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NXP Produkte

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BLF6G27LS-50BN,112
NXP

TRANSISTOR RF PWR LDMOS SOT1112B

  • Transistor Type: LDMOS (Dual)
  • Frequency: 2.5GHz ~ 2.7GHz
  • Gain: 16.5dB
  • Voltage - Test: 28V
  • Current Rating: 12A
  • Noise Figure: -
  • Current - Test: 430mA
  • Power - Output: 3W
  • Voltage - Rated: 65V
  • Package / Case: SOT-1112B
  • Supplier Device Package: CDFM6
Paket: SOT-1112B
Lager3.568
MRF7S19100NR1
NXP

FET RF 65V 1.99GHZ TO270-4

  • Transistor Type: LDMOS
  • Frequency: 1.93GHz ~ 1.99GHz
  • Gain: 17.5dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 1A
  • Power - Output: 29W
  • Voltage - Rated: 65V
  • Package / Case: TO-270AB
  • Supplier Device Package: TO-270 WB-4
Paket: TO-270AB
Lager3.248
PBLS1504V,115
NXP

TRANS NPN PREBIAS/PNP SOT666

  • Transistor Type: 1 NPN Pre-Biased, 1 PNP
  • Current - Collector (Ic) (Max): 100mA, 500mA
  • Voltage - Collector Emitter Breakdown (Max): 50V, 15V
  • Resistor - Base (R1) (Ohms): 22k
  • Resistor - Emitter Base (R2) (Ohms): 22k
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 150 @ 100mA, 2V
  • Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA
  • Current - Collector Cutoff (Max): 1µA, 100nA
  • Frequency - Transition: 280MHz
  • Power - Max: 300mW
  • Mounting Type: Surface Mount
  • Package / Case: SOT-563, SOT-666
  • Supplier Device Package: SOT-666
Paket: SOT-563, SOT-666
Lager4.224
PZM13NB2,115
NXP

DIODE ZENER 13V 300MW SMT3

  • Voltage - Zener (Nom) (Vz): 13V
  • Tolerance: ±2%
  • Power - Max: 300mW
  • Impedance (Max) (Zzt): 10 Ohms
  • Current - Reverse Leakage @ Vr: 100nA @ 10V
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
Paket: TO-236-3, SC-59, SOT-23-3
Lager4.608
MMPF0100F4ANES
NXP

IC PWR MGMT I.MX6 56QFN

  • Applications: Converter, i.MX6
  • Voltage - Input: 2.8 V ~ 4.5 V
  • Number of Outputs: 12
  • Voltage - Output: Multiple
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN (8x8)
Paket: 56-VFQFN Exposed Pad
Lager3.008
N74F161AD,602
NXP

IC COUNTER 4BIT BINARY 16SOIC

  • Logic Type: Binary Counter
  • Direction: Up
  • Number of Elements: 1
  • Number of Bits per Element: 4
  • Reset: Asynchronous
  • Timing: Synchronous
  • Count Rate: 130MHz
  • Trigger Type: Positive Edge
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
Paket: 16-SOIC (0.154", 3.90mm Width)
Lager5.472
74LVCH16245ABQ,518
NXP

TXRX 16BIT NON-INV 3ST 60HUQFN

  • Logic Type: Transceiver, Non-Inverting
  • Number of Elements: 2
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 24mA, 24mA
  • Voltage - Supply: 1.2 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 60-UFQFN Dual Rows, Exposed Pad
  • Supplier Device Package: 60-HUQFN (4x6)
Paket: 60-UFQFN Dual Rows, Exposed Pad
Lager3.424
TDA18271HD/C2,557
NXP

IC TV SILICON TUNER 64-HLQFN

  • Type: Silicon Tuner
  • Applications: Set-Top Boxes
  • Mounting Type: Surface Mount
  • Package / Case: 64-LFQFN Exposed Pad
  • Supplier Device Package: 64-HLFQFN (9x9)
Paket: 64-LFQFN Exposed Pad
Lager4.368
MCZ33903CS3EK
NXP

IC SBC CAN HS 3.3V 32SOIC

  • Applications: System Basis Chip
  • Interface: CAN, LIN
  • Voltage - Supply: 5.5 V ~ 28 V
  • Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC EP
  • Mounting Type: Surface Mount
Paket: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Lager6.368
MCZ33904C5EKR2
NXP

IC SBC CAN HS 5.0V 32SOIC

  • Applications: System Basis Chip
  • Interface: CAN
  • Voltage - Supply: 5.5 V ~ 28 V
  • Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC EP
  • Mounting Type: Surface Mount
Paket: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Lager6.016
TDA8034AT/C1,118
NXP

IC SMART CARD INTERFACE 16SOIC

  • Applications: -
  • Interface: Analog
  • Voltage - Supply: 3V, 5V
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
  • Mounting Type: Surface Mount
Paket: 16-SOIC (0.154", 3.90mm Width)
Lager2.112
PCA9556PW,112
NXP

IC I/O EXPANDER I2C 8B 16TSSOP

  • Number of I/O: 8
  • Interface: I2C, SMBus
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Open Drain, Push-Pull
  • Current - Output Source/Sink: 10mA, 20mA
  • Clock Frequency: 100kHz
  • Voltage - Supply: 3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
Paket: 16-TSSOP (0.173", 4.40mm Width)
Lager25.716
PPC8306VMADDCA
NXP

IC MPU MPC83XX 266MHZ 369BGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 369-LFBGA
  • Supplier Device Package: 369-PBGA (19x19)
Paket: 369-LFBGA
Lager5.184
hot P4080PSE1MZA
NXP

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

  • Core Processor: PowerPC e500mc
  • Number of Cores/Bus Width: 8 Core, 32-Bit
  • Speed: 1.5GHz
  • Co-Processors/DSP: Security; SEC 4.0
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1 Gbps (8), 10 Gbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
  • Package / Case: 1295-BBGA, FCBGA
  • Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Paket: 1295-BBGA, FCBGA
Lager10.704
MC68EN302CAG20BT
NXP

IC MPU M683XX 20MHZ 144LQFP

  • Core Processor: M68000
  • Number of Cores/Bus Width: 1 Core, 8/16-Bit
  • Speed: 20MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
Paket: 144-LQFP
Lager6.160
KMPC860PVR66D4
NXP

IC MPU MPC8XX 66MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (4), 10/100 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
Paket: 357-BBGA
Lager3.728
LPC2138FHN64/01,55
NXP

IC MCU 32BIT 512KB FLASH 64HVQFN

  • Core Processor: ARM7?
  • Core Size: 16/32-Bit
  • Speed: 60MHz
  • Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
  • Number of I/O: 47
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 16x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-VFQFN Exposed Pad
  • Supplier Device Package: 64-HVQFN (9x9)
Paket: 64-VFQFN Exposed Pad
Lager7.712
MCF51JF128VLH
NXP

IC MCU 32BIT 128KB FLASH 64LQFP

  • Core Processor: Coldfire V1
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 48
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 17x12b, D/A 1x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
Paket: 64-LQFP
Lager22.104
LPC11U24FHI33/301,
NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

  • Core Processor: ARM? Cortex?-M0
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, POR, WDT
  • Number of I/O: 26
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
Paket: 32-VFQFN Exposed Pad
Lager38.094
hot MPX2200A
NXP

SENSOR ABS PRESS 29PSI MAX

  • Pressure Type: Absolute
  • Operating Pressure: 29.01 PSI (200 kPa)
  • Output Type: Wheatstone Bridge
  • Output: 0 mV ~ 40 mV (10V)
  • Accuracy: ±1%
  • Voltage - Supply: 10 V ~ 16 V
  • Port Size: -
  • Port Style: No Port
  • Features: Temperature Compensated
  • Termination Style: PCB
  • Maximum Pressure: 116.03 PSI (800 kPa)
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 4-SIP Module
  • Supplier Device Package: -
Paket: 4-SIP Module
Lager18.180
hot MMA7455LT
NXP

ACCELEROMETER 2-8G I2C/SPI 14LGA

  • Type: Digital
  • Axis: X, Y, Z
  • Acceleration Range: ±2g, 4g, 8g
  • Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
  • Sensitivity (mV/g): -
  • Bandwidth: 62.5Hz ~ 125Hz
  • Output Type: I2C, SPI
  • Voltage - Supply: 2.4 V ~ 3.6 V
  • Features: Adjustable Bandwidth, Selectable Scale
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 14-VFLGA
  • Supplier Device Package: 14-LGA (3x5)
Paket: 14-VFLGA
Lager5.472
NCF2960VHN/T0B040J
NXP

IC REMOTE KEYLESS ENTRY 24HVQFN

  • Type: -
  • Frequency: -
  • Standards: -
  • Interface: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
Paket: -
Lager5.724
SA616BS,115
NXP

IC MIXER FM IF SYSTEM LV 20HVQFN

  • RF Type: General Purpose
  • Frequency: 150MHz
  • Number of Mixers: 2
  • Gain: 17dB
  • Noise Figure: 6.8dB
  • Secondary Attributes: With Amplifier
  • Current - Supply: 3.5mA
  • Voltage - Supply: 2.7 V ~ 7 V
  • Package / Case: 20-VFQFN Exposed Pad
  • Supplier Device Package: 20-HVQFN (4x4)
Paket: 20-VFQFN Exposed Pad
Lager8.910
MC35FS4501NAE
NXP

FS4500

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
Paket: 48-LQFP Exposed Pad
Lager5.616
S9S12GA240F0VLLR
NXP

16-BIT MCU S12 CORE 240KB FLAS

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CANbus, IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 86
  • Program Memory Size: 240KB (240K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 11K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 16x12b, D/A 2x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
Paket: 100-LQFP
Lager7.248
MFS8631BMBA0ES
NXP

IC FS86 SYSTEM BASIS CHIP ASIL

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 4.5V ~ 36V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
Paket: -
Request a Quote
MC33FS6516NAE
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
Paket: -
Request a Quote
S9S12GN48J0VLH
NXP

S12 CORE,48K FLASH

  • Core Processor: S12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 48KB (48K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1.5K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
Paket: -
Request a Quote