Microchip Technology Produkte

DSC2311KL1-R0009

Microchip Technology

OSC MEMS CONFIGURABLE OUTPUT

• Type: MEMS (Silicon)
• Frequency - Output 1: -
• Frequency - Output 2: -
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): -
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height: 0.035" (0.90mm)
• Package / Case: 6-SMD, No Lead

Paket: 6-SMD, No Lead

DSC1001AE1-133.0000T

Microchip Technology

OSC MEMS 133.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 133MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 8.7mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paket: 4-SMD, No Lead Exposed Pad

DSC1033AE1-005.0000T

Microchip Technology

OSC MEMS 5.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 5MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 3.3V
• Frequency Stability: ±50ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 3mA (Typ)
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

Paket: 4-SMD, No Lead Exposed Pad

MIC29152BU TR

Microchip Technology

IC REG LIN POS ADJ 1.5A TO263-5

• Output Configuration: Positive
• Output Type: Adjustable
• Number of Regulators: 1
• Voltage - Input (Max): 26V
• Voltage - Output (Min/Fixed): 1.25V
• Voltage - Output (Max): 25V
• Voltage Dropout (Max): 0.6V @ 1.5A
• Current - Output: 1.5A
• Current - Quiescent (Iq): -
• Current - Supply (Max): 20mA
• PSRR: -
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Reverse Polarity, Transient Voltage
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TO-263-6, D2Pak (5 Leads + Tab), TO-263BA
• Supplier Device Package: TO-263-5

Paket: TO-263-6, D2Pak (5 Leads + Tab), TO-263BA

MIC33164YGJ-T5

Microchip Technology

IC REG BUCK ADJ 1A SYNC 20QFN

• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Output Type: Adjustable
• Number of Outputs: 1
• Voltage - Input (Min): 2.7V
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 0.7V
• Voltage - Output (Max): 5V
• Current - Output: 1A
• Frequency - Switching: 4MHz
• Synchronous Rectifier: Yes
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 20-PowerTFQFN
• Supplier Device Package: 20-QFN (2.5x3)

Paket: 20-PowerTFQFN

MIC2075-1FBMM

Microchip Technology

IC DISTRIBUTION SW SGL 8-MSOP

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 2.7 V ~ 5.5 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 500mA
• Rds On (Typ): 90 mOhm
• Input Type: Non-Inverting
• Features: Slew Rate Controlled, Status Flag
• Fault Protection: Current Limiting (Fixed), Over Temperature, UVLO
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

Paket: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

USB3813I-1080XY-TR

Microchip Technology

IC USB 2.0 HUB CTLR 3PORT 30CSP

• Protocol: USB
• Function: Hub Controller
• Interface: USB
• Standards: USB 2.0
• Voltage - Supply: 3.3V
• Current - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 30-UFBGA, WLCSP
• Supplier Device Package: 30-WLCSP (2.90x2.50)

Paket: 30-UFBGA, WLCSP

PIC24EP128MC204-H/PT

Microchip Technology

IC MCU 16BIT 128KB FLASH 44TQFP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: I2C, IrDA, LIN, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 9x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

Paket: 44-TQFP

PIC18F8720-I/PTC01

Microchip Technology

IC MCU 8BIT 128KB FLASH 80TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 68
• Program Memory Size: 128KB (64K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 3.75K x 8
• Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-TQFP
• Supplier Device Package: 80-TQFP (12x12)

Paket: 80-TQFP

PIC14000-04/SS

Microchip Technology

IC MCU 8BIT 7KB OTP 28SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: I2C
• Peripherals: POR, Temp Sensor, WDT
• Number of I/O: 20
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V
• Data Converters: Slope A/D
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

Paket: 28-SSOP (0.209", 5.30mm Width)

PIC16LC71-04I/P

Microchip Technology

IC MCU 8BIT 1.75KB OTP 18DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 13
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 36 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 4x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 18-DIP (0.300", 7.62mm)
• Supplier Device Package: 18-PDIP

Paket: 18-DIP (0.300", 7.62mm)

DSPIC33FJ16GS404-E/ML

Microchip Technology

IC MCU 16BIT 16KB FLASH 44QFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 44-VQFN Exposed Pad
• Supplier Device Package: 44-QFN (8x8)

Paket: 44-VQFN Exposed Pad

PIC16F1828T-I/GZ

Microchip Technology

IC MCU 8BIT 7KB FLASH 20UQFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-UFQFN Exposed Pad
• Supplier Device Package: 20-UQFN (4x4)

Paket: 20-UFQFN Exposed Pad

PIC16C54C-20/SO

Microchip Technology

IC MCU 8BIT 768B OTP 18SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 12
• Program Memory Size: 768B (512 x 12)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 25 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 18-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 18-SOIC

Paket: 18-SOIC (0.295", 7.50mm Width)

DSPIC33EP256GP504-I/ML

Microchip Technology

IC MCU 16BIT 256KB FLASH 44QFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 70 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 256KB (85.5K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 9x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-VQFN Exposed Pad
• Supplier Device Package: 44-QFN (8x8)

Paket: 44-VQFN Exposed Pad

AT6003-4AI

Microchip Technology

IC FPGA 80 I/O 100VQFP

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 1600
• Total RAM Bits: -
• Number of I/O: 80
• Number of Gates: 9000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TC)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

Paket: 100-TQFP

MCP3221A4T-E/OTVAO

Microchip Technology

ADC 12BIT I2C INTERFACE SOT23-5

• Number of Bits: 12
• Sampling Rate (Per Second): 22.3k
• Number of Inputs: 1
• Input Type: Single Ended
• Data Interface: I²C
• Configuration: S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: SAR
• Reference Type: Supply
• Voltage - Supply, Analog: 2.7 V ~ 5.5 V
• Voltage - Supply, Digital: 2.7 V ~ 5.5 V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: SOT-23-5
• Mounting Type: -

Paket: SC-74A, SOT-753

PIC32MZ1024EFH100T-E/GJX

Microchip Technology

1024KB FLASH 512KB RAM NO CRYPTO

• Core Processor: MIPS32® M-Class
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number of I/O: 78
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-TFBGA (7x7)

Paket: 100-TFBGA

47L64-I-SN

Microchip Technology

IC EERAM 64KBIT I2C 1MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EERAM
• Technology: EEPROM, SRAM
• Memory Size: 64Kbit
• Memory Interface: I2C
• Clock Frequency: 1 MHz
• Write Cycle Time - Word, Page: -
• Access Time: 550 ns
• Voltage - Supply: 2.7V ~ 3.6V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

Paket: -

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1N4553A

Microchip Technology

DIODE ZENER 5.6V 50W DO5

• Voltage - Zener (Nom) (Vz): 5.6 V
• Tolerance: ±10%
• Power - Max: 50 W
• Impedance (Max) (Zzt): 0.12 Ohms
• Current - Reverse Leakage @ Vr: 20 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5 (DO-203AB)

Paket: -

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JAN1N6339CUS

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 43 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 65 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 33 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

Paket: -

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UM4302B

Microchip Technology

SI PPIN HERMETIC GLASS AXIAL

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 200V
• Current - Max: -
• Capacitance @ Vr, F: 2.2pF @ 100V, 1MHz
• Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
• Power Dissipation (Max): 10 W
• Operating Temperature: -
• Package / Case: Axial
• Supplier Device Package: Axial

Paket: -

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RT4G150-1CQG352PROTO

Microchip Technology

RT4G150-1CQG352PROTO

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 151824
• Total RAM Bits: 5325
• Number of I/O: 166
• Number of Gates: -
• Voltage - Supply: 1.14V ~ 1.26V
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 125°C (TJ)
• Package / Case: 352-BFCQFP Exposed Pad and Tie Bar
• Supplier Device Package: 352-QFP (48x48)

Paket: -

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CDLL4954

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): -
• Tolerance: -
• Power - Max: -
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: -
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

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MCP47CMB28-20E-ST

Microchip Technology

IC DAC 12BIT V-OUT 20TSSOP

• Number of Bits: 12
• Number of D/A Converters: 8
• Settling Time: 16µs (Typ)
• Output Type: Voltage - Buffered
• Differential Output: No
• Data Interface: I2C
• Reference Type: External, Internal, Supply
• Voltage - Supply, Analog: 1.8V ~ 5.5V
• Voltage - Supply, Digital: 1.8V ~ 5.5V
• INL/DNL (LSB): -, ±1 (Max)
• Architecture: R-2R
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP
• Mounting Type: Surface Mount

Paket: -

JAN1N6349US-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 110 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 500 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 84 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

Paket: -

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2N6327

Microchip Technology

TRANS PNP 80V 30A TO3

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 30 A
• Voltage - Collector Emitter Breakdown (Max): 80 V
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: 200 W
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: Through Hole
• Package / Case: TO-204AA, TO-3
• Supplier Device Package: TO-3

Paket: -

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1N4114UR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 20 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 150 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 15.2 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TA)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA (Glass)
• Supplier Device Package: DO-213AA

Paket: -

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