Microchip Technology Produkte

DSC1001DL5-033.0000T

Microchip Technology

OSC MEMS 33.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 33MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paket: 4-SMD, No Lead

DSC1001DI5-002.4576

Microchip Technology

OSC MEMS 2.4576MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 2.4576MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paket: 4-SMD, No Lead

DSC1001AI2-027.0016T

Microchip Technology

OSC MEMS 27.0016MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 27.0016MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paket: 4-SMD, No Lead Exposed Pad

MIC5236BMM

Microchip Technology

IC REG LIN POS ADJ 150MA 8MSOP

• Output Configuration: Positive
• Output Type: Adjustable
• Number of Regulators: 1
• Voltage - Input (Max): 30V
• Voltage - Output (Min/Fixed): 1.24V
• Voltage - Output (Max): 20V
• Voltage Dropout (Max): 0.5V @ 150mA
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 30µA ~ 5mA
• PSRR: -
• Control Features: Enable
• Protection Features: Load Dump, Over Current, Over Temperature, Over Voltage, Reverse Polarity
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

MIC2212-KNBML-TR

Microchip Technology

IC REG LINEAR 2.6V/2.85V 10MLF

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 2
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.6V, 2.85V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.25V @ 150mA, 0.42V @ 300mA
• Current - Output: 150mA, 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 80µA
• PSRR: 60dB ~ 40dB (1KHz ~ 20kHz)
• Control Features: Enable, Power On Reset
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad, 10-MLF?
• Supplier Device Package: 10-MLF? (3x3)

Paket: 10-VFDFN Exposed Pad, 10-MLF?

MIC2198YML-TR

Microchip Technology

IC REG CTRLR BUCK 12MLF

• Output Type: Transistor Driver
• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Number of Outputs: 1
• Output Phases: 1
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 32 V
• Frequency - Switching: 500kHz
• Duty Cycle (Max): 76%
• Synchronous Rectifier: Yes
• Clock Sync: No
• Serial Interfaces: -
• Control Features: Enable
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 12-VFDFN Exposed Pad, 12-MLF?
• Supplier Device Package: 12-MLF? (4x4)

Paket: 12-VFDFN Exposed Pad, 12-MLF?

93C86BT-E/SN

Microchip Technology

IC EEPROM 16KBIT 3MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 16Kb (1K x 16)
• Memory Interface: SPI
• Clock Frequency: 3MHz
• Write Cycle Time - Word, Page: 2ms
• Access Time: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

Paket: 8-SOIC (0.154", 3.90mm Width)

AT25FS010N-SH27-B

Microchip Technology

IC FLASH 1MBIT 50MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 1Mb (128K x 8)
• Memory Interface: SPI
• Clock Frequency: 50MHz
• Write Cycle Time - Word, Page: 50µs
• Access Time: -
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

Paket: 8-SOIC (0.154", 3.90mm Width)

AT28C64E-12JU

Microchip Technology

IC EEPROM 64KBIT 120NS 32PLCC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 64Kb (8K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 200µs
• Access Time: 120ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 32-LCC (J-Lead)
• Supplier Device Package: 32-PLCC

Paket: 32-LCC (J-Lead)

93LC46CT-I/MC

Microchip Technology

IC EEPROM 1KBIT 3MHZ 8DFN

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 1Kb (128 x 8 , 64 x 16)
• Memory Interface: SPI
• Clock Frequency: 3MHz
• Write Cycle Time - Word, Page: 6ms
• Access Time: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-VFDFN Exposed Pad
• Supplier Device Package: 8-DFN (2x3)

Paket: 8-VFDFN Exposed Pad

MCP6002-I/SN

Microchip Technology

IC OPAMP GP 1MHZ RRO 8SOIC

• Amplifier Type: General Purpose
• Number of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 0.6 V/µs
• Gain Bandwidth Product: 1MHz
• -3db Bandwidth: -
• Current - Input Bias: 1pA
• Voltage - Input Offset: 4.5mV
• Current - Supply: 100µA
• Current - Output / Channel: 23mA
• Voltage - Supply, Single/Dual (±): 1.8 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

Paket: 8-SOIC (0.154", 3.90mm Width)

ATSAM4E8CB-CNR

Microchip Technology

IC MCU 32BIT 512KB FLASH 100BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, Ethernet, IrDA, MMC/SD, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 79
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 16x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-UFBGA
• Supplier Device Package: 100-TFBGA (9x9)

Paket: 100-UFBGA

PIC16LF1939-E/MV

Microchip Technology

IC MCU 8BIT 28KB FLASH 40UQFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 28KB (16K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 14x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 40-UFQFN Exposed Pad
• Supplier Device Package: 40-UQFN (5x5)

Paket: 40-UFQFN Exposed Pad

PIC18F44J10-I/P

Microchip Technology

IC MCU 8BIT 16KB FLASH 40DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-PDIP

Paket: 40-DIP (0.600", 15.24mm)

PIC16F1764-I/P

Microchip Technology

IC MCU 8BIT 7KB FLASH 14DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 8x10b, D/A 1x5b, 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-PDIP

Paket: 14-DIP (0.300", 7.62mm)

ATXMEGA128A1-C7U

Microchip Technology

IC MCU 8BIT 128KB FLASH 100VFBGA

• Core Processor: AVR
• Core Size: 8/16-Bit
• Speed: 32MHz
• Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 78
• Program Memory Size: 128KB (64K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.6 V ~ 3.6 V
• Data Converters: A/D 16x12b, D/A 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-VFBGA
• Supplier Device Package: 100-VFBGA (7x7)

Paket: 100-VFBGA

MCP3304T-CI/SL

Microchip Technology

IC ADC 13BIT 2.7V 4CH SPI 16SOIC

• Number of Bits: 13
• Sampling Rate (Per Second): 100k
• Number of Inputs: 4, 8
• Input Type: Differential, Single Ended
• Data Interface: SPI
• Configuration: MUX-S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: SAR
• Reference Type: External
• Voltage - Supply, Analog: 5V
• Voltage - Supply, Digital: 5V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SOIC
• Mounting Type: -

Paket: 16-SOIC (0.154", 3.90mm Width)

DSPIC33CH128MP505T-I/M4

Microchip Technology

16 BIT DSC DUAL CORE 128K FLASH

• Core Processor: dsPIC
• Core Size: 16-Bit Dual-Core
• Speed: 180MHz, 200MHz
• Connectivity: CANbus, I²C, IrDA, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
• Number of I/O: 39
• Program Memory Size: 152KB (152K x 8)
• Program Memory Type: FLASH/PRAM
• EEPROM Size: -
• RAM Size: 20K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 31x12b, D/A 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-UFQFN Exposed Pad
• Supplier Device Package: 48-UQFN (6x6)

Paket: 48-UFQFN Exposed Pad

RE46C194S16T

Microchip Technology

3V E-CAL PHOTO S.D. IC

• Type: -
• Input Type: -
• Output Type: -
• Interface: -
• Current - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

DSPIC33EV128GM004-E/P8

Microchip Technology

16 BIT 5V DSC 128KB ECC FLASH 4K

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CANbus, I²C, IrDA, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
• Data Converters: A/D 24x10/12b; D/A 1x7b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP (7x7)

Paket: 48-TQFP

PL701-04SC-R

Microchip Technology

IC CLOCK MULTIPLEXER

• Type: -
• PLL: -
• Input: -
• Output: -
• Number of Circuits: -
• Ratio - Input:Output: -
• Differential - Input:Output: -
• Frequency - Max: -
• Divider/Multiplier: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

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JANS1N5804-TR

Microchip Technology

DIODE GEN PURP 100V 2A A AXIAL

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 100 V
• Current - Average Rectified (Io): 2A
• Voltage - Forward (Vf) (Max) @ If: 975 mV @ 2.5 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 25 ns
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: A, Axial
• Supplier Device Package: A, Axial
• Operating Temperature - Junction: -65°C ~ 175°C

Paket: -

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UM6201A

Microchip Technology

SI PPIN HERMETIC SEAL

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 100V
• Current - Max: -
• Capacitance @ Vr, F: 1.1pF @ 100V, 1MHz
• Resistance @ If, F: 400mOhm @ 100mA, 100MHz
• Power Dissipation (Max): 6 W
• Operating Temperature: -
• Package / Case: Axial
• Supplier Device Package: Axial

Paket: -

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JAN1N6940UTK3CS

Microchip Technology

DIODE SCHOTTKY 15V 150A THINKEY3

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 15 V
• Current - Average Rectified (Io): 150A
• Voltage - Forward (Vf) (Max) @ If: 500 mV @ 150 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 5 mA @ 15 V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: ThinKey™3
• Supplier Device Package: ThinKey™3
• Operating Temperature - Junction: -65°C ~ 175°C

Paket: -

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1N5542A

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 24 V
• Tolerance: ±10%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: 10 nA @ 20 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

Paket: -

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JANKCA1N914

Microchip Technology

DIODE GEN PURP 75V 200MA DO35

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 75 V
• Current - Average Rectified (Io): 200mA
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 50 mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 5 ns
• Current - Reverse Leakage @ Vr: 500 nA @ 75 V
• Capacitance @ Vr, F: 4pF @ 0V, 1MHz
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)
• Operating Temperature - Junction: -65°C ~ 175°C

Paket: -

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MSR2N2907AUA-TR

Microchip Technology

RH SMALL-SIGNAL BJT

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 600 mA
• Voltage - Collector Emitter Breakdown (Max): 60 V
• Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
• Current - Collector Cutoff (Max): 50nA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
• Power - Max: 500 mW
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Supplier Device Package: UA

Paket: -

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PIC18F14Q41-E-SS

Microchip Technology

IC MCU 8BIT 16KB FLASH 20SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I2C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 17x12b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

Paket: -

1N5228BUR-1

Microchip Technology

DIODE ZENER

• Voltage - Zener (Nom) (Vz): 3.9 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 23 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

Paket: -

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1N936AE3-TR

Microchip Technology

TEMPERATURE COMPENSATED

• Voltage - Zener (Nom) (Vz): 9 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 6 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AA, DO-7, Axial
• Supplier Device Package: DO-7

Paket: -

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