Maxim Integrated Produkte - Schnittstelle - Modems - ICs und Module | Heisener Electronics
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Maxim Integrated Produkte - Schnittstelle - Modems - ICs und Module

Aufzeichnungen 4
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Bild
Teilenummer
Hersteller
Beschreibung
Paket
Lager
Anzahl
Baud Rates
Voltage - Supply
Mounting Type
Package / Case
Supplier Device Package
73M2901CE-IGVR/F
Maxim Integrated

IC MODEM 3.3V V.22BIS 32-TQFP

  • Data Format: V.21, V.22, V.23, Bell 103, Bell 212A
  • Baud Rates: 300 ~ 9.6k
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Package / Case: 32-TQFP
  • Supplier Device Package: 32-TQFP (7x7)
Paket: 32-TQFP
Lager7.520
300 ~ 9.6k
2.7 V ~ 3.6 V
Surface Mount
32-TQFP
32-TQFP (7x7)
73M2901CE-IMR/F
Maxim Integrated

IC MODEM 3.3V V.22BIS 32-QFN

  • Data Format: V.21, V.22, V.23, Bell 103, Bell 212A
  • Baud Rates: 300 ~ 9.6k
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-QFN (5x5)
Paket: 32-VFQFN Exposed Pad
Lager5.856
300 ~ 9.6k
2.7 V ~ 3.6 V
Surface Mount
32-VFQFN Exposed Pad
32-QFN (5x5)
hot 73M2901CE-IM/F
Maxim Integrated

IC MODEM 3.3V V.22BIS 32-QFN

  • Data Format: V.21, V.22, V.23, Bell 103, Bell 212A
  • Baud Rates: 300 ~ 9.6k
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-QFN (5x5)
Paket: 32-VFQFN Exposed Pad
Lager4.480
300 ~ 9.6k
2.7 V ~ 3.6 V
Surface Mount
32-VFQFN Exposed Pad
32-QFN (5x5)
hot 73M2901CE-IGV/F
Maxim Integrated

IC MODEM 3.3V V.22BIS 32-TQFP

  • Data Format: V.21, V.22, V.23, Bell 103, Bell 212A
  • Baud Rates: 300 ~ 9.6k
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Package / Case: 32-TQFP
  • Supplier Device Package: 32-TQFP
Paket: 32-TQFP
Lager6.960
300 ~ 9.6k
2.7 V ~ 3.6 V
Surface Mount
32-TQFP
32-TQFP