NXP Produkte

PHP78NQ03LT,127

NXP

MOSFET N-CH 25V 75A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 25V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 13nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 1074pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 93W (Tc)
• Rds On (Max) @ Id, Vgs: 9 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

Paket: TO-220-3

MRFE6S9135HSR5

NXP

FET RF 66V 940MHZ NI-880S

• Transistor Type: LDMOS
• Frequency: 940MHz
• Gain: 21dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1A
• Power - Output: 39W
• Voltage - Rated: 66V
• Package / Case: NI-880S
• Supplier Device Package: NI-880S

Paket: NI-880S

MRF5S21130HR3

NXP

FET RF 65V 2.17GHZ NI-880

• Transistor Type: LDMOS
• Frequency: 2.11GHz ~ 2.17GHz
• Gain: 13.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.2A
• Power - Output: 28W
• Voltage - Rated: 65V
• Package / Case: NI-880
• Supplier Device Package: NI-880

Paket: NI-880

BZX284-B15,115

NXP

DIODE ZENER 15V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 15V
• Tolerance: ±2%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 15 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 10.5V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

Paket: SOD-110

74LVT32374EC,518

NXP

IC D-TYPE POS TRG QUAD 96LFBGA

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 4
• Number of Bits per Element: 8
• Clock Frequency: 150MHz
• Max Propagation Delay @ V, Max CL: 5.3ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Iq): 240µA
• Input Capacitance: 3pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA

Paket: 96-LFBGA

74ABT273AD,118

NXP

IC D-TYPE POS TRG SNGL 20SOIC

• Function: Master Reset
• Type: D-Type
• Output Type: Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 350MHz
• Max Propagation Delay @ V, Max CL: 4.6ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 250µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)

Paket: 20-SOIC (0.295", 7.50mm Width)

74LVCH322245AEC/G;

NXP

IC BUS TRSCVR 3-ST 32BIT 96LFBGA

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

Paket: 96-LFBGA

PTN36221AHXHP

NXP

IC REDRIVER USB 3.0 1CH 12X2QFN

• Type: Buffer, ReDriver
• Applications: USB 3.0
• Input: -
• Output: -
• Data Rate (Max): -
• Number of Channels: 1
• Delay Time: 0.5ns
• Signal Conditioning: Input Equalization, Output De-Emphasis
• Capacitance - Input: -
• Voltage - Supply: 1.71 V ~ 1.89 V
• Current - Supply: 57mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 12-XFQFN
• Supplier Device Package: 12-X2QFN (1.6x1.6)

Paket: 12-XFQFN

KMPC8315ECVRAGDA

NXP

IC MPU MPC83XX 400MHZ 620BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Security; SEC 3.3
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

Paket: 620-BBGA Exposed Pad

MC68EC030FE25C

NXP

IC MPU M680X0 25MHZ 132CQFP

• Core Processor: 68030
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 132-BCQFP
• Supplier Device Package: 132-CQFP (24x24)

Paket: 132-BCQFP

MPC8280VVQLDA

NXP

IC MPU MPC82XX 333MHZ 408TBGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 480-LBGA
• Supplier Device Package: 408-TBGA (37.5x37.5)

Paket: 480-LBGA

MPC8349ECVVAJDB

NXP

IC MPU MPC83XX 533MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

Paket: 672-LBGA

MCIMX513CJM6C

NXP

IC MPU I.MX51 600MHZ 529BGA

• Core Processor: ARM? Cortex?-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 600MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 (3), USB 2.0 + PHY (1)
• Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
• Operating Temperature: -40°C ~ 95°C (TC)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
• Package / Case: 529-LFBGA
• Supplier Device Package: 529-BGA Case 2017 (19x19)

Paket: 529-LFBGA

MCIMX31CVKN5D

NXP

IC MPU I.MX31 532MHZ 457MAPBGA

• Core Processor: ARM1136JF-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 532MHz
• Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
• RAM Controllers: DDR
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keyboard, Keypad, LCD
• Ethernet: -
• SATA: -
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
• Package / Case: 457-LFBGA
• Supplier Device Package: -

Paket: 457-LFBGA

MC9328MXLVM15

NXP

IC MPU I.MXL 150MHZ 256MAPBGA

• Core Processor: ARM920T
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 150MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: LCD
• Ethernet: -
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 3.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 256-LFBGA
• Supplier Device Package: -

Paket: 256-LFBGA

MC9S12DJ128MFUE

NXP

IC MCU 16BIT 128KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 59
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

Paket: 80-QFP

MC908GP16CBE

NXP

IC MCU 8BIT 16KB FLASH 42PSDIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 31
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 42-SDIP (0.600", 15.24mm)
• Supplier Device Package: 42-PSDIP

Paket: 42-SDIP (0.600", 15.24mm)

MPC5554MZP132R2

NXP

IC MCU 32BIT 2MB FLASH 416BGA

• Core Processor: e200z6
• Core Size: 32-Bit
• Speed: 132MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 256
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
• Data Converters: A/D 40x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BBGA
• Supplier Device Package: 416-PBGA (27x27)

Paket: 416-BBGA

MC9S12XD256MAA

NXP

IC MCU 16BIT 256KB FLASH 80QFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 14K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

Paket: 80-QFP

MCF51AC128ACFUE

NXP

IC MCU 32BIT 128KB FLASH 64QFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 20x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

Paket: 64-QFP

MC9RS08KA1CDB

NXP

IC MCU 8BIT 1KB FLASH 6QFN

• Core Processor: RS08
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: -
• Peripherals: LVD, POR, WDT
• Number of I/O: 2
• Program Memory Size: 1KB (1K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 63 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 6-VDFN Exposed Pad
• Supplier Device Package: 6-QFN-EP (3x3)

Paket: 6-VDFN Exposed Pad

SPC5744PGK1AMMM9

NXP

IC MCU 32BIT 2.5MB FLASH 257PBGA

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 200MHz
• Connectivity: CAN, Ethernet, FlexRay, LIN, SPI, UART/USART
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: -
• Program Memory Size: 2.5MB (2.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 257-LFBGA
• Supplier Device Package: 257-MAPBGA (14x14)

Paket: 257-LFBGA

MKL27Z32VFM4

NXP

IC MCU 32BIT 32KB FLASH 32QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, FlexIO, SPI, UART/USART, USB
• Peripherals: DMA, I2S, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 8x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-UFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

Paket: 32-UFQFN Exposed Pad

MSC8112TVT2400V

NXP

DSP DUAL CORE 431FCBGA

• Type: SC140 Core
• Interface: Ethernet, I2C, TDM, UART
• Clock Rate: 300MHz
• Non-Volatile Memory: External
• On-Chip RAM: 448kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.10V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 431-BFBGA, FCBGA
• Supplier Device Package: 431-FCPBGA (20x20)

Paket: 431-BFBGA, FCBGA

PCF7938XA/LAAB3800

NXP

IC REMOTE KEYLESS ENTRY PLLMC

• Frequency: -
• Applications: -
• Modulation or Protocol: -
• Data Rate (Max): -
• Power - Output: -
• Current - Transmitting: -
• Data Interface: -
• Antenna Connector: -
• Memory Size: -
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -

Paket: -

MC35FS4500NAER2

NXP

FS4500

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

Paket: 48-LQFP Exposed Pad

SPC5744PEK1AMMM5

NXP

C55G-PANTHER (CUT 2.2B)

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 150MHz
• Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: -
• Program Memory Size: 2.5MB (2.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 257-LFBGA
• Supplier Device Package: 257-MAPBGA (14x14)

Paket: 257-LFBGA

S912XEG256J2CALR

NXP

W/16 BIT 256K FLASH 16K

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

Paket: 112-LQFP

NVT4557HKX

NXP

SIM CARD INTERFACE LEVEL TRANSLA

• Applications: Modems, Mobile Phones, SIM Card
• Interface: -
• Voltage - Supply: 1.08V ~ 1.95V, 1.65V ~ 3.6V
• Package / Case: 10-XFQFN
• Supplier Device Package: 10-XQFN (1.4x1.8)
• Mounting Type: Surface Mount

Paket: -

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MF0ULH3101DUDV

NXP

MF0ULH3101DUDV

• Applications: -
• Core Processor: -
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: -
• Number of I/O: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

Request a Quote