Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MCU 32BIT 1.5MB FLASH 208BGA
|
Paket: 208-BGA |
Lager5.472 |
|
32-Bit Dual-Core | 80MHz | CAN, EBI/EMI, I2C, SCI, SPI | DMA, POR, PWM, WDT | 144 | 1.5MB (1.5M x 8) | FLASH | - | 80K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 208-BGA | 208-MAPBGA (17x17) |
||
NXP |
IC MCU 16BIT 256KB FLASH 112LQFP
|
Paket: 112-LQFP |
Lager5.360 |
|
16-Bit | 25MHz | CAN, I2C, SCI, SPI | PWM, WDT | 91 | 256KB (256K x 8) | FLASH | 4K x 8 | 12K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 85°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
Paket: - |
Lager4.768 |
|
32-Bit Dual-Core | 500MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | - | - |
||
NXP |
IC MCU 32BIT ROMLESS 144LQFP
|
Paket: 144-LQFP |
Lager5.872 |
|
32-Bit | 16MHz | EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | 15 | - | ROMless | - | 2K x 8 | 4.5 V ~ 5.5 V | - | Internal | -40°C ~ 105°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
IC MCU 32BIT ROMLESS 144LQFP
|
Paket: 144-LQFP |
Lager7.552 |
|
32-Bit | 20MHz | EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | 15 | - | ROMless | - | 2K x 8 | 4.5 V ~ 5.5 V | - | Internal | -40°C ~ 85°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
IC MCU 16BIT 32KB FLASH 80QFP
|
Paket: 80-QFP |
Lager3.984 |
|
16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 63 | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5 V ~ 5.5 V | A/D 8x10b | External | -40°C ~ 105°C (TA) | - | 80-QFP | 80-QFP (14x14) |
||
NXP |
IC MCU 8BIT 32KB FLASH 80QFP
|
Paket: 80-QFP |
Lager6.592 |
|
16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 63 | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5 V ~ 5.5 V | A/D 8x10b | External | -40°C ~ 125°C (TA) | - | 80-QFP | 80-QFP (14x14) |
||
NXP |
IC MCU 32BIT 1MB FLASH 324TEBGA
|
Paket: 324-BBGA |
Lager7.616 |
|
32-Bit | 80MHz | CAN, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 220 | 1MB (1M x 8) | FLASH | - | 64K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 324-BBGA | 324-TEPBGA (23x23) |
||
NXP |
IC MCU 32BIT 2MB FLASH 208TQFP
|
Paket: 208-LQFP |
Lager5.696 |
|
32-Bit | 120MHz | CAN, I2C, LIN, SCI, SPI | DMA, POR, PWM, WDT | 177 | 2MB (2M x 8) | FLASH | 4K x 16 | 160K x 8 | 3 V ~ 5.5 V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP | 208-TQFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
Paket: - |
Lager4.224 |
|
32-Bit Dual-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | - | - |
||
NXP |
IC MCU 16BIT 256KB FLASH 80QFP
|
Paket: 80-QFP |
Lager6.208 |
|
16-Bit | 25MHz | CAN, I2C, SCI, SPI | POR, PWM, WDT | 59 | 256KB (256K x 8) | FLASH | 2K x 8 | 4K x 8 | 2.35 V ~ 5.5 V | A/D 8x10b | Internal | -40°C ~ 125°C (TA) | - | 80-QFP | 80-QFP (14x14) |
||
NXP |
IC MCU 32BIT 6MB FLASH 176LQFP
|
Paket: 176-LQFP Exposed Pad |
Lager5.296 |
|
32-Bit Dual-Core | 80MHz/160MHz | CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
IC MCU 32BIT 4MB FLASH 176LQFP
|
Paket: 176-LQFP |
Lager6.304 |
|
32-Bit | 80MHz | CAN, EBI/EMI, LIN, SCI, SPI | DMA, POR, PWM, WDT | 84 | 4MB (4M x 8) | FLASH | - | 192K x 8 | 1.14 V ~ 1.32 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
IC MCU 32BIT 1.5MB FLASH 144LQFP
|
Paket: 144-LQFP |
Lager6.880 |
|
32-Bit Dual-Core | 66MHz | CAN, EBI/EMI, I2C, SCI, SPI | DMA, POR, PWM, WDT | 111 | 1.5MB (1.5M x 8) | FLASH | - | 80K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
IC MCU 32BIT ROMLESS 360PBGA
|
Paket: 360-BBGA |
Lager5.456 |
|
32-Bit | 266MHz | I2C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | 132 | - | ROMless | - | 32K x 8 | 1.35 V ~ 3.6 V | - | Internal | 0°C ~ 70°C (TA) | - | 360-BBGA | 360-PBGA (23x23) |
||
NXP |
IC MCU 32BIT ROMLESS 360PBGA
|
Paket: 360-BBGA |
Lager6.336 |
|
32-Bit | 200MHz | I2C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | 132 | - | ROMless | - | 32K x 8 | 1.35 V ~ 3.6 V | - | Internal | -40°C ~ 85°C (TA) | - | 360-BBGA | 360-PBGA (23x23) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
Paket: - |
Lager7.904 |
|
32-Bit Dual-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 115 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | - | - |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
Paket: - |
Lager7.104 |
|
32-Bit Dual-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 115 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | - | - |
||
NXP |
IC MCU 32BIT 1.5MB FLASH 176LQFP
|
Paket: 176-LQFP |
Lager6.640 |
|
32-Bit | 66MHz | CAN, EBI/EMI, I2C, SCI, SPI | DMA, POR, PWM, WDT | 137 | 1.5MB (1.5M x 8) | FLASH | - | 64K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
IC MCU 16BIT 60KB FLASH 80QFP
|
Paket: 80-QFP |
Lager15.396 |
|
16-Bit | 8MHz | CAN, MI Bus, SCI, SPI | POR, PWM, WDT | 48 | 60KB (60K x 8) | FLASH | 1K x 8 | 2K x 8 | 4.5 V ~ 5.5 V | A/D 8x8/10b | Internal | -40°C ~ 125°C (TA) | - | 80-QFP | 80-QFP (14x14) |
||
NXP |
IC MCU 32BIT 1.5MB FLASH 176LQFP
|
Paket: 176-LQFP |
Lager4.944 |
|
32-Bit Dual-Core | 66MHz | CAN, EBI/EMI, I2C, SCI, SPI | DMA, POR, PWM, WDT | 137 | 1.5MB (1.5M x 8) | FLASH | - | 80K x 8 | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
Paket: - |
Lager2.896 |
|
32-Bit Dual-Core | 500MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | - | - |
||
NXP |
IC MCU 32BIT 6MB FLASH 176LQFP
|
Paket: 176-LQFP Exposed Pad |
Lager7.120 |
|
32-Bit Dual-Core | 80MHz/160MHz | CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
IC MCU 32BIT 4MB FLASH 176LQFP
|
Paket: 176-LQFP Exposed Pad |
Lager3.360 |
|
32-Bit Tri-Core | 80MHz/160MHz | CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
||
NXP |
IC MCU 16BIT 256KB FLASH 112LQFP
|
Paket: 112-LQFP |
Lager7.536 |
|
16-Bit | 25MHz | CAN, I2C, SCI, SPI | PWM, WDT | 91 | 256KB (256K x 8) | FLASH | 4K x 8 | 12K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | -40°C ~ 105°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
IC MCU 16BIT 256KB FLASH 112LQFP
|
Paket: 112-LQFP |
Lager7.824 |
|
16-Bit | 25MHz | CAN, I2C, SCI, SPI | PWM, WDT | 91 | 256KB (256K x 8) | FLASH | 4K x 8 | 12K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | -40°C ~ 125°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
IC MCU 32BIT 4MB FLASH 252MAPBGA
|
Paket: 252-LFBGA |
Lager5.856 |
|
32-Bit Tri-Core | 200MHz | CAN, Ethernet, I2C, LIN, SCI, SPI, UART/USART | DMA, LVD, POR, Zipwire | - | 4MB (4M x 8) | FLASH | - | 256K x 8 | 3.5 V ~ 5.5 V | A/D 12b SAR, 16b Sigma-Delta | Internal | -40°C ~ 125°C (TA) | - | 252-LFBGA | 252-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
Paket: 364-LFBGA |
Lager6.080 |
|
32-Bit Dual-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |