Bild |
Teilenummer |
Hersteller |
Beschreibung |
Paket |
Lager |
Anzahl |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MCU 32BIT ROMLESS 388PBGA
|
Paket: 388-BBGA |
Lager3.536 |
|
32-Bit | 200MHz | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | DMA, PWM, WDT | 99 | - | ROMless | - | 32K x 8 | 1.43 V ~ 1.58 V | - | External | 0°C ~ 70°C (TA) | - | 388-BBGA | 388-PBGA (27x27) |
||
NXP |
IC MCU 32BIT 256KB FLASH 256BGA
|
Paket: 256-LBGA |
Lager4.016 |
|
32-Bit | 80MHz | CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 142 | 256KB (256K x 8) | FLASH | - | 64K x 8 | 2.7 V ~ 3.6 V | A/D 8x10b | External | -40°C ~ 85°C (TA) | - | 256-LBGA | 256-MAPBGA |
||
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
|
Paket: 112-LQFP |
Lager3.808 |
|
16-Bit | 8MHz | CAN, I2C, SCI, SPI | POR, PWM, WDT | 67 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5 V ~ 5.5 V | A/D 16x8/10b | Internal | -40°C ~ 125°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
IC MCU 16BIT 512KB FLASH 144LQFP
|
Paket: 144-LQFP |
Lager17.148 |
|
16-Bit | 60MHz | CAN, EBI/EMI, SCI, SPI | POR, PWM, Temp Sensor, WDT | 62 | 512KB (256K x 16) | FLASH | - | 18K x 16 | 2.25 V ~ 3.6 V | A/D 16x12b | External | -40°C ~ 125°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
IC MCU 32BIT 1.5MB FLASH 416BGA
|
Paket: 416-BBGA |
Lager6.880 |
|
32-Bit | 132MHz | CAN, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 220 | 1.5MB (1.5M x 8) | FLASH | - | 64K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
IC MCU 32BIT 1.5MB FLASH 416BGA
|
Paket: 416-BBGA |
Lager6.064 |
|
32-Bit | 132MHz | CAN, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 220 | 1.5MB (1.5M x 8) | FLASH | - | 64K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
IC MCU 32BIT 1.5MB FLASH 473BGA
|
Paket: 473-LFBGA |
Lager6.168 |
|
32-Bit | 180MHz | CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI | DMA, POR, PWM, WDT | - | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 384K x 8 | 1.14 V ~ 1.32 V | A/D 34x12b | Internal | -40°C ~ 105°C (TA) | - | 473-LFBGA | 473-MAPBGA (19x19) |
||
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
|
Paket: 112-LQFP |
Lager5.200 |
|
16-Bit | 8MHz | CAN, I2C, SCI, SPI | POR, PWM, WDT | 69 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5 V ~ 5.5 V | A/D 16x8/10b | Internal | -40°C ~ 105°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
|
Paket: 112-LQFP |
Lager6.960 |
|
16-Bit | 8MHz | CAN, I2C, SCI, SPI | POR, PWM, WDT | 69 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5 V ~ 5.5 V | A/D 16x8/10b | Internal | -40°C ~ 105°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
IC MCU 32BIT ROMLESS 256MAPBGA
|
Paket: 256-LBGA |
Lager5.088 |
|
32-Bit | 150MHz | CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART | DMA, WDT | 97 | - | ROMless | - | 64K x 8 | 1.4 V ~ 1.6 V | - | External | -40°C ~ 85°C (TA) | - | 256-LBGA | 256-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 388PBGA
|
Paket: 388-BBGA |
Lager7.440 |
|
32-Bit | 56MHz | CAN, EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | 64 | - | ROMless | - | 32K x 8 | 2.5 V ~ 2.7 V | A/D 32x10b | External | -40°C ~ 125°C (TA) | - | 388-BBGA | 388-PBGA (27x27) |
||
NXP |
IC MCU 32BIT 1.5MB FLASH 324BGA
|
Paket: 324-BBGA |
Lager3.488 |
|
32-Bit | 132MHz | CAN, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 220 | 1.5MB (1.5M x 8) | FLASH | - | 64K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 324-BBGA | 324-TEPBGA (23x23) |
||
NXP |
IC MCU 32BIT 1.5MB FLASH 324BGA
|
Paket: 324-BBGA |
Lager4.496 |
|
32-Bit | 132MHz | CAN, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 220 | 1.5MB (1.5M x 8) | FLASH | - | 64K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 324-BBGA | 324-TEPBGA (23x23) |
||
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
|
Paket: 112-LQFP |
Lager78.384 |
|
16-Bit | 8MHz | CAN, I2C, SCI, SPI | POR, PWM, WDT | 67 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5 V ~ 5.5 V | A/D 16x8/10b | Internal | -40°C ~ 85°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
|
Paket: 112-LQFP |
Lager7.712 |
|
16-Bit | 8MHz | CAN, I2C, SCI, SPI | POR, PWM, WDT | 67 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5 V ~ 5.5 V | A/D 16x8/10b | Internal | -40°C ~ 105°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
IC MCU 32BIT 512KB FLASH 388BGA
|
Paket: 388-BBGA |
Lager4.656 |
|
32-Bit | 40MHz | CAN, EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | 56 | 512KB (512K x 8) | FLASH | - | 32K x 8 | 2.5 V ~ 2.7 V | A/D 16x10b | External | -40°C ~ 85°C (TA) | - | 388-BBGA | 388-PBGA (27x27) |
||
NXP |
IC MCU 32BIT ROMLESS 388PBGA
|
Paket: 388-BBGA |
Lager6.048 |
|
32-Bit | 40MHz | CAN, EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | 64 | - | ROMless | - | 32K x 8 | 2.5 V ~ 2.7 V | A/D 32x10b | External | -40°C ~ 85°C (TA) | - | 388-BBGA | 388-PBGA (27x27) |
||
NXP |
IC MCU 32BIT ROMLESS 388PBGA
|
Paket: 388-BBGA |
Lager14.472 |
|
32-Bit | 40MHz | CAN, EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | 64 | - | ROMless | - | 32K x 8 | 2.5 V ~ 2.7 V | A/D 32x10b | External | -40°C ~ 85°C (TA) | - | 388-BBGA | 388-PBGA (27x27) |
||
NXP |
IC MCU 8BIT 20KB OTP 52PLCC
|
Paket: 52-LCC (J-Lead) |
Lager21.660 |
|
8-Bit | 4MHz | SCI, SPI | POR, WDT | 38 | 20KB (20K x 8) | OTP | 512 x 8 | 768 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | - | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 32BIT 1MB FLASH 257MAPBGA
|
Paket: 257-LFBGA |
Lager6.432 |
|
32-Bit | 150MHz | CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI | DMA, POR, PWM, WDT | - | 1MB (1M x 8) | FLASH | 64K x 8 | 256K x 8 | 1.14 V ~ 1.32 V | A/D 22x12b | Internal | -40°C ~ 105°C (TA) | - | 257-LFBGA | 257-MAPBGA (14x14) |
||
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
|
Paket: 112-LQFP |
Lager7.488 |
|
16-Bit | 8MHz | CAN, I2C, SCI, SPI | POR, PWM, WDT | 69 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5 V ~ 5.5 V | A/D 16x8/10b | Internal | -40°C ~ 85°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
|
Paket: 112-LQFP |
Lager7.648 |
|
16-Bit | 8MHz | CAN, I2C, SCI, SPI | POR, PWM, WDT | 69 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5 V ~ 5.5 V | A/D 16x8/10b | Internal | -40°C ~ 85°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
|
Paket: 112-LQFP |
Lager4.768 |
|
16-Bit | 8MHz | CAN, I2C, SCI, SPI | POR, PWM, WDT | 69 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5 V ~ 5.5 V | A/D 16x8/10b | Internal | -40°C ~ 105°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
|
Paket: 112-LQFP |
Lager3.136 |
|
16-Bit | 8MHz | CAN, I2C, SCI, SPI | POR, PWM, WDT | 69 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5 V ~ 5.5 V | A/D 16x8/10b | Internal | -40°C ~ 105°C (TA) | - | 112-LQFP | 112-LQFP (20x20) |
||
NXP |
IC MCU 32BIT ROMLESS 388PBGA
|
Paket: 388-BBGA |
Lager3.952 |
|
32-Bit | 200MHz | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | DMA, PWM, WDT | 99 | - | ROMless | - | 32K x 8 | 1.43 V ~ 1.58 V | - | External | 0°C ~ 70°C (TA) | - | 388-BBGA | 388-PBGA (27x27) |
||
NXP |
IC MCU 8BIT 20KB OTP 52PLCC
|
Paket: 52-LCC (J-Lead) |
Lager5.504 |
|
8-Bit | 2MHz | SCI, SPI | POR, WDT | 38 | 20KB (20K x 8) | OTP | 512 x 8 | 768 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | -40°C ~ 105°C (TA) | - | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
NXP |
IC MCU 8BIT 20KB OTP 52PLCC
|
Paket: 52-LCC (J-Lead) |
Lager16.224 |
|
8-Bit | 3MHz | SCI, SPI | POR, WDT | 38 | 20KB (20K x 8) | OTP | 512 x 8 | 768 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | - | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT 20KB OTP 52PLCC
|
Paket: 52-LCC (J-Lead) |
Lager2.560 |
|
8-Bit | 4MHz | SCI, SPI | POR, WDT | 38 | 20KB (20K x 8) | OTP | 512 x 8 | 768 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | -40°C ~ 105°C (TA) | - | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |