Page 100 - Preci-Dip Produkte - Sockel für ICs, Transistoren

558-10-520M31-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

Type: PGA
Number of Positions or Pins (Grid): 520 (31 x 31)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager3.888

520 (31 x 31)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-478M26-131106

Preci-Dip

CONN SOCKET PGA 478POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 478 (26 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager2.556

478 (26 x 26)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

550-10-600M35-001152

Preci-Dip

BGA SOLDER TAIL

Type: BGA
Number of Positions or Pins (Grid): 600 (35 x 35)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager2.250

600 (35 x 35)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-520M31-001106

Preci-Dip

CONN SOCKET PGA 520POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 520 (31 x 31)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager7.596

520 (31 x 31)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-480M29-001105

Preci-Dip

CONN SOCKET PGA 480POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 480 (29 x 29)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager7.794

480 (29 x 29)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-480M29-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 480 (29 x 29)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager3.400

480 (29 x 29)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-478M26-131105

Preci-Dip

CONN SOCKET PGA 478POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 478 (26 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager3.762

478 (26 x 26)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-478M26-131104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 478 (26 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager3.562

478 (26 x 26)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-560M33-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

Type: PGA
Number of Positions or Pins (Grid): 560 (33 x 33)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager2.736

560 (33 x 33)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-504M29-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

Type: PGA
Number of Positions or Pins (Grid): 504 (29 x 29)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager6.390

504 (29 x 29)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-520M31-001105

Preci-Dip

CONN SOCKET PGA 520POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 520 (31 x 31)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager7.434

520 (31 x 31)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-520M31-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 520 (31 x 31)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager4.860

520 (31 x 31)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-500M30-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

Type: PGA
Number of Positions or Pins (Grid): 500 (30 x 30)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager8.748

500 (30 x 30)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-504M29-001106

Preci-Dip

CONN SOCKET PGA 504POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 504 (29 x 29)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager8.964

504 (29 x 29)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-456M26-001106

Preci-Dip

CONN SOCKET PGA 456POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 456 (26 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager7.866

456 (26 x 26)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

550-10-576M30-001152

Preci-Dip

BGA SOLDER TAIL

Type: BGA
Number of Positions or Pins (Grid): 576 (30 x 30)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager6.678

576 (30 x 30)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-500M30-001106

Preci-Dip

CONN SOCKET PGA 500POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 500 (30 x 30)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager3.852

500 (30 x 30)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

550-10-520M31-001152

Preci-Dip

BGA SOLDER TAIL

Type: BGA
Number of Positions or Pins (Grid): 520 (31 x 31)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager3.042

520 (31 x 31)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

514-83-600M35-001148

Preci-Dip

CONN SOCKET BGA 600POS GOLD

Type: BGA
Number of Positions or Pins (Grid): 600 (35 x 35)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager2.682

600 (35 x 35)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

518-77-504M29-001105

Preci-Dip

CONN SOCKET PGA 504POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 504 (29 x 29)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager7.722

504 (29 x 29)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-456M26-001105

Preci-Dip

CONN SOCKET PGA 456POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 456 (26 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager3.114

456 (26 x 26)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-504M29-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 504 (29 x 29)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager7.362

504 (29 x 29)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-456M26-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 456 (26 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager4.878

456 (26 x 26)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-500M30-001105

Preci-Dip

CONN SOCKET PGA 500POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 500 (30 x 30)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager7.668

500 (30 x 30)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-480M29-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

Type: PGA
Number of Positions or Pins (Grid): 480 (29 x 29)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager6.678

480 (29 x 29)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

558-10-478M26-131101

Preci-Dip

PGA SOLDER TAIL 1.27MM

Type: PGA
Number of Positions or Pins (Grid): 478 (26 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager4.716

478 (26 x 26)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

550-10-504M29-001152

Preci-Dip

BGA SOLDER TAIL

Type: BGA
Number of Positions or Pins (Grid): 504 (29 x 29)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager3.834

504 (29 x 29)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

550-10-500M30-001152

Preci-Dip

BGA SOLDER TAIL

Type: BGA
Number of Positions or Pins (Grid): 500 (30 x 30)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager3.708

500 (30 x 30)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C