I3SGES

Intel

IC FPGA 768 I/O 1932FCBGA

• Number of LABs/CLBs: 427200
• Number of Logic Elements/Cells: 1150000
• Total RAM Bits: 68857856
• Number of I/O: 768
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

Paket: 1932-BBGA, FCBGA

EP20K400EFC672-2

Intel

IC FPGA 488 I/O 672FBGA

• Number of LABs/CLBs: 1664
• Number of Logic Elements/Cells: 16640
• Total RAM Bits: 212992
• Number of I/O: 488
• Number of Gates: 1052000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA
• Supplier Device Package: 672-FBGA (27x27)

Paket: 672-BBGA

EP1K100FC256-3

Intel

IC FPGA 186 I/O 256FBGA

• Number of LABs/CLBs: 624
• Number of Logic Elements/Cells: 4992
• Total RAM Bits: 49152
• Number of I/O: 186
• Number of Gates: 257000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 256-BBGA
• Supplier Device Package: 256-FBGA (17x17)

Paket: 256-BBGA

EP4SGX360NF45C4N

Intel

IC FPGA 920 I/O 1932FBGA

• Number of LABs/CLBs: 14144
• Number of Logic Elements/Cells: 353600
• Total RAM Bits: 23105536
• Number of I/O: 920
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

Paket: 1932-BBGA, FCBGA

5SGXMA9K3H40I3N

Intel

IC FPGA 696 I/O 1517HBGA

• Number of LABs/CLBs: 317000
• Number of Logic Elements/Cells: 840000
• Total RAM Bits: 64210944
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-HBGA (45x45)

Paket: 1517-BBGA, FCBGA

10AX048K4F35E3LG

Intel

1152-PIN FBGA

• Number of LABs/CLBs: 183590
• Number of Logic Elements/Cells: 480000
• Total RAM Bits: 5664768
• Number of I/O: 396
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

Paket: 1152-BBGA, FCBGA

EP2S60F1020C3

Intel

IC FPGA 718 I/O 1020FBGA

• Number of LABs/CLBs: 3022
• Number of Logic Elements/Cells: 60440
• Total RAM Bits: 2544192
• Number of I/O: 718
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

Paket: 1020-BBGA

5AGZME1H3F35C4N

Intel

IC FPGA 414 I/O 1152FBGA

• Number of LABs/CLBs: 10377
• Number of Logic Elements/Cells: 220000
• Total RAM Bits: 15282176
• Number of I/O: 414
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

Paket: 1152-BBGA, FCBGA

5AGXBB3D6F31C6N

Intel

IC FPGA 384 I/O 896FBGA

• Number of LABs/CLBs: 17110
• Number of Logic Elements/Cells: 362000
• Total RAM Bits: 19822592
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FBGA (31x31)

Paket: 896-BBGA, FCBGA

10CL040YU484C8G

Intel

484-PIN UBGA

• Number of LABs/CLBs: 2475
• Number of Logic Elements/Cells: 39600
• Total RAM Bits: 1161216
• Number of I/O: 325
• Number of Gates: -
• Voltage - Supply: 1.2V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 484-UBGA (19x19)

Paket: 484-FBGA

EPM3064ATI44-10NAD

Intel

IC CPLD 64MC 10NS 44TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1250
• Number of I/O: 34
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

Paket: 44-TQFP

EPM7160EQI100-15

Intel

IC CPLD 160MC 15NS 100QFP

• Programmable Type: EE PLD
• Delay Time tpd(1) Max: 15.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 10
• Number of Macrocells: 160
• Number of Gates: 3200
• Number of I/O: 84
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-BQFP
• Supplier Device Package: 100-PQFP (20x14)

Paket: 100-BQFP

EPM7160STI100-10N

Intel

IC CPLD 160MC 10NS 100TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 4.5 V ~ 5.5 V
• Number of Logic Elements/Blocks: 10
• Number of Macrocells: 160
• Number of Gates: 3200
• Number of I/O: 84
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

Paket: 100-TQFP

EPM1270F256C4N

Intel

IC CPLD 980MC 6.2NS 256FBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 6.2ns
• Voltage Supply - Internal: 2.5V, 3.3V
• Number of Logic Elements/Blocks: 1270
• Number of Macrocells: 980
• Number of Gates: -
• Number of I/O: 212
• Operating Temperature: 0°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

Paket: 256-BGA

AGFB019R24C2I3E

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

Paket: -

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EPM1270F256I5NRR

Intel

IC CPLD 980MC 10NS 256FBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10 ns
• Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
• Number of Logic Elements/Blocks: 1270
• Number of Macrocells: 980
• Number of Gates: -
• Number of I/O: 212
• Operating Temperature: -40°C ~ 100°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

Paket: -

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AGIB019R31B2I1V

Intel

IC FPGA AGILEX-I 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

Paket: -

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AGFA023R24C2E2VB

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

Paket: -

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AGFA023R24C2E1VB

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

Paket: -

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1SG210HN3F43I3VG

Intel

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 262500
• Number of Logic Elements/Cells: 2100000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

Paket: -

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EP3SE260F1517I4G

Intel

IC FPGA 976 I/O 1517FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

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5962-9069203QYA

Intel

MICROCONTROLLER, 8096 CPU

• Core Processor: 87C196KD
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: Serial Port
• Peripherals: PWM, WDT
• Number of I/O: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: EPROM
• EEPROM Size: -
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
• Data Converters: A/D 8x8/10b
• Oscillator Type: External, Internal
• Operating Temperature: -55°C ~ 125°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 68-CFlatpack
• Supplier Device Package: 68-CQFP (24.2x24.2)

Paket: -

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5SGXMB5R1F43I2G

Intel

IC FPGA 600 I/O 1760FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 41984000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

Paket: -

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5SGXEA5N2F45I3LG

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

Paket: -

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