NXP Produkte

PSMN8R5-108ESQ

NXP

MOSFET N-CH 108V 100A I2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 108V
• Current - Continuous Drain (Id) @ 25°C: 100A (Tj)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 111nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 5512pF @ 50V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 263W (Tc)
• Rds On (Max) @ Id, Vgs: 8.5 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: I2PAK
• Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA

Paket: TO-262-3 Long Leads, I2Pak, TO-262AA

BC337-25,126

NXP

TRANS NPN 45V 0.5A TO92

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 500mA
• Voltage - Collector Emitter Breakdown (Max): 45V
• Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
• Power - Max: 625mW
• Frequency - Transition: 100MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

Paket: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

74LV08PW/AUJ

NXP

IC GATE AND 4CH 2-INP 14-TSSOP

• Logic Type: AND Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Max): 20µA
• Current - Output High, Low: 12mA, 12mA
• Logic Level - Low: 0.3 V ~ 0.8 V
• Logic Level - High: 0.9 V ~ 2 V
• Max Propagation Delay @ V, Max CL: 11ns @ 5V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-TSSOP
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)

Paket: 14-TSSOP (0.173", 4.40mm Width)

N74F534D,602

NXP

IC D-TYPE POS TRG SNGL 20SOIC

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 165MHz
• Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 3mA, 24mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 86mA
• Input Capacitance: -
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)

Paket: 20-SOIC (0.295", 7.50mm Width)

74LVC245APW/AUJ

NXP

IC BUS TXRX 3-ST OCTAL 20TSSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

Paket: 20-TSSOP (0.173", 4.40mm Width)

74ABT2244DB,118

NXP

IC BUFF/DVR TRI-ST DUAL 20SSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 12mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

Paket: 20-SSOP (0.209", 5.30mm Width)

N74F07N,602

NXP

IC BUFFER/DRIVER HEX 14DIP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 6
• Number of Bits per Element: 1
• Input Type: -
• Output Type: Open Collector
• Current - Output High, Low: -, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-DIP

Paket: 14-DIP (0.300", 7.62mm)

NX3L1G3157GM-Q100X

NXP

IC ANLG SWITCH SPDT 6XSON

• Switch Circuit: SPDT
• Multiplexer/Demultiplexer Circuit: 2:1
• Number of Circuits: 1
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 20 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 25ns, 10ns
• -3db Bandwidth: 60MHz
• Charge Injection: 15pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT886 (1.45x1)

Paket: 6-XFDFN

MPC8544EVTANGA

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Paket: 783-BBGA, FCBGA

MPC850SRVR66BU

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

Paket: 256-BBGA

MC68060RC50

NXP

IC MPU M680X0 50MHZ 206PGA

• Core Processor: 68060
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 206-BEPGA
• Supplier Device Package: 206-PGA (47.25x47.25)

Paket: 206-BEPGA

MC9328MXLVP20

NXP

IC MPU I.MXL 200MHZ 225MAPBGA

• Core Processor: ARM920T
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 200MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: LCD
• Ethernet: -
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 3.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 225-LFBGA
• Supplier Device Package: 225-MAPBGA (13x13)

Paket: 225-LFBGA

PC9RS08LA8CLF

NXP

IC MCU 8BIT 8KB FLASH 48LQFP

• Core Processor: RS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: SCI, SPI
• Peripherals: LCD, LVD, POR, PWM, WDT
• Number of I/O: 33
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Paket: 48-LQFP

P89V662FA,512

NXP

IC MCU 8BIT 32KB FLASH 44PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

Paket: 44-LCC (J-Lead)

MCF54454CVR200

NXP

IC MCU 32BIT ROMLESS 360PBGA

• Core Processor: Coldfire V4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, WDT
• Number of I/O: 132
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 360-BBGA
• Supplier Device Package: 360-PBGA (23x23)

Paket: 360-BBGA

S9S08AW60E5MFGER

NXP

IC MCU 8BIT 60KB FLASH 44LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

Paket: 44-LQFP

S9S08SG16E1CTJ

NXP

IC MCU 8BIT 16KB FLASH 20TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

Paket: 20-TSSOP (0.173", 4.40mm Width)

LPC1114FHI33/302,5

NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 28
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

Paket: 32-VFQFN Exposed Pad

SAC57D54HCVLT

NXP

IC MCU 32BIT 4MB FLASH 208LQFP

• Core Processor: ARM? Cortex?-A5, -M4, -M0+
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz, 160MHz, 320MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, LIN, SPI
• Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2.3M x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 208-LQFP Exposed Pad
• Supplier Device Package: 208-LQFP (28x28)

Paket: 208-LQFP Exposed Pad

ADC1010S065HN/C1,5

NXP

ADC 10BIT SPI 65MSPS 40HVQFN

• Number of Bits: 10
• Sampling Rate (Per Second): 65M
• Number of Inputs: 1
• Input Type: Differential, Single Ended
• Data Interface: LVDS - Parallel, Parallel
• Configuration: S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: Pipelined
• Reference Type: External, Internal
• Voltage - Supply, Analog: 2.85 V ~ 3.4 V
• Voltage - Supply, Digital: 1.65 V ~ 3.6 V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)
• Mounting Type: -

Paket: 40-VFQFN Exposed Pad

PCKV857DGV,118

NXP

IC CLK BUF DDR 190MHZ 1CIRC

• PLL: Yes
• Main Purpose: Memory, DDR, SDRAM
• Input: SSTL-2
• Output: SSTL-2
• Number of Circuits: 1
• Ratio - Input:Output: 1:10
• Differential - Input:Output: Yes/Yes
• Frequency - Max: 190MHz
• Voltage - Supply: 2.3 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.173", 4.40mm Width)
• Supplier Device Package: 48-TSSOP

Paket: 48-TFSOP (0.173", 4.40mm Width)

MPX2102ASX

NXP

SENSOR ABS PRESS 14.5PSI MAX

• Pressure Type: Absolute
• Operating Pressure: 14.5 PSI (100 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 40 mV (10V)
• Accuracy: ±1%
• Voltage - Supply: 10 V ~ 16 V
• Port Size: Male - 0.19" (4.93mm) Tube
• Port Style: Barbed
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 4-SIP Module
• Supplier Device Package: -

Paket: 4-SIP Module

MMA6851BKWR2

NXP

ACCELEROMETER 25G 16QFN

• Type: Digital
• Axis: X
• Acceleration Range: ±25g
• Sensitivity (LSB/g): 20.48
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: SPI
• Voltage - Supply: 3.135 V ~ 5.25 V
• Features: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (6x6)

Paket: 16-QFN Exposed Pad

TDA18204HN/C1,551

NXP

CABLE PREPROCESSOR LP TUNER

• Function: -
• Interface: -
• Number of Circuits: -
• Voltage - Supply: -
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

MCIMX6X1CVO08ACR

NXP

I.MX6SX ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 200MHz, 800MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

Paket: 400-LFBGA

PN7412AUHN/C300Y

NXP

IC SMART CARD READER 64HVQFN

• Applications: -
• Core Processor: -
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: -
• Number of I/O: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

MPC8313EVRADDC

NXP

IC MPU POWERQUICC II PRO 516PBGA

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: 516-BBGA Exposed Pad
• Supplier Device Package: 516-TEPBGA (27x27)

Paket: 516-BBGA Exposed Pad

A2V09H525-04NR6

NXP

RF MOSFET LDMOS 48V OM1230-4

• Transistor Type: LDMOS
• Frequency: 720MHz ~ 960MHz
• Gain: 18.9dB
• Voltage - Test: 48 V
• Current Rating: 10µA
• Noise Figure: -
• Current - Test: 688 mA
• Power - Output: 120W
• Voltage - Rated: 105 V
• Package / Case: OM-1230-4L
• Supplier Device Package: OM-1230-4L

Paket: -

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MC35FS4508CAER2

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

Paket: -

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MIMX8ML6CVNKZAB

NXP

IC MPU I.MX8ML 1.8GHZ 548LFBGA

• Core Processor: ARM® Cortex®-A53
• Number of Cores/Bus Width: 4 Core, 64-Bit
• Speed: 1.8GHz
• Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
• RAM Controllers: DDR4, LPDDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
• Ethernet: GbE (2)
• SATA: -
• USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: ARM TZ, CAAM, RDC
• Package / Case: 548-LFBGA
• Supplier Device Package: 548-LFBGA (15x15)

Paket: -

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