Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
TRIPLE CORE 6M FLASH 768K RAM
|
Paket: 256-LBGA |
Lager7.344 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
Paket: 208-LQFP |
Lager4.208 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 177 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 208-LQFP | 208-TQFP (28x28) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
Paket: 208-LQFP |
Lager5.264 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 177 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 208-LQFP | 208-TQFP (28x28) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORES
|
Paket: 416-BGA |
Lager6.288 |
|
32-Bit Tri-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | - | 8MB (8M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 16b Sigma-Delta, eQADC | Internal | -40°C ~ 125°C (TA) | - | 416-BGA | 416-MAPBGA (27x27) |
||
NXP |
ULTRA RELIABLE MCU WITH VAST PER
|
Paket: 176-LQFP Exposed Pad |
Lager2.592 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORES
|
Paket: 416-BGA |
Lager6.768 |
|
32-Bit Tri-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | - | 8MB (8M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 16b Sigma-Delta, eQADC | Internal | -40°C ~ 125°C (TA) | - | 416-BGA | 416-MAPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORES
|
Paket: 416-BGA |
Lager7.104 |
|
32-Bit Tri-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | - | 8MB (8M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 16b Sigma-Delta, eQADC | Internal | -40°C ~ 125°C (TA) | - | 416-BGA | 416-MAPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORES
|
Paket: 416-BGA |
Lager7.888 |
|
32-Bit Tri-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | - | 8MB (8M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 16b Sigma-Delta, eQADC | Internal | -40°C ~ 125°C (TA) | - | 416-BGA | 416-MAPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
Paket: 473-LFBGA |
Lager5.584 |
|
32-Bit Dual-Core | 180MHz | CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, POR, PWM, WDT | - | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 384K x 8 | 1.14 V ~ 5.5 V | A/D 34x12b | Internal | -40°C ~ 105°C (TA) | - | 473-LFBGA | 473-MAPBGA (19x19) |
||
NXP |
TRIPLE CORE 6M FLASH 768K RAM
|
Paket: 256-LBGA |
Lager3.200 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU POWER ARCH 2MB FL
|
Paket: 208-BGA |
Lager4.080 |
|
32-Bit | 116MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 155 | 2MB (2M x 8) | FLASH | - | 592K x 8 | 3 V ~ 5.5 V | A/D 36x10b | Internal | -40°C ~ 125°C (TA) | - | 208-BGA | 208-MAPBGA (17x17) |
||
NXP |
IC SRAM 2M FLASH 257MAPBGA
|
Paket: 257-LFBGA |
Lager5.872 |
|
32-Bit Tri-Core | 180MHz, 240MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire | POR, PWM, WDT | - | 2MB (2M x 8) | FLASH | 64K x 8 | 1.5M x 8 | 1.19 V ~ 5.5 V | A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b | Internal | -40°C ~ 125°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
2M FLASH 1.5MB SRAM 2X
|
Paket: 257-LFBGA |
Lager3.488 |
|
32-Bit Tri-Core | 180MHz, 240MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire | POR, PWM, WDT | - | 2MB (2M x 8) | FLASH | 64K x 8 | 1.5M x 8 | 1.19 V ~ 5.5 V | A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b | Internal | -40°C ~ 125°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
32 BIT6MB FLASH768 RAM
|
Paket: 256-LBGA |
Lager5.648 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
Paket: 208-LQFP |
Lager6.928 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 177 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP | 208-TQFP (28x28) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORES
|
Paket: 416-BGA |
Lager6.336 |
|
32-Bit Tri-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | - | 8MB (8M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 16b Sigma-Delta, eQADC | Internal | -40°C ~ 125°C (TA) | - | 416-BGA | 416-MAPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORES
|
Paket: 416-BGA |
Lager6.928 |
|
32-Bit Tri-Core | 264MHz | EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | - | 8MB (8M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 16b Sigma-Delta, eQADC | Internal | -40°C ~ 125°C (TA) | - | 416-BGA | 416-MAPBGA (27x27) |
||
NXP |
TRIPLE CORE 6M FLASH
|
Paket: 176-LQFP Exposed Pad |
Lager5.232 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
TRIPLE CORE 6M FLASH 768K RAM
|
Paket: 256-LBGA |
Lager3.520 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
3M FLASH256K RAM120MHZ
|
Paket: 256-LBGA |
Lager4.096 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
Paket: 256-LBGA |
Lager4.640 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
NXP 32-BIT MCU POWER ARCH 2MB
|
Paket: 208-BGA |
Lager38.880 |
|
32-Bit | 116MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 155 | 2MB (2M x 8) | FLASH | - | 592K x 8 | 3 V ~ 5.5 V | A/D 36x10b | Internal | -40°C ~ 105°C (TA) | - | 208-BGA | 208-MAPBGA (17x17) |
||
NXP |
TRIPLE CORE 6M FLASH 768K RAM
|
Paket: 256-LBGA |
Lager2.192 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
Paket: 208-LQFP |
Lager6.144 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 177 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP | 208-TQFP (28x28) |
||
NXP |
TRIPLE CORE, 6M FLASH
|
Paket: 176-LQFP Exposed Pad |
Lager5.424 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
Paket: 208-LQFP |
Lager5.040 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 177 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 125°C (TA) | - | 208-LQFP | 208-TQFP (28x28) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
Paket: 176-LQFP |
Lager7.728 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
Paket: 256-LBGA |
Lager6.496 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 199 | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 256-LBGA | 256-MAPBGA |