NXP Produkte

BC369,112

NXP

TRANS PNP 20V 1A TO-92

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 1A
• Voltage - Collector Emitter Breakdown (Max): 20V
• Vce Saturation (Max) @ Ib, Ic: 500mV @ 100mA, 1A
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 500mA, 1V
• Power - Max: 830mW
• Frequency - Transition: 140MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)
• Supplier Device Package: TO-92-3

Paket: TO-226-3, TO-92-3 (TO-226AA)

BAP51-04W,115

NXP

DIODE PIN GP 50V 50MA SOT323

• Diode Type: PIN - 1 Pair Series Connection
• Voltage - Peak Reverse (Max): 50V
• Current - Max: 50mA
• Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
• Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz
• Power Dissipation (Max): 240mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-70, SOT-323
• Supplier Device Package: SOT-323-3

Paket: SC-70, SOT-323

N74F153D,623

NXP

IC MULTIPLEXER DUAL 4IN 16SOIC

• Type: Multiplexer
• Circuit: 2 x 4:1
• Independent Circuits: 1
• Current - Output High, Low: 1mA, 20mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

Paket: 16-SOIC (0.154", 3.90mm Width)

74HCT2G126DC,125

NXP

IC BUFF DVR TRI-ST DL 8VSSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 1
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 6mA, 6mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-VFSOP (0.091", 2.30mm Width)
• Supplier Device Package: 8-VSSOP, US8

Paket: 8-VFSOP (0.091", 2.30mm Width)

SC16C850IBS/Q900,5

NXP

IC UART SGL UNIV ASYNC 32HVQFN

• Features: -
• Number of Channels: 1, UART
• FIFO's: 128 Byte
• Protocol: RS485
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5 V ~ 3.3 V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

Paket: 32-VFQFN Exposed Pad

MC33978AEK

NXP

IC INTERFACE SW DETECT 32-SOIC

• Applications: Multiple Switch Detection
• Interface: SPI
• Voltage - Supply: 3 V ~ 5.25 V
• Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

Paket: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

PCA9516AD,112

NXP

IC REDRIVER I2C 5CH 400KHZ 16SO

• Type: Buffer, ReDriver
• Applications: I2C
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 5
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 6pF
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 5mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

Paket: 16-SOIC (0.154", 3.90mm Width)

SC18IS600IBS,151

NXP

IC SPI TO I2C BUS 24-HVQFN

• Protocol: I2C
• Function: Controller
• Interface: SPI
• Standards: -
• Voltage - Supply: 2.4 V ~ 3.6 V
• Current - Supply: 11mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

Paket: 24-VFQFN Exposed Pad

MPC563CVR40

NXP

IC MCU 32BIT 512KB FLASH 388BGA

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 388-BBGA
• Supplier Device Package: 388-PBGA (27x27)

Paket: 388-BBGA

MC9S08PT60AVLF

NXP

IC MCU 8BIT 60KB FLASH 48LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 41
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Paket: 48-LQFP

MC9S08AW32CFGER

NXP

IC MCU 8BIT 32KB FLASH 44LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

Paket: 44-LQFP

LPC1102UK,118

NXP

IC MCU 32BIT 32KB FLASH 16WLCSP

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 11
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-UFBGA, WLCSP
• Supplier Device Package: -

Paket: 16-UFBGA, WLCSP

ADC1004S040TS/C1:1

NXP

IC ADC 10BIT PAR 40MHZ 28-SSOP

• Number of Bits: 10
• Sampling Rate (Per Second): 40M
• Number of Inputs: 1
• Input Type: Single Ended
• Data Interface: Parallel
• Configuration: ADC
• Ratio - S/H:ADC: -
• Number of A/D Converters: 1
• Architecture: -
• Reference Type: External
• Voltage - Supply, Analog: 5V
• Voltage - Supply, Digital: 5V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP
• Mounting Type: -

Paket: 28-SSOP (0.209", 5.30mm Width)

BZA868AL,115

NXP

TVS DIODE 6.8VWM 5TSSOP

• Type: Zener
• Unidirectional Channels: 4
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): 6.8V
• Voltage - Breakdown (Min): -
• Voltage - Clamping (Max) @ Ipp: -
• Current - Peak Pulse (10/1000µs): -
• Power - Peak Pulse: 14W
• Power Line Protection: No
• Applications: General Purpose
• Capacitance @ Frequency: 180pF @ 1MHz
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 5-TSSOP, SC-70-5, SOT-353
• Supplier Device Package: 5-TSSOP

Paket: 5-TSSOP, SC-70-5, SOT-353

MPXHZ6116A6T1

NXP

IC SENSOR IPS ABSOLUTE 8SSOP

• Pressure Type: Absolute
• Operating Pressure: 2.9 PSI ~ 16.68 PSI (20 kPa ~ 115 kPa)
• Output Type: Analog Voltage
• Output: 0.399 V ~ 4.645 V
• Accuracy: ±1.5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 8-SSOP

Paket: 8-SOIC (0.295", 7.50mm Width)

MMA1211EG

NXP

ACCELEROMETER 169G ANALOG 16SOIC

• Type: Analog
• Axis: Z
• Acceleration Range: ±169g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 13.33
• Bandwidth: 400Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

Paket: 16-SOIC (0.295", 7.50mm Width)

MPXV8500DK016T1

NXP

IC PRESSURE SENSOR

• Frequency: 315MHz, 434MHz
• Applications: TPM (Tire Pressure Monitor)
• Modulation or Protocol: FSK, OOK
• Data Rate (Max): -
• Power - Output: -
• Current - Transmitting: -
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Memory Size: 8kB Flash, 512B SRAM
• Features: -
• Voltage - Supply: 2.3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 32-QFN Exposed Pad

Paket: 32-QFN Exposed Pad

MCIMX6U1AVM08AD

NXP

I.MX6 DL ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

Paket: 624-LFBGA

SPC5673FK0MVY2R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z7
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: CANbus, EBI/EMI, SCI, SPI
• Peripherals: DMA, POR, PWM
• Number of I/O: 32
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 192K x 8
• Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
• Data Converters: A/D 64x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

Paket: 516-BBGA

SP5745BBK1AMMH2R

NXP

32 BIT SINGLE CORE 2M FLASH 1

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
• Peripherals: DMA, I²S, POR, WDT
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 36x10b, 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 100-LBGA
• Supplier Device Package: 100-MAPBGA (11x11)

Paket: 100-LBGA

MC56F8023VLCR

NXP

16-BIT DSC 56800E CORE 32KB FL

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, LINbus, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

Paket: 32-LQFP

S9S08DV96F2CLFR

NXP

8-BIT MCU S08 CORE 96KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Paket: 48-LQFP

MC9S08SE4MWL

NXP

IC MCU 8BIT 4KB FLASH 28SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: LINbus, SCI
• Peripherals: LVD, POR, PWM
• Number of I/O: 24
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

Paket: 28-SOIC (0.295", 7.50mm Width)

K32L3A60VPJ1AT

NXP

IC MCU 32B 1.25MB FLASH 176VFBGA

• Core Processor: ARM® Cortex®-M4/M0+
• Core Size: 32-Bit Dual-Core
• Speed: 72MHz
• Connectivity: FlexIO, I2C, SAI, SDHC, SPI, UART/USART, USB
• Peripherals: AC'97, DMA, I2S, LCD, POR, PWM, WDT
• Number of I/O: 104
• Program Memory Size: 1.25MB (1.25M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 48K x 8
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 176-VFBGA
• Supplier Device Package: 176-VFBGA (9x9)

Paket: -

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MC33FS8510A3ESR2

NXP

SYSTEM BASIS CHIP FS8510

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

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MC33771CTP2AE

NXP

BATTERY CELL CONTROLLER, PREMIUM

• Function: Battery Cell Controller
• Battery Chemistry: Lithium Ion
• Number of Cells: 7 ~ 14
• Fault Protection: Over/Under Voltage
• Interface: SPI
• Operating Temperature: -40°C ~ 105°C (TA)
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP (10x10)

Paket: -

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SPC5746BSK1AVKU2

NXP

IC MCU 32BIT 3MB FLASH 176LQFP

• Core Processor: e200z4
• Core Size: 32-Bit Single-Core
• Speed: 160MHz
• Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 129
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
• Data Converters: A/D 36x10b, 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP (24x24)

Paket: -

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MIMX8ML8DVNLZCB

NXP

IC

• Architecture: DSP, MCU, MPU
• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
• Flash Size: -
• RAM Size: 868KB
• Peripherals: DMA, PWM, WDT
• Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
• Speed: 1.8GHz, 800MHz
• Primary Attributes: -
• Operating Temperature: 0°C ~ 95°C (TJ)
• Package / Case: -
• Supplier Device Package: -

Paket: -

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