Intel Produkte

10AS032H3F34I2LG

Intel

1152-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 320K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

Paket: -

10AX027H2F34E1SG

Intel

IC FPGA 384 I/O 1152FCBGA

• Number of LABs/CLBs: 101620
• Number of Logic Elements/Cells: 270000
• Total RAM Bits: 17870848
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

Paket: 1152-BBGA, FCBGA

EPF10K200SBC600-3B

Intel

IC FPGA

• Number of LABs/CLBs: 1248
• Number of Logic Elements/Cells: 9984
• Total RAM Bits: 98304
• Number of I/O: 470
• Number of Gates: 513000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 600-BGA
• Supplier Device Package: 600-BGA (45x45)

Paket: 600-BGA

EP20K1000CF33C8N

Intel

IC FPGA APEX 20KC 1020-FBGA

• Number of LABs/CLBs: 3840
• Number of Logic Elements/Cells: 38400
• Total RAM Bits: 327680
• Number of I/O: 708
• Number of Gates: 1772000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

Paket: 1020-BBGA

EP2SGX130GF1508C3

Intel

IC FPGA 734 I/O 1508FBGA

• Number of LABs/CLBs: 6627
• Number of Logic Elements/Cells: 132540
• Total RAM Bits: 6747840
• Number of I/O: 734
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1508-BBGA, FCBGA
• Supplier Device Package: 1508-FBGA (30x30)

Paket: 1508-BBGA, FCBGA

EPF10K30RC240-4N

Intel

IC FPGA 189 I/O 240RQFP

• Number of LABs/CLBs: 216
• Number of Logic Elements/Cells: 1728
• Total RAM Bits: 12288
• Number of I/O: 189
• Number of Gates: 69000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-RQFP (32x32)

Paket: 240-BFQFP Exposed Pad

EP4SGX530NF45I3N

Intel

IC FPGA 920 I/O 1932FBGA

• Number of LABs/CLBs: 21248
• Number of Logic Elements/Cells: 531200
• Total RAM Bits: 28033024
• Number of I/O: 920
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

Paket: 1932-BBGA, FCBGA

EP4SGX290KF40C2

Intel

IC FPGA 744 I/O 1517FBGA

• Number of LABs/CLBs: 11648
• Number of Logic Elements/Cells: 291200
• Total RAM Bits: 17661952
• Number of I/O: 744
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

Paket: 1517-BBGA, FCBGA

EP4SGX530KH40I4N

Intel

IC FPGA 744 I/O 1517HBGA

• Number of LABs/CLBs: 21248
• Number of Logic Elements/Cells: 531200
• Total RAM Bits: 28033024
• Number of I/O: 744
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-HBGA (42.5x42.5)

Paket: 1517-BBGA, FCBGA

5SGSMD5K3F40I3L

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 172600
• Number of Logic Elements/Cells: 457000
• Total RAM Bits: 46769152
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

Paket: 1517-BBGA, FCBGA

5SGXMA3K2F35C2N

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 23704576
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

Paket: 1152-BBGA, FCBGA

5SGXEB5R2F40I2LN

Intel

IC FPGA 432 I/O 1517FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 48927744
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

Paket: 1517-BBGA, FCBGA

EP2AGX260FF35C4N

Intel

IC FPGA 612 I/O 1152FBGA

• Number of LABs/CLBs: 10260
• Number of Logic Elements/Cells: 244188
• Total RAM Bits: 12038144
• Number of I/O: 612
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

Paket: 1152-BBGA, FCBGA

5SGXMA3E3H29C4N

Intel

IC FPGA 360 I/O 780HBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 23704576
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

Paket: 780-BBGA, FCBGA

EP3SL50F484C2N

Intel

IC FPGA 296 I/O 484FBGA

• Number of LABs/CLBs: 1900
• Number of Logic Elements/Cells: 47500
• Total RAM Bits: 2184192
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FBGA (23x23)

Paket: 484-BBGA, FCBGA

5CEFA7F23C8N

Intel

IC FPGA 240 I/O 484FBGA

• Number of LABs/CLBs: 56480
• Number of Logic Elements/Cells: 149500
• Total RAM Bits: 7880704
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

Paket: 484-BGA

EP3C5U256C6

Intel

IC FPGA 182 I/O 256UBGA

• Number of LABs/CLBs: 321
• Number of Logic Elements/Cells: 5136
• Total RAM Bits: 423936
• Number of I/O: 182
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LFBGA
• Supplier Device Package: 256-UBGA (14x14)

Paket: 256-LFBGA

EP4CE6F17C7

Intel

IC FPGA 179 I/O 256FBGA

• Number of LABs/CLBs: 392
• Number of Logic Elements/Cells: 6272
• Total RAM Bits: 276480
• Number of I/O: 179
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

Paket: 256-LBGA

EPM7128BFI256-7

Intel

IC CPLD 128MC 7.5NS 256FBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 2500
• Number of I/O: 100
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

Paket: 256-BGA

5SGXEA7H2F35I3W

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

Paket: -

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EP4SGX360FF35I4G

Intel

IC FPGA 564 I/O 1152FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

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AT80601000897AB

Intel

IC MPU 2.8GHZ 1366FCLGA

• Core Processor: Intel® Xeon® Processor W3530
• Number of Cores/Bus Width: 4 Core, 64-Bit
• Speed: 2.8GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 0.8V, 1.375V
• Operating Temperature: 67.9°C (TC)
• Security Features: -
• Package / Case: 1366-LGA
• Supplier Device Package: 1366-FCLGA (42.5x45)

Paket: -

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5SGXMA4K2F40I3LG

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 37888000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

Paket: -

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AGFB022R24C2I3V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.2M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

Paket: -

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1SX165HN3F43E3VG

Intel

IC FPGA STRATIX 10 1760FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 1650K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

Paket: -

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AGFB022R31C2E3V

Intel

IC FPGA AGILEX-F 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.2M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

Paket: -

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1SG280HH1F55I1VG

Intel

IC FPGA 1160 I/O 2912BGA

• Number of LABs/CLBs: 350000
• Number of Logic Elements/Cells: 2800000
• Total RAM Bits: -
• Number of I/O: 1160
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2912-BBGA, FCBGA
• Supplier Device Package: 2912-FBGA, FC (55x55)

Paket: -

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5SGXEA4K3F35C4G

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 37888000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

Paket: -

Request a Quote