NXP Produkte

2N7002K,215

NXP

MOSFET N-CH 60V 340MA SOT23

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 60V
• Current - Continuous Drain (Id) @ 25°C: 340mA (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 40pF @ 10V
• Vgs (Max): ±15V
• FET Feature: -
• Power Dissipation (Max): 830mW (Ta)
• Rds On (Max) @ Id, Vgs: 3.9 Ohm @ 500mA, 10V
• Operating Temperature: -65°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: TO-236AB (SOT23)
• Package / Case: TO-236-3, SC-59, SOT-23-3

Paket: TO-236-3, SC-59, SOT-23-3

PZM10NB,115

NXP

DIODE ZENER 10V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 10V
• Tolerance: ±5%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 200nA @ 7V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

Paket: TO-236-3, SC-59, SOT-23-3

UBA2035TS/N1,118

NXP

IC DVR HF FULL BRIDGE 28-SSOP

• Type: HID Lamp Controller
• Frequency: 100kHz
• Voltage - Supply: 10.5 V ~ 13.5 V
• Current - Supply: 500µA
• Current - Output Source/Sink: -
• Dimming: No
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

Paket: 28-SSOP (0.209", 5.30mm Width)

PCA9551BSHP

NXP

IC LED DRVR PS DIM 25MA 16HVQFN

• Type: Power Switch
• Topology: -
• Internal Switch(s): Yes
• Number of Outputs: 8
• Voltage - Supply (Min): 2.3V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: -
• Current - Output / Channel: 25mA
• Frequency: -
• Dimming: PWM
• Applications: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-VQFN Exposed Pad
• Supplier Device Package: 16-HVQFN (4x4)

Paket: 16-VQFN Exposed Pad

74LVTH574DB,112

NXP

IC D-TYPE POS TRG SNGL 20SSOP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 150MHz
• Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Iq): 190µA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)

Paket: 20-SSOP (0.209", 5.30mm Width)

74LVC241AD,112

NXP

IC BUFF/DVR TRI-ST DUAL 20SOIC

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

Paket: 20-SOIC (0.295", 7.50mm Width)

SC26C92A1A,529

NXP

IC DUART 44PLCC

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 2, DUART
• FIFO's: 8 Byte
• Protocol: -
• Data Rate (Max): 1Mbps
• Voltage - Supply: 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

Paket: 44-LCC (J-Lead)

USB2SERA10CFK

NXP

IC CONTROLLER USB 24QFN

• Protocol: USB
• Function: Bridge, USB to UART
• Interface: UART
• Standards: USB 2.0
• Voltage - Supply: 2.7 V ~ 5.5 V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 24-VQFN Exposed Pad
• Supplier Device Package: 24-QFN-EP (5x5)

Paket: 24-VQFN Exposed Pad

PTN5100ABSMP

NXP

IC USB PD PHY TYPE C 20HVQFN

• Protocol: USB
• Function: Controller
• Interface: USB
• Standards: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-HVQFN (4x4)

Paket: 20-VFQFN Exposed Pad

MPC8544VTARJ

NXP

IC MPU MPC85XX 1.067GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.067GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Paket: 783-BBGA, FCBGA

MC68LC060ZU75

NXP

IC MPU M680X0 75MHZ 304TBGA

• Core Processor: 68060
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 75MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 304-LBGA
• Supplier Device Package: 304-TBGA (31x31)

Paket: 304-LBGA

MC68MH360ZP33L

NXP

IC MPU M683XX 33MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 33MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 357-BGA
• Supplier Device Package: 357-PBGA (25x25)

Paket: 357-BGA

MCIMX6D6AVT10AC

NXP

IC MPU I.MX6D 1.0GHZ 624FCBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-FBGA, FCBGA
• Supplier Device Package: 624-FCBGA (21x21)

Paket: 624-FBGA, FCBGA

MC9328MXLVP15R2

NXP

IC MPU I.MXL 150MHZ 225MAPBGA

• Core Processor: ARM920T
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 150MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: LCD
• Ethernet: -
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 3.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 225-LFBGA
• Supplier Device Package: 225-MAPBGA (13x13)

Paket: 225-LFBGA

MC68HSC705J1ACPE

NXP

IC MCU 8BIT 1.2KB OTP 20DIP

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 14
• Program Memory Size: 1.2KB (1.2K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 64 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

Paket: 20-DIP (0.300", 7.62mm)

MC68HC908JK1CDW

NXP

IC MCU 8BIT 1.5KB FLASH 20SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 15
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
• Data Converters: A/D 12x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

Paket: 20-SOIC (0.295", 7.50mm Width)

S912XEQ512F1MAG

NXP

IC MCU 16BIT 512KB FLASH 144LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Paket: 144-LQFP

LPC11E68JBD48E

NXP

IC MCU 32BIT 256KB FLASH 48LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 36K x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Paket: 48-LQFP

MC56F82743VFM

NXP

IC MCU 32BIT 64KB FLASH 32QFN

• Core Processor: 56800EX
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 16
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 6x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

Paket: 32-VFQFN Exposed Pad

MKE04Z128VLD4

NXP

IC MCU 32BIT 128KB FLASH 44LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: LVD, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b, D/A 2x6b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

Paket: 44-LQFP

MRB-KW019032EU

NXP

DEV TOOL FOR KW SERIES MCU

• Type: Transceiver; 802.15.4
• Frequency: -
• For Use With/Related Products: KW0x
• Supplied Contents: Board

Paket: -

MIMXRT1052DVJ6B

NXP

I.MXRT1052 MPU 196MAPBGA

• Core Processor: ARM® Cortex®-M7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 600MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: Yes
• Display & Interface Controllers: LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.8V, 3.3V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: BEE, DCP, HAB, SJC, SNVS, TRNG
• Package / Case: 196-LFBGA
• Supplier Device Package: 196-MAPBGA (12x12)

Paket: 196-LFBGA

LPC54616J512BD100E

NXP

32-BIT ARM CORTEX-M4

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 16K x 8
• RAM Size: 200K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

Paket: 100-LQFP

SP5748GSK0AVMJ2R

NXP

TRIPLE CORE, 6M FLASH

• Core Processor: e200z2, e200z4, e200z4
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz/160MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 178
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

Paket: 256-LBGA

S9S08RN16W2MTJR

NXP

8-BIT MCU S08 CORE 16KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

Paket: 20-TSSOP (0.173", 4.40mm Width)

BAV103-S500-115

NXP

DIODE SWITCHING SOD80C

• Diode Type: -
• Voltage - DC Reverse (Vr) (Max): -
• Current - Average Rectified (Io): -
• Voltage - Forward (Vf) (Max) @ If: -
• Speed: -
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -
• Operating Temperature - Junction: -

Paket: -

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LPC11U36FBD64-40EL

NXP

IC MCU 32BIT 96KB FLASH 64LQFP

• Core Processor: ARM® Cortex®-M0
• Core Size: 32-Bit Dual-Core
• Speed: 50MHz
• Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 54
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 10K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 8x10b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Paket: -

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MPF5024AVNA0ESR2

NXP

PF5024

• Applications: High Performance i.MX 8 Processor Based
• Current - Supply: -
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)

Paket: -

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PCA2000U-10AC-1-00

NXP

IC WATCH CIRCUIT WAFER

• Type: Watch Circuit
• Applications: Wrist Watches
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Wafer

Paket: -

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MPF7100BVMA0ESR2

NXP

POWER MANAGEMENT IC, I.MX 8, I.M

• Applications: i.MX Processors
• Current - Supply: 10µA
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

Paket: -

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