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NXP |
MOSFET N-CH 60V 200A D2PAK-7
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 60V
- Current - Continuous Drain (Id) @ 25°C: -
- Drive Voltage (Max Rds On, Min Rds On): -
- Vgs(th) (Max) @ Id: -
- Gate Charge (Qg) (Max) @ Vgs: -
- Input Capacitance (Ciss) (Max) @ Vds: -
- Vgs (Max): -
- FET Feature: -
- Power Dissipation (Max): -
- Rds On (Max) @ Id, Vgs: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Supplier Device Package: 7-DDPAK
- Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB
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Paket: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB |
Lager2.944 |
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NXP |
MOSFET N-CH 30V 5.4A SOT-23
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 30V
- Current - Continuous Drain (Id) @ 25°C: 5.4A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 9.4nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 350pF @ 30V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 280mW (Tj)
- Rds On (Max) @ Id, Vgs: 42 mOhm @ 2A, 10V
- Operating Temperature: -55°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: TO-236AB (SOT23)
- Package / Case: TO-236-3, SC-59, SOT-23-3
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Paket: TO-236-3, SC-59, SOT-23-3 |
Lager6.976 |
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NXP |
FET RF 2CH 133V 230MHZ TO-270
- Transistor Type: LDMOS (Dual)
- Frequency: 230MHz
- Gain: 27dB
- Voltage - Test: 50V
- Current Rating: -
- Noise Figure: -
- Current - Test: 100mA
- Power - Output: 300W
- Voltage - Rated: 133V
- Package / Case: TO-270AB
- Supplier Device Package: TO-270 WB-4
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Paket: TO-270AB |
Lager4.528 |
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NXP |
FET RF 40V 470MHZ TO272-8
- Transistor Type: LDMOS
- Frequency: 470MHz
- Gain: 11.5dB
- Voltage - Test: 12.5V
- Current Rating: -
- Noise Figure: -
- Current - Test: 800mA
- Power - Output: 70W
- Voltage - Rated: 40V
- Package / Case: TO-272-8
- Supplier Device Package: TO-272-8 Flat Lead
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Paket: TO-272-8 |
Lager7.440 |
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NXP |
IC POWER MANAGEMENT 56-QFN
- Applications: Processor
- Current - Supply: 86mA
- Voltage - Supply: 2.7 V ~ 5.5 V
- Operating Temperature: -20°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 56-QFN
- Supplier Device Package: 56-QFN-EP (7x7)
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Paket: 56-QFN |
Lager4.528 |
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NXP |
IC SW SERIAL OCTAL 32SOIC
- Switch Type: General Purpose
- Number of Outputs: 8
- Ratio - Input:Output: 1:4
- Output Configuration: High Side or Low Side
- Output Type: N-Channel
- Interface: SPI
- Voltage - Load: 5.5 V ~ 27.5 V
- Voltage - Supply (Vcc/Vdd): 3.1 V ~ 5.5 V
- Current - Output (Max): 600mA
- Rds On (Typ): 750 mOhm
- Input Type: -
- Features: -
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
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Paket: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Lager166.398 |
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NXP |
IC MULTIVIBRATOR DUAL MONO 16DIP
- Logic Type: Monostable
- Independent Circuits: 2
- Schmitt Trigger Input: No
- Propagation Delay: 20ns
- Current - Output High, Low: 5.2mA, 5.2mA
- Voltage - Supply: 2 V ~ 6 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Paket: 16-DIP (0.300", 7.62mm) |
Lager4.912 |
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NXP |
IC C2K 900MHZ 8CH VOIP 625FCBGA
- Function: -
- Interface: -
- Number of Circuits: -
- Voltage - Supply: -
- Current - Supply: -
- Power (Watts): -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Paket: - |
Lager4.016 |
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NXP |
IC I2C SWITCH 8CH 24SOIC
- Applications: Translating Switch
- Interface: I2C, SMBus
- Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
- Package / Case: 24-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 24-SO
- Mounting Type: Surface Mount
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Paket: 24-SOIC (0.295", 7.50mm Width) |
Lager7.328 |
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NXP |
IC MPU I.MX23 454MHZ 169MAPBGA
- Core Processor: ARM926EJ-S
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 454MHz
- Co-Processors/DSP: Data; DCP
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: LCD, Touchscreen
- Ethernet: -
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: Cryptography, Hardware ID
- Package / Case: 169-LFBGA
- Supplier Device Package: 169-MAPBGA (11x11)
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Paket: 169-LFBGA |
Lager7.088 |
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NXP |
IC MPU MPC83XX 667MHZ 740TBGA
- Core Processor: PowerPC e300
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 740-LBGA
- Supplier Device Package: 740-TBGA (37.5x37.5)
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Paket: 740-LBGA |
Lager3.888 |
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NXP |
IC MPU M683XX 25MHZ 240FQFP
- Core Processor: CPU32+
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 25MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 240-BFQFP
- Supplier Device Package: 240-FQFP (32x32)
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Paket: 240-BFQFP |
Lager6.708 |
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NXP |
IC MCU 32BIT 512KB FLASH 80LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 52
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 27x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (12x12)
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Paket: 80-LQFP |
Lager8.904 |
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NXP |
IC MCU 32BIT 32KB FLASH 33HVQFN
- Core Processor: ARM? Cortex?-M3
- Core Size: 32-Bit
- Speed: 72MHz
- Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Number of I/O: 28
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 32-VQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (7x7)
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Paket: 32-VQFN Exposed Pad |
Lager6.264 |
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NXP |
IC MCU 32BIT 128KB FLASH 48LQFP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O: 34
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 20K x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Paket: 48-LQFP |
Lager21.408 |
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NXP |
IC VIDEO DAC 10BIT TRIPLE 48LQFP
- Number of Bits: 10
- Number of D/A Converters: 3
- Settling Time: -
- Output Type: Current - Unbuffered
- Differential Output: Yes
- Data Interface: Parallel
- Reference Type: Internal
- Voltage - Supply, Analog: 3 V ~ 3.6 V
- Voltage - Supply, Digital: 3 V ~ 3.6 V
- INL/DNL (LSB): ±1.8 (Max), ±0.9 (Max)
- Architecture: String DAC
- Operating Temperature: 0°C ~ 70°C
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
- Mounting Type: -
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Paket: 48-LQFP |
Lager3.088 |
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NXP |
TVS DIODE 4CSP
- Type: Steering (Rail to Rail)
- Unidirectional Channels: 2
- Bidirectional Channels: -
- Voltage - Reverse Standoff (Typ): -
- Voltage - Breakdown (Min): -
- Voltage - Clamping (Max) @ Ipp: -
- Current - Peak Pulse (10/1000µs): -
- Power - Peak Pulse: -
- Power Line Protection: -
- Applications: General Purpose
- Capacitance @ Frequency: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 4-WFBGA, WLCSP
- Supplier Device Package: 4-CSP
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Paket: 4-WFBGA, WLCSP |
Lager4.302 |
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NXP |
IC IMMOBIL BASESTATION 20HTSSOP
- Type: -
- Frequency: -
- Standards: -
- Interface: -
- Voltage - Supply: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Paket: - |
Lager3.420 |
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NXP |
IC RF TRANSMITTER UHF 14-TSSOP
- Frequency: 315 ~ 434MHz, 868 ~ 928MHz
- Applications: General Data Transfer
- Modulation or Protocol: FSK, OOK
- Data Rate (Max): 10 kbps
- Power - Output: -3dBm
- Current - Transmitting: 11.6mA
- Data Interface: PCB, Surface Mount
- Antenna Connector: PCB, Surface Mount
- Memory Size: -
- Features: -
- Voltage - Supply: 1.9 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
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Paket: 14-TSSOP (0.173", 4.40mm Width) |
Lager6.102 |
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NXP |
IC TUNER CAR RADIO 80LQFP
- Frequency: -
- Sensitivity: -
- Data Rate (Max): -
- Modulation or Protocol: AM, FM, WB
- Applications: AM/FM Radio Receiver
- Current - Receiving: -
- Data Interface: PCB, Surface Mount
- Memory Size: -
- Antenna Connector: PCB, Surface Mount
- Features: -
- Voltage - Supply: 5V, 8.5V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (12x12)
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Paket: 80-LQFP |
Lager5.292 |
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NXP |
I.MX 6DL ROM PERF ENHAN
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (4)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: 0°C ~ 95°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 624-LFBGA
- Supplier Device Package: 624-MAPBGA (21x21)
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Paket: 624-LFBGA |
Lager6.160 |
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NXP |
I.MX6 SOLO MAPBGA 800 MHZ
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (4)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 624-LFBGA
- Supplier Device Package: 624-MAPBGA (21x21)
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Paket: 624-LFBGA |
Lager4.448 |
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NXP |
I.MX6SX ROM PERF ENHAN
- Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 200MHz, 800MHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Package / Case: 400-LFBGA
- Supplier Device Package: 400-MAPBGA (17x17)
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Paket: 400-LFBGA |
Lager3.904 |
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NXP |
16-BIT MCU S12X CORE 512KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 119
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Paket: 144-LQFP |
Lager7.840 |
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NXP |
NXP 32-BIT MCU DUAL POWER ARCH
- Core Processor: e200z4d, e200z0h
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/120MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 177
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 33x10b, 10x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 208-LQFP
- Supplier Device Package: 208-TQFP (28x28)
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Paket: 208-LQFP |
Lager5.504 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 79
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 28x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Paket: 100-LQFP |
Lager3.456 |
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NXP |
16-BIT MCU S12X CORE 128KB FLA
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 50MHz
- Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 59
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 8x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 80-QFP
- Supplier Device Package: 80-QFP (14x14)
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Paket: 80-QFP |
Lager5.088 |
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NXP |
8-BIT MCU S08 CORE 60KB FLASH
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 53
- Program Memory Size: 60KB (60K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Paket: 64-LQFP |
Lager6.496 |
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NXP |
NX30P0121, HIGH-VOLTAGE BACK-TO-
- Switch Type: General Purpose
- Number of Outputs: 1
- Ratio - Input:Output: 1:1
- Output Configuration: -
- Output Type: N-Channel
- Interface: -
- Voltage - Load: 2.5V ~ 20V
- Voltage - Supply (Vcc/Vdd): Not Required
- Current - Output (Max): 3A
- Rds On (Typ): 54mOhm
- Input Type: -
- Features: -
- Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 12-UFBGA, WLCSP
- Supplier Device Package: 12-WLCSP (1.65x1.25)
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Paket: 12-UFBGA, WLCSP |
Lager95.028 |
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NXP |
IC MPU POWERQUICC II PRO 516PBGA
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: 516-BBGA Exposed Pad
- Supplier Device Package: 516-TEPBGA (27x27)
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Paket: 516-BBGA Exposed Pad |
Lager2.176 |
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