Intel Produkte

10AS057K2F35I1HG

Intel

IC SOC FPGA 396 I/O 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 570K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

Paket: 1152-BBGA, FCBGA

10AS027E2F29I2SG

Intel

780-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 270K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

Paket: -

HC1S80XX

Intel

IC FPGA APEX

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

EP20K200CB356C8ES

Intel

IC FPGA

• Number of LABs/CLBs: 832
• Number of Logic Elements/Cells: 8320
• Total RAM Bits: 106496
• Number of I/O: 271
• Number of Gates: 526000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 356-LBGA
• Supplier Device Package: 356-BGA (35x35)

Paket: 356-LBGA

10AX057H1F34I1SG

Intel

IC FPGA 492 I/O 1152FCBGA

• Number of LABs/CLBs: 217080
• Number of Logic Elements/Cells: 570000
• Total RAM Bits: 42082304
• Number of I/O: 492
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FCBGA (35x35)

Paket: 1152-BBGA, FCBGA

EP20K60ETC144-2N

Intel

IC FPGA 92 I/O 144TQFP

• Number of LABs/CLBs: 2560
• Number of Logic Elements/Cells: 2560
• Total RAM Bits: 32768
• Number of I/O: 92
• Number of Gates: 162000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

Paket: 144-LQFP

EP4SGX530HH35C3NES

Intel

IC FPGA 564 I/O 1152HBGA

• Number of LABs/CLBs: 21248
• Number of Logic Elements/Cells: 531200
• Total RAM Bits: 28033024
• Number of I/O: 564
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-HBGA, FC (42.5x42.5)

Paket: 1152-BBGA, FCBGA

EPF10K30ATI144-3

Intel

IC FPGA 102 I/O 144TQFP

• Number of LABs/CLBs: 216
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 12288
• Number of I/O: 102
• Number of Gates: 69000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

Paket: 144-LQFP

EP4S100G2F40I1

Intel

IC FPGA 654 I/O 1517FBGA

• Number of LABs/CLBs: 9120
• Number of Logic Elements/Cells: 228000
• Total RAM Bits: 17544192
• Number of I/O: 654
• Number of Gates: -
• Voltage - Supply: 0.92 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

Paket: 1517-BBGA, FCBGA

EP3SL110F780I3

Intel

IC FPGA 488 I/O 780FBGA

• Number of LABs/CLBs: 4300
• Number of Logic Elements/Cells: 107500
• Total RAM Bits: 4992000
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

Paket: 780-BBGA, FCBGA

EP2AGX190FF35C6

Intel

IC FPGA 612 I/O 11152FBGA

• Number of LABs/CLBs: 7612
• Number of Logic Elements/Cells: 181165
• Total RAM Bits: 10177536
• Number of I/O: 612
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

Paket: 1152-BBGA, FCBGA

EP3SL70F780C2

Intel

IC FPGA 488 I/O 780FBGA

• Number of LABs/CLBs: 2700
• Number of Logic Elements/Cells: 67500
• Total RAM Bits: 2699264
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

Paket: 780-BBGA, FCBGA

EP1C3T144C7

Intel

IC FPGA 104 I/O 144TQFP

• Number of LABs/CLBs: 291
• Number of Logic Elements/Cells: 2910
• Total RAM Bits: 59904
• Number of I/O: 104
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

Paket: 144-LQFP

EP2C5T144C6N

Intel

IC FPGA 89 I/O 144TQFP

• Number of LABs/CLBs: 288
• Number of Logic Elements/Cells: 4608
• Total RAM Bits: 119808
• Number of I/O: 89
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

Paket: 144-LQFP

EPM3064ATC100-7

Intel

IC CPLD 64MC 7.5NS 100TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1250
• Number of I/O: 66
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

Paket: 100-TQFP

5M570ZT100I5N

Intel

IC CPLD 440MC 9NS 100TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 9.0ns
• Voltage Supply - Internal: 1.71 V ~ 1.89 V
• Number of Logic Elements/Blocks: 570
• Number of Macrocells: 440
• Number of Gates: -
• Number of I/O: 74
• Operating Temperature: -40°C ~ 100°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

Paket: 100-TQFP

5AGTFD3H3F40I3G

Intel

IC FPGA 704 I/O 1517FBGA

• Number of LABs/CLBs: 17110
• Number of Logic Elements/Cells: 362000
• Total RAM Bits: 19822592
• Number of I/O: 704
• Number of Gates: -
• Voltage - Supply: 1.12V ~ 1.18V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

Paket: 1517-BBGA, FCBGA

1SG110HN3F43E3XG

Intel

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 137500
• Number of Logic Elements/Cells: 1100000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

Paket: -

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5SGSMD5H3F35C4G

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 172600
• Number of Logic Elements/Cells: 457000
• Total RAM Bits: 39936000
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

Paket: -

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1SG110HN1F43I1VGAS

Intel

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 137500
• Number of Logic Elements/Cells: 1100000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

Paket: -

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5SGXMA4K3F40C4WN

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 37888000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

Paket: -

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5SGXMA3H1F35C1G

Intel

IC FPGA 600 I/O 1152FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 19456000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

Paket: -

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AGIC035R39A2I1V

Intel

IC

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 3.54M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 3948-BFBGA Exposed Pad
• Supplier Device Package: 3948-BGA (56x56)

Paket: -

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AGFB006R16A2I3E

Intel

IC FPGA AGILEX-F 1546FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 573K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

Paket: -

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AGFD023R24C3I3E

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

Paket: -

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1SX280HH2F55E2LGS3

Intel

IC FPGA STRATIX 10 2912FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2912-BBGA, FCBGA
• Supplier Device Package: 2912-FBGA, FC (55x55)

Paket: -

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AGFB027R25A2I3V

Intel

IC FPGA AGILEX-F 2581FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

Paket: -

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TE28F400CVT80

Intel

IC FLASH 4MBIT CUI 48TSOP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH - Boot Block
• Memory Size: 4Mbit
• Memory Interface: CUI
• Clock Frequency: -
• Write Cycle Time - Word, Page: 80ns
• Access Time: 80 ns
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.724", 18.40mm Width)
• Supplier Device Package: 48-TSOP

Paket: -

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