Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
Paket: 12-WFDFN Exposed Pad |
Lager6.160 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
Paket: 12-WFDFN Exposed Pad |
Lager3.232 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
Paket: 12-WFDFN Exposed Pad |
Lager6.704 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
Paket: 12-WFDFN Exposed Pad |
Lager3.248 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.8GHZ
|
Paket: 36-WFQFN Exposed Pad |
Lager7.536 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVPECL | 1.8GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
Paket: 36-WFQFN Exposed Pad |
Lager7.760 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
Paket: 36-WFQFN Exposed Pad |
Lager6.800 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
Paket: 36-WFQFN Exposed Pad |
Lager6.816 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
Paket: 12-TSSOP (0.118", 3.00mm Width) |
Lager6.736 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
Paket: 12-TSSOP (0.118", 3.00mm Width) |
Lager2.000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
Paket: 12-TSSOP (0.118", 3.00mm Width) |
Lager25.200 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
Paket: 12-TSSOP (0.118", 3.00mm Width) |
Lager7.296 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
Paket: 12-WFDFN Exposed Pad |
Lager60.000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
Paket: 12-TSSOP (0.118", 3.00mm Width) |
Lager44.400 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
Paket: 12-TSSOP (0.118", 3.00mm Width) |
Lager18.000 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
Paket: 12-WFDFN Exposed Pad |
Lager63.600 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
Paket: 12-WFDFN Exposed Pad |
Lager108.000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
Paket: 12-WFDFN Exposed Pad |
Lager84.000 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
Paket: 12-TSSOP (0.118", 3.00mm Width) |
Lager19.644 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
Paket: 12-TSSOP (0.118", 3.00mm Width) |
Lager15.552 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC POWER MANAGEMENT
|
Paket: 12-WFDFN Exposed Pad |
Lager4.976 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
Paket: 12-WFDFN Exposed Pad |
Lager7.792 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
Paket: 12-WFDFN Exposed Pad |
Lager5.264 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
Paket: 12-WFDFN Exposed Pad |
Lager5.248 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
Paket: 36-WFQFN Exposed Pad |
Lager7.280 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
Paket: 36-WFQFN Exposed Pad |
Lager4.320 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
Paket: 36-WFQFN Exposed Pad |
Lager7.088 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
Paket: 36-WFQFN Exposed Pad |
Lager5.952 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVPECL | 1.8GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |