Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Number of Elements | Output Type | Voltage - Supply, Single/Dual (±) | Voltage - Input Offset (Max) | Current - Input Bias (Max) | Current - Output (Typ) | Current - Quiescent (Max) | CMRR, PSRR (Typ) | Propagation Delay (Max) | Hysteresis | Operating Temperature | Package / Case | Mounting Type | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager17.700 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8DIP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager4.304 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP 1.6V SGL O-D W/CS 8SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager2.352 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager5.392 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager7.872 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager3.840 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8MSOP
|
Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Lager6.640 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP
|
Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Lager7.776 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager12.132 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager31.272 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-DIP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager3.776 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8DIP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager5.088 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8MSOP
|
Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Lager5.056 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D 8DIP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager7.664 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP 1.6V SGL P-P 8-MSOP
|
Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Lager4.384 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D 8MSOP
|
Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Lager6.304 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P 8MSOP
|
Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Lager6.272 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D 8SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager7.232 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D 8SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager4.976 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P 8SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager5.008 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 125°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager2.960 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager109.236 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP
|
Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Lager7.344 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8MSOP
|
Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Lager15.420 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC
|
Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager121.656 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | Surface Mount | 8-SOIC |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8DIP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager38.568 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-DIP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager4.032 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | Through Hole | 8-PDIP |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8MSOP
|
Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Lager4.576 |
|
1 | CMOS, Push-Pull, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | - | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Surface Mount | 8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D SC70-5
|
Paket: 5-TSSOP, SC-70-5, SOT-353 |
Lager5.600 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | 5-TSSOP, SC-70-5, SOT-353 | Surface Mount | SC-70-5 |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SGL SOT23-5
|
Paket: SC-74A, SOT-753 |
Lager5.296 |
|
1 | CMOS, Open-Drain, Rail-to-Rail, TTL | 1.6 V ~ 5.5 V | 7mV @ 5.5V | 1pA @ 5.5V | 30mA | 1µA | 70dB CMRR, 80dB PSRR | 8µs | 6.5mV | -40°C ~ 85°C | SC-74A, SOT-753 | Surface Mount | SOT-23-5 |