NXP Produkte

MMPF0100F3ANES

NXP

IC PWR MGMT I.MX6 56QFN

• Applications: Converter, i.MX6
• Voltage - Input: 2.8 V ~ 4.5 V
• Number of Outputs: 12
• Voltage - Output: Multiple
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN (8x8)

Paket: 56-VFQFN Exposed Pad

PIP3105-P,127

NXP

TOPFET LOGIC LVL 50V TO220AB

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 50V (Max)
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 16A
• Rds On (Typ): 36 mOhm
• Input Type: Non-Inverting
• Features: -
• Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
• Operating Temperature: -
• Package / Case: TO-220-3
• Supplier Device Package: TO-220AB

Paket: TO-220-3

TZA3011AVH/C2,551

NXP

IC LASER DRIVER 3.2GBPS 32-HBCC

• Type: Laser Diode Driver (Fiber Optic)
• Data Rate: 3.2Gbps
• Number of Channels: 1
• Voltage - Supply: 3.14 V ~ 3.47 V
• Current - Supply: 40mA
• Current - Modulation: 100mA
• Current - Bias: 100mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-HBCC
• Supplier Device Package: 32-HBCC (5x5)
• Mounting Type: Surface Mount

Paket: 32-HBCC

TEA1533AT/N1,518

NXP

IC CTRLR SMPS GREEN OVP 14SOIC

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: 650V
• Topology: Flyback
• Voltage - Start Up: 11V
• Voltage - Supply (Vcc/Vdd): 8.7 V ~ 20 V
• Duty Cycle: -
• Frequency - Switching: 25kHz ~ 175kHz
• Power (Watts): 250W
• Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit
• Control Features: -
• Operating Temperature: -20°C ~ 145°C (TJ)
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO
• Mounting Type: Surface Mount

Paket: 14-SOIC (0.154", 3.90mm Width)

74LVC646APW,118

NXP

IC TRANSCVR 8BIT N-INV 24TSSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

Paket: 24-TSSOP (0.173", 4.40mm Width)

74ABT544DB,112

NXP

IC TRANSCVR 3-ST 8BIT INV 24SSOP

• Logic Type: Transceiver, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

Paket: 24-SSOP (0.209", 5.30mm Width)

SC28L91A1A,518

NXP

IC UART SINGLE W/FIFO 44-PLCC

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 1, UART
• FIFO's: 16 Byte
• Protocol: -
• Data Rate (Max): 1Mbps
• Voltage - Supply: 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

Paket: 44-LCC (J-Lead)

MCZ145012EGR2

NXP

IC SMOKE DETECT PHOTOELEC 16SOIC

• Type: Smoke Detector
• Input Type: Photoelectric
• Output Type: Voltage
• Interface: -
• Current - Supply: 12µA
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

Paket: 16-SOIC (0.295", 7.50mm Width)

MC33901SNEF

NXP

CANHS 8SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

PTN5100DABSBZ

NXP

IC USB PD PHY TYPE C 20HVQFN

• Protocol: USB
• Function: Controller
• Interface: USB
• Standards: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-HVQFN (4x4)

Paket: 20-VFQFN Exposed Pad

P1010NSE5DFA

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Security; SEC 4.4
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 425-FBGA
• Supplier Device Package: 425-TEPBGA I (19x19)

Paket: 425-FBGA

P2040NSN7FLC

NXP

IC MPU Q OR IQ 667MHZ 780FCBGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (5)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: -
• Supplier Device Package: 780-FCPBGA (23x23)

Paket: -

LS1012ASE7HKA

NXP

QORIQ 64-BIT ARM MPU 800MHZ STD

• Core Processor: ARM? Cortex?-A53
• Number of Cores/Bus Width: 1 Core, 64-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: SATA 6Gbps (1)
• USB: USB 2.0 (1), USB 3.0 + PHY
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: ARM TZ
• Package / Case: 211-VFLGA
• Supplier Device Package: 211-FCLGA (9.6x9.6)

Paket: 211-VFLGA

SPC5515SBMLQ66

NXP

IC MCU 32BIT 768KB FLASH 144LQFP

• Core Processor: e200z1
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 111
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Paket: 144-LQFP

MC908QB4MDTE

NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

Paket: 16-TSSOP (0.173", 4.40mm Width)

LPC2132FHN64/01,55

NXP

IC MCU 32BIT 64KB FLASH 64HVQFN

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 47
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-HVQFN (9x9)

Paket: 64-VFQFN Exposed Pad

MK50DX256ZCLQ10

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 96
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 41x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Paket: 144-LQFP

SPC5605BK0VLQ6

NXP

IC MCU 32BIT 768KB FLASH 144LQFP

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 121
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 16
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 15x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Paket: 144-LQFP

LPC1115JET48/303QL

NXP

IC MCU 32BIT 64KB FLASH 48TFBGA

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 42
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-TFBGA
• Supplier Device Package: 48-TFBGA (4.5x4.5)

Paket: 48-TFBGA

MC9S08QA2CPAE

NXP

IC MCU 8BIT 2KB FLASH 8DIP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 4
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 160 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

Paket: 8-DIP (0.300", 7.62mm)

MK22FN1M0AVMC12

NXP

IC MCU 32BIT 1MB FLASH 121MAPBGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 38x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-LFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

Paket: 121-LFBGA

MC9S08QD4CSC

NXP

IC MCU 8BIT 4KB FLASH 8SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 4
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

Paket: 8-SOIC (0.154", 3.90mm Width)

PCK9448BD,157

NXP

IC CLK BUFFER 2:12 350MHZ 32LQFP

• Type: Fanout Buffer (Distribution), Multiplexer
• Number of Circuits: 1
• Ratio - Input:Output: 2:12
• Differential - Input:Output: Yes/Yes
• Input: LVCMOS, LVPECL
• Output: LVCMOS
• Frequency - Max: 350MHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

Paket: 32-LQFP

MC88916DW70

NXP

IC CLK BUF CISC 70MHZ 1CIRC

• PLL: Yes
• Main Purpose: CISC/RISC Microprocessor
• Input: TTL
• Output: CMOS, TTL
• Number of Circuits: 1
• Ratio - Input:Output: 1:6
• Differential - Input:Output: No/No
• Frequency - Max: 70MHz
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

Paket: 20-SOIC (0.295", 7.50mm Width)

IP4286CZ6-TBF,115

NXP

TVS DIODE 6XSON

• Type: Steering (Rail to Rail)
• Unidirectional Channels: 4
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): -
• Voltage - Breakdown (Min): 6V
• Voltage - Clamping (Max) @ Ipp: -
• Current - Peak Pulse (10/1000µs): -
• Power - Peak Pulse: -
• Power Line Protection: Yes
• Applications: General Purpose
• Capacitance @ Frequency: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT886 (1.45x1)

Paket: 6-XFDFN

MMA2301D

NXP

ACCELEROMETER 225G ANALOG 16SOIC

• Type: Analog
• Axis: X
• Acceleration Range: ±225g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 10
• Bandwidth: 400Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

Paket: 16-SOIC (0.295", 7.50mm Width)

SPC5748CBK0AVKU2

NXP

DUAL CORE 6M FLASH 768K RAM F

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/160MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 129
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP (24x24)

Paket: 176-LQFP Exposed Pad

MIMX8US3DVK08SC

NXP

I.MX8ULP, SOLO 800MHZ

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

Request a Quote