Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
32 CHANNEL SHORT HAUL T1/E1 LIU
|
Paket: - |
Lager3.344 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER
|
Paket: - |
Lager5.440 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DGTL SWITCH QDX QUAD 144LBGA
|
Paket: 144-LBGA |
Lager5.088 |
|
- | 4 | 3V ~ 3.6V | 64mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | 144-LBGA (13x13) |
||
Microchip Technology |
IC ENHANCED DIGITAL SWITCH
|
Paket: - |
Lager3.712 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 2CH UNIV 150V 48QFN
|
Paket: 56-VFQFN Exposed Pad |
Lager4.320 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
IC SLIC 2CH UNIV 150V 48QFN
|
Paket: 56-VFQFN Exposed Pad |
Lager5.920 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28PLCC
|
Paket: 28-LCC (J-Lead) |
Lager4.144 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28SOIC
|
Paket: 28-SOIC (0.295", 7.50mm Width) |
Lager2.528 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC TIMING-OVER-PACKET 324BGA
|
Paket: 324-BGA |
Lager4.192 |
|
- | 1 | 3V ~ 3.6V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC TIMING-OVER-PACKET 324BGA
|
Paket: 324-BGA |
Lager4.576 |
|
- | 1 | 3V ~ 3.6V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC TIMING-OVER-PACKET 324BGA
|
Paket: 324-BGA |
Lager3.536 |
|
- | 1 | 3V ~ 3.6V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC ECHO CANCEL ACOUSTIC 36SSOP
|
Paket: 36-BSOP (0.295", 7.50mm Width) |
Lager5.760 |
|
Serial | 1 | 2.7V ~ 3.6V | 3µA | - | -40°C ~ 85°C | Surface Mount | 36-BSOP (0.295", 7.50mm Width) | 36-QSOP |
||
Microchip Technology |
IC VOICE ECHO CANCEL 365MCMBGA
|
Paket: 365-BBGA |
Lager6.208 |
|
- | 1 | 3V ~ 3.6V | 65µA | - | -40°C ~ 85°C | Surface Mount | 365-BBGA | 365-BGA (27x27) |
||
Microchip Technology |
IC VOICE ECHO CANCEL 365MCMBGA
|
Paket: 365-BBGA |
Lager2.368 |
|
- | 1 | 3V ~ 3.6V | 65µA | - | -40°C ~ 85°C | Surface Mount | 365-BBGA | 365-BGA (27x27) |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28SOIC
|
Paket: 28-SOIC (0.295", 7.50mm Width) |
Lager4.768 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28PLCC
|
Paket: 28-LCC (J-Lead) |
Lager7.840 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28DIP
|
Paket: 28-DIP (0.600", 15.24mm) |
Lager5.280 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC CODEC MFC 5V 20SSOP
|
Paket: 20-SSOP (0.209", 5.30mm Width) |
Lager6.480 |
|
SSI | 1 | 4.75V ~ 5.25V | 4µA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC CODEC MFC 5V 20SOIC
|
Paket: 20-SOIC (0.209", 5.30mm Width) |
Lager4.864 |
|
- | 1 | 4.75V ~ 5.25V | 4µA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.209", 5.30mm Width) | 20-SOIC |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 20SSOP
|
Paket: 20-SSOP (0.209", 5.30mm Width) |
Lager6.800 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC SLIC 1CH UNIV 10V 28PLCC
|
Paket: - |
Lager2.208 |
|
Parallel | 1 | 3.3V | 40mA | - | - | Surface Mount | - | 28-PLCC |
||
Microchip Technology |
IC OLAC CHIPSET 1CHAN 48LQFP
|
Paket: - |
Lager2.304 |
|
- | 1 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 8DIP
|
Paket: 8-DIP (0.300", 7.62mm) |
Lager7.248 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SLIC 1CH UNIV 145V 48TQFP
|
Paket: - |
Lager5.600 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 18SOIC
|
Paket: 18-SOIC (0.295", 7.50mm Width) |
Lager3.904 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 18SOIC
|
Paket: 18-SOIC (0.295", 7.50mm Width) |
Lager5.456 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 20SSOP
|
Paket: 20-SSOP (0.209", 5.30mm Width) |
Lager4.192 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC RECEIVER DTMF 50DB 18SOIC
|
Paket: 18-SOIC (0.295", 7.50mm Width) |
Lager3.888 |
|
Parallel | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |