Page 11 - Aries Electronics Produkte

Teilenummer	Hersteller	Beschreibung	Paket	Lager
44-3552-18	Aries Electronics	CONN IC DIP SOCKET ZIF 44POS Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 44 (2 x 22) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50µin (1.27µm) Contact Material - Mating: Beryllium Nickel Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50µin (1.27µm) Contact Material - Post: Beryllium Nickel Housing Material: Polyetheretherketone (PEEK), Glass Filled Operating Temperature: -55°C ~ 250°C	Paket: -	Lager5.724
28-3553-16	Aries Electronics	CONN IC DIP SOCKET ZIF 28POS Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50µin (1.27µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50µin (1.27µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Paket: -	Lager5.364
24-3573-11	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS GLD Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Paket: -	Lager3.562
32-C212-20	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Paket: -	Lager4.428
36-6553-10	Aries Electronics	CONN IC DIP SOCKET ZIF 36POS GLD Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 36 (2 x 18) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Paket: -	Lager5.562
30-1508-30	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 30 (2 x 15) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6 Operating Temperature: -55°C ~ 105°C	Paket: -	Lager7.848
18-6501-21	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	Paket: -	Lager2.448
20-8800-310C	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Paket: -	Lager5.346
20-8750-310C	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Paket: -	Lager3.114
05-0511-11	Aries Electronics	CONN SOCKET SIP 5POS GOLD Type: SIP Number of Positions or Pins (Grid): 5 (1 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	Paket: -	Lager8.604
16-8440-310C	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Paket: -	Lager3.436
14-8250-310C	Aries Electronics	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Paket: -	Lager5.292
50-9518-11	Aries Electronics	CONN IC DIP SOCKET 50POS GOLD Type: DIP, 0.9" (22.86mm) Row Spacing Number of Positions or Pins (Grid): 50 (2 x 25) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Paket: -	Lager2.970
26-1518-11H	Aries Electronics	CONN IC DIP SOCKET 26POS GOLD Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 26 (2 x 13) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Paket: -	Lager8.964
03-0501-21	Aries Electronics	CONN SOCKET SIP 3POS GOLD Type: SIP Number of Positions or Pins (Grid): 3 (1 x 3) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	Paket: -	Lager2.520
08-810-90T	Aries Electronics	CONN IC DIP SOCKET 8POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole, Right Angle, Vertical Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6 Operating Temperature: -	Paket: -	Lager5.670
04-7950-10	Aries Electronics	CONN SOCKET SIP 4POS TIN Type: SIP Number of Positions or Pins (Grid): 4 (1 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Paket: -	Lager2.178
22-0513-11	Aries Electronics	CONN SOCKET SIP 22POS GOLD Type: SIP Number of Positions or Pins (Grid): 22 (1 x 22) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Paket: -	Lager2.610
12-1508-30	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 12 (2 x 6) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6 Operating Temperature: -55°C ~ 105°C	Paket: -	Lager3.060
16-3518-102	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Paket: -	Lager3.690
02-7250-10	Aries Electronics	CONN SOCKET SIP 2POS TIN Type: SIP Number of Positions or Pins (Grid): 2 (1 x 2) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Paket: -	Lager6.156
22-0518-10	Aries Electronics	CONN SOCKET SIP 22POS GOLD Type: SIP Number of Positions or Pins (Grid): 22 (1 x 22) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Paket: -	Lager3.438
32-6518-10T	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Paket: -	Lager5.706
84-537-20	Aries Electronics	CONN SCKT INSERT PLATE FOR PLCC Accessory Type: Insert Plate For Use With/Related Products: PLCC Sockets Number of Pins: 84 Body Material: Polyphenylene Sulfide (PPS), Glass Filled Body Finish: - Color: Black Features: -	Paket: -	Lager4.572
23-0625-21	Aries Electronics	0625 PIN-LINE HDR SCRW MACH CONT Connector Type: Header Strip Contact Type: Post Number of Positions: 23 Pitch: 0.100" (2.54mm) Number of Rows: 1 Row Spacing: - Mounting Type: Through Hole Termination: Solder Features: - Contact Finish: Gold Contact Finish Thickness: 10µin (0.25µm) Color: Black	Paket: -	Lager5.976
23-0600-10	Aries Electronics	0600 STRIP-LINE HDR COINED CNTCT Connector Type: DIP, DIL - Header Contact Type: Forked Number of Positions: 23 Pitch: 0.100" (2.54mm) Number of Rows: 1 Row Spacing: - Mounting Type: Through Hole Termination: Solder Features: - Contact Finish: Tin Contact Finish Thickness: 200µin (5.08µm) Color: Black	Paket: -	Lager8.208
20-680-190T	Aries Electronics	CONN HEADER PROGRAMMABLE 20POS Connector Type: Header Contact Type: Male Pin Number of Positions: 20 Pitch: 0.100" (2.54mm) Number of Rows: 2 Row Spacing: 0.300" (7.62mm) Mounting Type: Through Hole Termination: Solder Features: Programmable Contact Finish: Tin Contact Finish Thickness: 50µin (1.27µm) Color: Black	Paket: -	Lager8.442
14-680-190T	Aries Electronics	CONN HEADER PROGRAMMABLE 14POS Connector Type: Header Contact Type: Male Pin Number of Positions: 14 Pitch: 0.100" (2.54mm) Number of Rows: 2 Row Spacing: 0.300" (7.62mm) Mounting Type: Through Hole Termination: Solder Features: Programmable Contact Finish: Tin Contact Finish Thickness: 50µin (1.27µm) Color: Black	Paket: -	Lager4.284

44-3552-18

Aries Electronics

CONN IC DIP SOCKET ZIF 44POS

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 44 (2 x 22)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Operating Temperature: -55°C ~ 250°C

Paket: -

Lager5.724

28-3553-16

Aries Electronics

CONN IC DIP SOCKET ZIF 28POS

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

Paket: -

Lager5.364

24-3573-11

Aries Electronics

CONN IC DIP SOCKET ZIF 24POS GLD

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

Paket: -

Lager3.562

32-C212-20

Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager4.428

36-6553-10

Aries Electronics

CONN IC DIP SOCKET ZIF 36POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

Paket: -

Lager5.562

30-1508-30

Aries Electronics

CONN IC DIP SOCKET 30POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 30 (2 x 15)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager7.848

18-6501-21

Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager2.448

20-8800-310C

Aries Electronics

CONN IC DIP SOCKET 20POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager5.346

20-8750-310C

Aries Electronics

CONN IC DIP SOCKET 20POS GOLD

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Paket: -

Lager3.114

05-0511-11

Aries Electronics

CONN SOCKET SIP 5POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager8.604

16-8440-310C

Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager3.436

14-8250-310C

Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager5.292

50-9518-11

Aries Electronics

CONN IC DIP SOCKET 50POS GOLD

Type: DIP, 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid): 50 (2 x 25)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

Paket: -

Lager2.970

26-1518-11H

Aries Electronics

CONN IC DIP SOCKET 26POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 26 (2 x 13)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

Paket: -

Lager8.964

03-0501-21

Aries Electronics

CONN SOCKET SIP 3POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: -
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 125°C

Paket: -

Lager2.520

08-810-90T

Aries Electronics

CONN IC DIP SOCKET 8POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole, Right Angle, Vertical
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6
Operating Temperature: -

Paket: -

Lager5.670

04-7950-10

Aries Electronics

CONN SOCKET SIP 4POS TIN

Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager2.178

22-0513-11

Aries Electronics

CONN SOCKET SIP 22POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 22 (1 x 22)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

Paket: -

Lager2.610

12-1508-30

Aries Electronics

CONN IC DIP SOCKET 12POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager3.060

16-3518-102

Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

Paket: -

Lager3.690

02-7250-10

Aries Electronics

CONN SOCKET SIP 2POS TIN

Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

Paket: -

Lager6.156

22-0518-10

Aries Electronics

CONN SOCKET SIP 22POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 22 (1 x 22)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

Paket: -

Lager3.438

32-6518-10T

Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

Paket: -

Lager5.706

84-537-20

Aries Electronics

CONN SCKT INSERT PLATE FOR PLCC

Accessory Type: Insert Plate
For Use With/Related Products: PLCC Sockets
Number of Pins: 84
Body Material: Polyphenylene Sulfide (PPS), Glass Filled
Body Finish: -
Color: Black
Features: -

Paket: -

Lager4.572

23-0625-21

Aries Electronics

0625 PIN-LINE HDR SCRW MACH CONT

Connector Type: Header Strip
Contact Type: Post
Number of Positions: 23
Pitch: 0.100" (2.54mm)
Number of Rows: 1
Row Spacing: -
Mounting Type: Through Hole
Termination: Solder
Features: -
Contact Finish: Gold
Contact Finish Thickness: 10µin (0.25µm)
Color: Black

Paket: -

Lager5.976

23-0600-10

Aries Electronics

0600 STRIP-LINE HDR COINED CNTCT

Connector Type: DIP, DIL - Header
Contact Type: Forked
Number of Positions: 23
Pitch: 0.100" (2.54mm)
Number of Rows: 1
Row Spacing: -
Mounting Type: Through Hole
Termination: Solder
Features: -
Contact Finish: Tin
Contact Finish Thickness: 200µin (5.08µm)
Color: Black

Paket: -

Lager8.208

20-680-190T

Aries Electronics

CONN HEADER PROGRAMMABLE 20POS

Connector Type: Header
Contact Type: Male Pin
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Number of Rows: 2
Row Spacing: 0.300" (7.62mm)
Mounting Type: Through Hole
Termination: Solder
Features: Programmable
Contact Finish: Tin
Contact Finish Thickness: 50µin (1.27µm)
Color: Black

Paket: -

Lager8.442

14-680-190T

Aries Electronics

CONN HEADER PROGRAMMABLE 14POS

Connector Type: Header
Contact Type: Male Pin
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Number of Rows: 2
Row Spacing: 0.300" (7.62mm)
Mounting Type: Through Hole
Termination: Solder
Features: Programmable
Contact Finish: Tin
Contact Finish Thickness: 50µin (1.27µm)
Color: Black

Paket: -

Lager4.284