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NXP |
IC TRANS RF LDMOS
- Transistor Type: LDMOS (Dual)
- Frequency: 2.5GHz
- Gain: 14.7dB
- Voltage - Test: 28V
- Current Rating: -
- Noise Figure: -
- Current - Test: 400mA
- Power - Output: 32W
- Voltage - Rated: 65V
- Package / Case: NI-780S-4L2L
- Supplier Device Package: NI-780S-4L2L
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Paket: NI-780S-4L2L |
Lager4.768 |
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NXP |
TRANS NPN 15V .5A 18GHZ CMPAK-4
- Transistor Type: NPN
- Voltage - Collector Emitter Breakdown (Max): 4.5V
- Frequency - Transition: 18GHz
- Noise Figure (dB Typ @ f): -
- Gain: -
- Power - Max: 600mW
- DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 200mA, 2V
- Current - Collector (Ic) (Max): 500mA
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-82A, SOT-343
- Supplier Device Package: CMPAK-4
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Paket: SC-82A, SOT-343 |
Lager3.456 |
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NXP |
DIODE ZENER 11V 300MW SMT3
- Voltage - Zener (Nom) (Vz): 11V
- Tolerance: ±5%
- Power - Max: 300mW
- Impedance (Max) (Zzt): 10 Ohms
- Current - Reverse Leakage @ Vr: 100nA @ 8V
- Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
- Operating Temperature: -65°C ~ 150°C
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SMT3; MPAK
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Paket: TO-236-3, SC-59, SOT-23-3 |
Lager3.472 |
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NXP |
IC SWITCH DUAL H-SIDE 20-SOIC
- Applications: Automotive
- Current - Supply: 6mA
- Voltage - Supply: 6 V ~ 27 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SOIC
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Paket: 20-SOIC (0.295", 7.50mm Width) |
Lager9.648 |
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NXP |
IC GATE NAND 1CH 13-INP 16-SO
- Logic Type: NAND Gate
- Number of Circuits: 1
- Number of Inputs: 13
- Features: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Max): -
- Current - Output High, Low: 1mA, 20mA
- Logic Level - Low: 0.8V
- Logic Level - High: 2V
- Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Supplier Device Package: 16-SO
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
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Paket: 16-SOIC (0.154", 3.90mm Width) |
Lager5.984 |
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NXP |
IC D-TYPE POS TRG DUAL 48TSSOP
- Function: Master Reset
- Type: D-Type
- Output Type: Non-Inverted
- Number of Elements: 2
- Number of Bits per Element: 8
- Clock Frequency: 240MHz
- Max Propagation Delay @ V, Max CL: 3.4ns @ 5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Iq): 1mA
- Input Capacitance: 4pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-TFSOP (0.240", 6.10mm Width)
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Paket: 48-TFSOP (0.240", 6.10mm Width) |
Lager4.064 |
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NXP |
IC TRANSCVR TRI-ST 16BIT 48TSSOP
- Logic Type: Transceiver, Non-Inverting
- Number of Elements: 2
- Number of Bits per Element: 8
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 12mA, 12mA
- Voltage - Supply: 2.7 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package: 48-TSSOP
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Paket: 48-TFSOP (0.240", 6.10mm Width) |
Lager6.464 |
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NXP |
IC AMP CLASS B OUTPUT 20HSOP
- Type: Class B
- Output Type: 2-Channel (Stereo)
- Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm
- Voltage - Supply: 6 V ~ 18 V
- Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: 20-HSOP
- Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
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Paket: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Lager13.464 |
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NXP |
IC SBC LIN 5.0V 32HTSSOP
- Applications: Automotive
- Interface: SPI Serial
- Voltage - Supply: 4.5 V ~ 28 V
- Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
- Supplier Device Package: 32-HTSSOP
- Mounting Type: Surface Mount
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Paket: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad |
Lager5.168 |
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NXP |
IC MPU Q OR IQ 1.333GHZ 1295BGA
- Core Processor: PowerPC e500mc
- Number of Cores/Bus Width: 4 Core, 32-Bit
- Speed: 1.333GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1295-BBGA, FCBGA
- Supplier Device Package: 1295-FCPBGA (37.5x37.5)
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Paket: 1295-BBGA, FCBGA |
Lager2.672 |
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NXP |
IC MPU MPC85XX 667MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Paket: 783-BBGA, FCBGA |
Lager6.928 |
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NXP |
IC MPU MPC85XX 1.5GHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.5GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 (3)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 90°C (TA)
- Security Features: -
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Paket: 783-BBGA, FCBGA |
Lager8.424 |
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NXP |
IC MPU MPC86XX 1.25GHZ 994FCCBGA
- Core Processor: PowerPC e600
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.25GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 994-BCBGA, FCCBGA
- Supplier Device Package: 994-FCCBGA (33x33)
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Paket: 994-BCBGA, FCCBGA |
Lager2.400 |
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NXP |
IC MPU MPC82XX 400MHZ 516BGA
- Core Processor: PowerPC G2_LE
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
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Paket: 516-BBGA |
Lager5.952 |
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NXP |
IC MPU MPC82XX 166MHZ 408TBGA
- Core Processor: PowerPC G2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 166MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 480-LBGA
- Supplier Device Package: 408-TBGA (37.5x37.5)
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Paket: 480-LBGA |
Lager5.344 |
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NXP |
IC MPU SOC 32BIT 600MHZ 783FCBGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 600MHz
- Co-Processors/DSP: Security; SEC
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 (3)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 90°C (TA)
- Security Features: Cryptography
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
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Paket: 783-BBGA, FCBGA |
Lager4.208 |
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NXP |
IC MCU 32BIT 256KB FLASH 104BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 72MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 104-LFBGA
- Supplier Device Package: 104-MAPBGA (10x10)
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Paket: 104-LFBGA |
Lager5.904 |
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NXP |
IC MCU 8BIT 48KB FLASH 44QFP
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 6MHz
- Connectivity: I2C, USB
- Peripherals: POR, PWM
- Number of I/O: 32
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 6x8b
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 44-QFP
- Supplier Device Package: 44-QFP (10x10)
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Paket: 44-QFP |
Lager29.184 |
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NXP |
IC MCU 32BIT 2MB FLASH 176LQFP
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 16
- RAM Size: 160K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Paket: 176-LQFP |
Lager4.224 |
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NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
- Peripherals: LCD, Motor control PWM, POR, PWM, WDT
- Number of I/O: 91
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 6K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Paket: 112-LQFP |
Lager4.032 |
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NXP |
IC MCU 32BIT ROMLESS 180TFBGA
- Core Processor: ARM? Cortex?-M4/M0
- Core Size: 32-Bit Dual-Core
- Speed: 204MHz
- Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
- Number of I/O: 118
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 264K x 8
- Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
- Data Converters: A/D 8x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 180-TFBGA
- Supplier Device Package: 180-TFBGA (12x12)
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Paket: 180-TFBGA |
Lager4.960 |
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NXP |
IC MCU 8BIT 16KB FLASH 48LQFP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: CAN, I2C, LIN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 39
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 16x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Paket: 48-LQFP |
Lager6.864 |
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NXP |
IC MCU 16BIT 256KB FLASH 64LQFP
- Core Processor: HCS12X
- Core Size: 16-Bit
- Speed: 40MHz
- Connectivity: CAN, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 44
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
- Data Converters: A/D 8x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Paket: 64-LQFP |
Lager7.360 |
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NXP |
IC MCU 32BIT 96KB FLASH 64LQFP
- Core Processor: ARM? Cortex?-M0
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Number of I/O: 54
- Program Memory Size: 96KB (96K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 12K x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: -
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Paket: 64-LQFP |
Lager6.848 |
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NXP |
IC MCU 32BIT 256KB FLASH 80LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, IrDA, SPI, UART/USART
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 60
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 24x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (12x12)
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Paket: 80-LQFP |
Lager5.696 |
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NXP |
IC MCU 32BIT 448KB FLASH 272BGA
- Core Processor: PowerPC
- Core Size: 32-Bit
- Speed: 40MHz
- Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 101
- Program Memory Size: 448KB (448K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 26K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 32x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 272-BBGA
- Supplier Device Package: 272-PBGA (27x27)
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Paket: 272-BBGA |
Lager8.700 |
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NXP |
SENSOR DIFF PRESS 7.25 PSI MAX
- Pressure Type: Differential
- Operating Pressure: 7.25 PSI (50 kPa)
- Output Type: Analog Voltage
- Output: 0.2 V ~ 4.7 V
- Accuracy: ±2.5%
- Voltage - Supply: 4.75 V ~ 5.25 V
- Port Size: Male - 0.19" (4.93mm) Tube, Dual
- Port Style: Barbed
- Features: Temperature Compensated
- Termination Style: PCB
- Maximum Pressure: 29.01 PSI (200 kPa)
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 6-SIP Module
- Supplier Device Package: -
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Paket: 6-SIP Module |
Lager19.908 |
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NXP |
ACCELEROMETER 240G SPI 16QFN
- Type: Digital
- Axis: X
- Acceleration Range: ±240g
- Sensitivity (LSB/g): 2
- Sensitivity (mV/g): -
- Bandwidth: -
- Output Type: SPI
- Voltage - Supply: 4.2 V ~ 17 V
- Features: -
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-QFN Exposed Pad
- Supplier Device Package: 16-QFN (6x6)
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Paket: 16-QFN Exposed Pad |
Lager2.412 |
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NXP |
IC RF TXRX+MCU BLUETOOTH 32QFN
- Type: TxRx + MCU
- RF Family/Standard: Bluetooth
- Protocol: Bluetooth v4.1
- Modulation: FSK, GFSK
- Frequency: 2.4GHz
- Data Rate (Max): 1Mbps
- Power - Output: 5dBm
- Sensitivity: -102dBm
- Memory Size: 160kB Flash, 20kB SRAM
- Serial Interfaces: I2C, SPI, UART
- GPIO: 15
- Voltage - Supply: 3.6V
- Current - Receiving: 6.5mA
- Current - Transmitting: 8.4mA
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 32-VFQFN
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Paket: 32-VFQFN |
Lager7.506 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 149
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 80K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 29x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Paket: 176-LQFP |
Lager2.784 |
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