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NXP |
FET RF 65V 2.17GHZ NI-780S
- Transistor Type: LDMOS
- Frequency: 2.17GHz
- Gain: 17.3dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 1.1A
- Power - Output: 33W
- Voltage - Rated: 65V
- Package / Case: NI-780S
- Supplier Device Package: NI-780S
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Paket: NI-780S |
Lager5.504 |
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NXP |
FET RF 68V 2.66GHZ NI-780
- Transistor Type: LDMOS
- Frequency: 2.66GHz
- Gain: 15.5dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 900mA
- Power - Output: 20W
- Voltage - Rated: 68V
- Package / Case: NI-780
- Supplier Device Package: NI-780
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Paket: NI-780 |
Lager3.280 |
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NXP |
FET RF 68V 1.93GHZ TO270-4
- Transistor Type: LDMOS
- Frequency: 1.93GHz
- Gain: 16dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 610mA
- Power - Output: 12W
- Voltage - Rated: 68V
- Package / Case: TO-270AB
- Supplier Device Package: TO-270 WB-4
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Paket: TO-270AB |
Lager5.248 |
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NXP |
TRANS RF NPN LO NOISE SOT-343
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 6.5V
- Frequency - Transition: 15GHz
- Noise Figure (dB Typ @ f): 0.8dB ~ 1.1dB @ 900MHz ~ 1.9GHz
- Gain: 15dB ~ 22dB
- Power - Max: 188mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 2V
- Current - Collector (Ic) (Max): 20mA
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-82A, SOT-343
- Supplier Device Package: SOT-343
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Paket: SC-82A, SOT-343 |
Lager4.192 |
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NXP |
TRANSISTOR NPN UHF 50MA SOT23
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 10V
- Frequency - Transition: 8GHz
- Noise Figure (dB Typ @ f): 1.4dB ~ 2dB @ 1GHz ~ 2GHz
- Gain: -
- Power - Max: 360mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 5mA, 6V
- Current - Collector (Ic) (Max): 50mA
- Operating Temperature: 175°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: TO-236AB (SOT23)
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Paket: TO-236-3, SC-59, SOT-23-3 |
Lager3.520 |
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NXP |
DIODE ZENER 9.1V 220MW SMT3
- Voltage - Zener (Nom) (Vz): 9.1V
- Tolerance: ±2%
- Power - Max: 220mW
- Impedance (Max) (Zzt): 10 Ohms
- Current - Reverse Leakage @ Vr: 500nA @ 6V
- Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Paket: TO-236-3, SC-59, SOT-23-3 |
Lager7.472 |
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NXP |
IC REG LINEAR 1.8V 1A SOT223
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 20V
- Voltage - Output (Min/Fixed): 1.8V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 1.2V @ 800mA
- Current - Output: 1A
- Current - Quiescent (Iq): -
- Current - Supply (Max): 6mA
- PSRR: 68dB (120Hz)
- Control Features: -
- Protection Features: Over Current, Over Temperature
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: TO-261-4, TO-261AA
- Supplier Device Package: SOT-223
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Paket: TO-261-4, TO-261AA |
Lager7.536 |
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NXP |
IC POWER MANAGEMENT 48QFN
- Applications: Processor
- Current - Supply: -
- Voltage - Supply: 2.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 105°C
- Mounting Type: Surface Mount
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
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Paket: 48-VFQFN Exposed Pad |
Lager6.864 |
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NXP |
IC SWITCH HI/LO SIDE 16B 32-SOIC
- Switch Type: General Purpose
- Number of Outputs: 8
- Ratio - Input:Output: 1:8
- Output Configuration: High Side or Low Side
- Output Type: N-Channel
- Interface: SPI
- Voltage - Load: 5.5 V ~ 26.5 V
- Voltage - Supply (Vcc/Vdd): 3.1 V ~ 5.5 V
- Current - Output (Max): 600mA
- Rds On (Typ): 750 mOhm
- Input Type: -
- Features: -
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
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Paket: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Lager27.456 |
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NXP |
IC GATE NAND 4CH 2-INP 14-SO
- Logic Type: NAND Gate
- Number of Circuits: 4
- Number of Inputs: 2
- Features: Open Drain
- Voltage - Supply: 2 V ~ 6 V
- Current - Quiescent (Max): 2µA
- Current - Output High, Low: -, 5.2mA
- Logic Level - Low: 0.5 V ~ 1.8 V
- Logic Level - High: 1.5 V ~ 4.2 V
- Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-SO
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
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Paket: 14-SOIC (0.154", 3.90mm Width) |
Lager3.488 |
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NXP |
IC GATE NOR 3CH 3-INP 14-DIP
- Logic Type: NOR Gate
- Number of Circuits: 3
- Number of Inputs: 3
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): 2µA
- Current - Output High, Low: 4mA, 4mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Supplier Device Package: 14-DIP
- Package / Case: 14-DIP (0.300", 7.62mm)
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Paket: 14-DIP (0.300", 7.62mm) |
Lager5.888 |
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NXP |
IC D-TYPE POS TRG SNGL 20TSSOP
- Function: Master Reset
- Type: D-Type
- Output Type: Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 150MHz
- Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.7 V ~ 3.6 V
- Current - Quiescent (Iq): 190µA
- Input Capacitance: 4pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
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Paket: 20-TSSOP (0.173", 4.40mm Width) |
Lager2.800 |
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NXP |
IC SWITCH QUAD SPST 14DIP
- Switch Circuit: SPST - NO
- Multiplexer/Demultiplexer Circuit: 1:1
- Number of Circuits: 2
- On-State Resistance (Max): 95 Ohm
- Channel-to-Channel Matching (ΔRon): 5 Ohm
- Voltage - Supply, Single (V+): 4.5 V ~ 5.5 V
- Voltage - Supply, Dual (V±): -
- Switch Time (Ton, Toff) (Max): 30ns, 44ns
- -3db Bandwidth: 200MHz
- Charge Injection: -
- Channel Capacitance (CS(off), CD(off)): 3.5pF
- Current - Leakage (IS(off)) (Max): 1µA
- Crosstalk: -60dB @ 1MHz
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 14-DIP (0.300", 7.62mm)
- Supplier Device Package: 14-DIP
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Paket: 14-DIP (0.300", 7.62mm) |
Lager3.568 |
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NXP |
IC MPU MPC82XX 300MHZ 516BGA
- Core Processor: PowerPC G2_LE
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 300MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
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Paket: 516-BBGA |
Lager3.504 |
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NXP |
IC MPU M683XX 33MHZ 357BGA
- Core Processor: CPU32+
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 33MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Paket: 357-BBGA |
Lager5.712 |
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NXP |
IC MPU MPC82XX 350MHZ 352TBGA
- Core Processor: PowerPC 603e
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 350MHz
- Co-Processors/DSP: -
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 352-LBGA
- Supplier Device Package: 352-TBGA (35x35)
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Paket: 352-LBGA |
Lager4.896 |
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NXP |
IC MPU MPC8XX 133MHZ 256BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 133MHz
- Co-Processors/DSP: Communications; CPM, Security; SEC
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1), 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: Cryptography
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
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Paket: 256-BBGA |
Lager6.400 |
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NXP |
IC MPU I.MX6S 1.0GHZ 624MAPBGA
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (4)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -20°C ~ 105°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 624-LFBGA
- Supplier Device Package: 624-MAPBGA (21x21)
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Paket: 624-LFBGA |
Lager5.408 |
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NXP |
I.MX 6ULL 800 MHZ INDUSTRIAL
- Core Processor: ARM? Cortex?-A7
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON? MPE
- RAM Controllers: LPDDR2, DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: Electrophoretic, LCD
- Ethernet: 10/100 Mbps (1)
- SATA: -
- USB: USB 2.0 OTG + PHY (2)
- Voltage - I/O: 1.8V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
- Package / Case: 289-LFBGA
- Supplier Device Package: 289-MAPBGA (14x14)
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Paket: 289-LFBGA |
Lager6.672 |
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NXP |
IC MCU 32BIT 8MB FLASH 416BGA
- Core Processor: e200z7
- Core Size: 32-Bit Tri-Core
- Speed: 264MHz
- Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI
- Peripherals: DMA, LVD, POR, Zipwire
- Number of I/O: -
- Program Memory Size: 8MB (8M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 16b Sigma-Delta, eQADC
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 416-BGA
- Supplier Device Package: 416-MAPBGA (27x27)
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Paket: 416-BGA |
Lager3.536 |
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NXP |
IC MCU 8BIT 4KB FLASH 16TSSOP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: -
- Peripherals: LVD, POR, PWM
- Number of I/O: 13
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 6x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Paket: 16-TSSOP (0.173", 4.40mm Width) |
Lager153.444 |
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NXP |
IC MCU 8BIT 1.5KB FLASH 16SOIC
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: -
- Peripherals: LVD, POR, PWM
- Number of I/O: 13
- Program Memory Size: 1.5KB (1.5K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 6x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 16-SOIC
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Paket: 16-SOIC (0.295", 7.50mm Width) |
Lager6.608 |
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NXP |
IC MCU 8BIT 1.5KB FLASH 8DIP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: -
- Peripherals: LVD, POR, PWM
- Number of I/O: 5
- Program Memory Size: 1.5KB (1.5K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 8-DIP (0.300", 7.62mm)
- Supplier Device Package: 8-PDIP
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Paket: 8-DIP (0.300", 7.62mm) |
Lager5.184 |
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NXP |
IC MCU 16BIT 128KB FLASH 80QFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: EBI/EMI, I2C, SCI, SPI
- Peripherals: POR, PWM, WDT
- Number of I/O: 60
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V
- Data Converters: A/D 16x10b; D/A 2x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Paket: 80-QFP |
Lager9.396 |
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NXP |
IC MCU 32BIT 128KB FLASH 48QFN
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 29
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 11x16b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN-EP (7x7)
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Paket: 48-VFQFN Exposed Pad |
Lager4.976 |
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NXP |
IC MCU 32BIT 4MB FLASH 516MAPBGA
- Core Processor: ARM? Cortex?-A5, -M4, -M0+
- Core Size: 32-Bit Tri-Core
- Speed: 80MHz, 160MHz, 320MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, LIN, SPI
- Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2.3M x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 516-BGA
- Supplier Device Package: 516-MAPBGA (27x27)
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Paket: 516-BGA |
Lager10.728 |
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NXP |
IC PRESSURE SENSOR 32QFN
- Frequency: 315MHz, 434MHz
- Applications: TPM (Tire Pressure Monitor)
- Modulation or Protocol: FSK, OOK
- Data Rate (Max): -
- Power - Output: -
- Current - Transmitting: -
- Data Interface: PCB, Surface Mount
- Antenna Connector: PCB, Surface Mount
- Memory Size: 8kB Flash, 512B SRAM
- Features: -
- Voltage - Supply: 2.3 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 32-QFN Exposed Pad
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Paket: 32-QFN Exposed Pad |
Lager5.724 |
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NXP |
TOWER SYSTEM KIT
- Type: Transceiver; 802.15.4
- Frequency: 2.4GHz
- For Use With/Related Products: KW2x
- Supplied Contents: Board, Cable
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Paket: - |
Lager5.508 |
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NXP |
32 BITDUAL CORE3M FLASH384 RA
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 178
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPPBGA (17x17)
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Paket: 256-LBGA |
Lager5.936 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 121
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 80K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 15x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Paket: 144-LQFP |
Lager7.248 |
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