Page 144 - NXP Produkte | Heisener Electronics

Teilenummer	Hersteller	Beschreibung	Paket	Lager
BF512,235	NXP	JFET N-CH 20V 30MA SOT23 Transistor Type: N-Channel JFET Frequency: 100MHz Gain: - Voltage - Test: 10V Current Rating: 30mA Noise Figure: 1.5dB Current - Test: 5mA Power - Output: - Voltage - Rated: 20V Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	Paket: TO-236-3, SC-59, SOT-23-3	Lager5.520
LD6836CX4/18H,315	NXP	IC REG LINEAR 1.8V 300MA 4WLCSP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.8V Voltage - Output (Max): - Voltage Dropout (Max): 0.16V @ 300mA Current - Output: 300mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XFBGA, WLCSP Supplier Device Package: 4-WLCSP (0.76x0.76)	Paket: 4-XFBGA, WLCSP	Lager6.000
TDA18253HN/C1,557	NXP	IC DGTL CABLE SIL TUNER 48HVQFN Type: Silicon Tuner Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	Paket: 48-VFQFN Exposed Pad	Lager4.192
MPC8547VTAQGD	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Paket: 783-BBGA, FCBGA	Lager5.792
MC7448HX1267ND	NXP	IC MPU MPC74XX 1.267GHZ 360BGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	Paket: 360-BCBGA, FCCBGA	Lager3.840
MCIMX6L8DVN10AA	NXP	IC MPU I.MX6SL 1.0GHZ 432MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (3) Voltage - I/O: 1.2V, 1.8V, 3.0V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 432-TFBGA Supplier Device Package: 432-MAPBGA (13x13)	Paket: 432-TFBGA	Lager6.656
MCIMX6Y2DVM05AA	NXP	I.MX 32-BIT MPU, ARM CORTEX-A7 C Core Processor: ARM? Cortex?-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON? MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14x14)	Paket: 289-LFBGA	Lager4.784
S912XET256J2MAAR	NXP	IC MCU 16BIT 256KB FLASH 80QFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	Paket: 80-QFP	Lager2.672
MC9S08QG4CFKE	NXP	IC MCU 8BIT 4KB FLASH 24QFN Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN-EP (4x4)	Paket: 24-VFQFN Exposed Pad	Lager9.240
MCF5328CVM240	NXP	IC MCU 32BIT ROMLESS 256MAPBGA Core Processor: Coldfire V3 Core Size: 32-Bit Speed: 240MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Number of I/O: 94 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	Paket: 256-LBGA	Lager7.328
MC9S12DP512MPVE	NXP	IC MCU 16BIT 512KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Paket: 112-LQFP	Lager19.272
ADC1412D125HN/C1:5	NXP	ADC 14BIT SPI 125MSPS 64HVQFN Number of Bits: 14 Sampling Rate (Per Second): 125M Number of Inputs: 2 Input Type: Differential, Single Ended Data Interface: LVDS - Parallel, Parallel Configuration: S/H-ADC Ratio - S/H:ADC: 1:1 Number of A/D Converters: 2 Architecture: Pipelined Reference Type: External, Internal Voltage - Supply, Analog: 2.85 V ~ 3.4 V Voltage - Supply, Digital: 1.65 V ~ 3.6 V Features: Simultaneous Sampling Operating Temperature: -40°C ~ 85°C Package / Case: 64-VFQFN Exposed Pad Supplier Device Package: 64-HVQFN (9x9) Mounting Type: -	Paket: 64-VFQFN Exposed Pad	Lager2.896
PCF8583T/5,518	NXP	IC RTC CLK/CALENDAR I2C 8-SOIC Type: Clock/Calendar Features: Alarm, NVSRAM, Square Wave Output Memory Size: 240B Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD Interface: I2C, 2-Wire Serial Voltage - Supply: 2.5 V ~ 6 V Voltage - Supply, Battery: - Current - Timekeeping (Max): 10µA ~ 50µA @ 1V ~ 5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.295", 7.50mm Width) Supplier Device Package: 8-SO	Paket: 8-SOIC (0.295", 7.50mm Width)	Lager6.960
SX5148P2LCWT1	NXP	ACCELEROMETER Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Paket: -	Lager8.910
SL2ICS2001DW/V1D,3	NXP	IC I-CODE SLI UNCASED FOIL Style: Inlay Technology: Passive Frequency: 13.56MHz Memory Type: Read/Write Writable Memory: 1kB (User) Standards: ISO 15693 Operating Temperature: - Size / Dimension: -	Paket: -	Lager6.894
MC35FS6501NAE	NXP	FS6500 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	Paket: 48-LQFP Exposed Pad	Lager2.944
MC34PF4210A1ES	NXP	PF4210 Applications: Audio, Video Current - Supply: - Voltage - Supply: 2.8 V ~ 4.5 V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN-EP (8x8)	Paket: 56-VFQFN Exposed Pad	Lager5.424
TEA1999TK/1J	NXP	FLYBACK SR Applications: - Voltage - Input: - Voltage - Supply: - Current - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	Paket: 8-VDFN Exposed Pad	Lager4.064
LS1048AXE7PTA	NXP	LS1048A 1400/1800 XT WE Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Paket: -	Lager4.272
LS1048ASE7PTA	NXP	LS1048A 1400/1800 ST WE Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Paket: -	Lager6.608
MKL17Z32VFM4R	NXP	KINETIS KL17: 48MHZ CORTEX-M0+ U Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, FlexIO, SPI, UART/USART Peripherals: DMA, I²S, PWM, WDT Number of I/O: 28 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 11x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-UFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	Paket: 32-UFQFN Exposed Pad	Lager2.096
FS32K146HAT0MLQR	NXP	IC MCU 32BIT 1MB FLASH 144LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 128 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Paket: -	Request a Quote
TEA1611T-N2-518	NXP	IC CTLR RESONANT CONVERT 20-SOIC Applications: Resonant Converter Controller Voltage - Input: - Voltage - Supply: 11V ~ 13V Current - Supply: 2.4 mA Operating Temperature: -25°C ~ 70°C Mounting Type: - Package / Case: - Supplier Device Package: -	Paket: -	Request a Quote
MFS2323BMBA0EP	NXP	IC Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Paket: -	Request a Quote
PCA9420KUKZ	NXP	IC Applications: Microcontroller, MCU Current - Supply: 4.5µA Voltage - Supply: 3.3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 25-UFBGA, WLCSP Supplier Device Package: 25-WLCSP (2.09x2.09)	Paket: -	Request a Quote
MC32PF4210A4ESR2	NXP	PF4210 Applications: Audio, Video Current - Supply: - Voltage - Supply: 2.8V ~ 4.5V Operating Temperature: 0°C ~ 85°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN-EP (8x8)	Paket: -	Request a Quote
NVT4558HKX	NXP	IC SIM CARD LEVEL TRANS XQFN10 Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: - Voltage - VCCA: 1.08 V ~ 1.98 V Voltage - VCCB: 1.62 V ~ 3.6 V Input Signal: - Output Signal: - Output Type: Open Drain Data Rate: 10MHz Operating Temperature: -40°C ~ 85°C (TA) Features: - Mounting Type: Surface Mount Package / Case: 10-XFQFN Supplier Device Package: 10-XQFN (1.4x1.8)	Paket: -	Request a Quote
FH32K116LFT0VLFR	NXP	S32K116 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Paket: -	Request a Quote

BF512,235

NXP

JFET N-CH 20V 30MA SOT23

Transistor Type: N-Channel JFET
Frequency: 100MHz
Gain: -
Voltage - Test: 10V
Current Rating: 30mA
Noise Figure: 1.5dB
Current - Test: 5mA
Power - Output: -
Voltage - Rated: 20V
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

Paket: TO-236-3, SC-59, SOT-23-3

Lager5.520

LD6836CX4/18H,315

NXP

IC REG LINEAR 1.8V 300MA 4WLCSP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.8V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.16V @ 300mA
Current - Output: 300mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-XFBGA, WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)

Paket: 4-XFBGA, WLCSP

Lager6.000

TDA18253HN/C1,557

NXP

IC DGTL CABLE SIL TUNER 48HVQFN

Type: Silicon Tuner
Applications: Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

Paket: 48-VFQFN Exposed Pad

Lager4.192

MPC8547VTAQGD

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

Paket: 783-BBGA, FCBGA

Lager5.792

MC7448HX1267ND

NXP

IC MPU MPC74XX 1.267GHZ 360BGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.267GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-BCBGA, FCCBGA
Supplier Device Package: 360-FCCBGA (25x25)

Paket: 360-BCBGA, FCCBGA

Lager3.840

MCIMX6L8DVN10AA

NXP

IC MPU I.MX6SL 1.0GHZ 432MAPBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (3)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 432-TFBGA
Supplier Device Package: 432-MAPBGA (13x13)

Paket: 432-TFBGA

Lager6.656

MCIMX6Y2DVM05AA

NXP

I.MX 32-BIT MPU, ARM CORTEX-A7 C

Core Processor: ARM? Cortex?-A7
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 528MHz
Co-Processors/DSP: Multimedia; NEON? MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.8V, 3.3V
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Package / Case: 289-LFBGA
Supplier Device Package: 289-MAPBGA (14x14)

Paket: 289-LFBGA

Lager4.784

S912XET256J2MAAR

NXP

IC MCU 16BIT 256KB FLASH 80QFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

Paket: 80-QFP

Lager2.672

MC9S08QG4CFKE

NXP

IC MCU 8BIT 4KB FLASH 24QFN

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 12
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-QFN-EP (4x4)

Paket: 24-VFQFN Exposed Pad

Lager9.240

MCF5328CVM240

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

Core Processor: Coldfire V3
Core Size: 32-Bit
Speed: 240MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Number of I/O: 94
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

Paket: 256-LBGA

Lager7.328

MC9S12DP512MPVE

NXP

IC MCU 16BIT 512KB FLASH 112LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 91
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

Paket: 112-LQFP

Lager19.272

ADC1412D125HN/C1:5

NXP

ADC 14BIT SPI 125MSPS 64HVQFN

Number of Bits: 14
Sampling Rate (Per Second): 125M
Number of Inputs: 2
Input Type: Differential, Single Ended
Data Interface: LVDS - Parallel, Parallel
Configuration: S/H-ADC
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 2
Architecture: Pipelined
Reference Type: External, Internal
Voltage - Supply, Analog: 2.85 V ~ 3.4 V
Voltage - Supply, Digital: 1.65 V ~ 3.6 V
Features: Simultaneous Sampling
Operating Temperature: -40°C ~ 85°C
Package / Case: 64-VFQFN Exposed Pad
Supplier Device Package: 64-HVQFN (9x9)
Mounting Type: -

Paket: 64-VFQFN Exposed Pad

Lager2.896

PCF8583T/5,518

NXP

IC RTC CLK/CALENDAR I2C 8-SOIC

Type: Clock/Calendar
Features: Alarm, NVSRAM, Square Wave Output
Memory Size: 240B
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD
Interface: I2C, 2-Wire Serial
Voltage - Supply: 2.5 V ~ 6 V
Voltage - Supply, Battery: -
Current - Timekeeping (Max): 10µA ~ 50µA @ 1V ~ 5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 8-SO

Paket: 8-SOIC (0.295", 7.50mm Width)

Lager6.960

SX5148P2LCWT1

NXP

ACCELEROMETER

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

Paket: -

Lager8.910

SL2ICS2001DW/V1D,3

NXP

IC I-CODE SLI UNCASED FOIL

Style: Inlay
Technology: Passive
Frequency: 13.56MHz
Memory Type: Read/Write
Writable Memory: 1kB (User)
Standards: ISO 15693
Operating Temperature: -
Size / Dimension: -

Paket: -

Lager6.894

MC35FS6501NAE

NXP

FS6500

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

Paket: 48-LQFP Exposed Pad

Lager2.944

MC34PF4210A1ES

NXP

PF4210

Applications: Audio, Video
Current - Supply: -
Voltage - Supply: 2.8 V ~ 4.5 V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN-EP (8x8)

Paket: 56-VFQFN Exposed Pad

Lager5.424

TEA1999TK/1J

NXP

FLYBACK SR

Applications: -
Voltage - Input: -
Voltage - Supply: -
Current - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Supplier Device Package: 8-HVSON (3x3)

Paket: 8-VDFN Exposed Pad

Lager4.064

LS1048AXE7PTA

NXP

LS1048A 1400/1800 XT WE

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

Paket: -

Lager4.272

LS1048ASE7PTA

NXP

LS1048A 1400/1800 ST WE

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

Paket: -

Lager6.608

MKL17Z32VFM4R

NXP

KINETIS KL17: 48MHZ CORTEX-M0+ U

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I²C, FlexIO, SPI, UART/USART
Peripherals: DMA, I²S, PWM, WDT
Number of I/O: 28
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 11x16b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-UFQFN Exposed Pad
Supplier Device Package: 32-QFN (5x5)

Paket: 32-UFQFN Exposed Pad

Lager2.096

FS32K146HAT0MLQR

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 128
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

Paket: -

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TEA1611T-N2-518

NXP

IC CTLR RESONANT CONVERT 20-SOIC

Applications: Resonant Converter Controller
Voltage - Input: -
Voltage - Supply: 11V ~ 13V
Current - Supply: 2.4 mA
Operating Temperature: -25°C ~ 70°C
Mounting Type: -
Package / Case: -
Supplier Device Package: -

Paket: -

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MFS2323BMBA0EP

NXP

IC

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

Paket: -

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PCA9420KUKZ

NXP

IC

Applications: Microcontroller, MCU
Current - Supply: 4.5µA
Voltage - Supply: 3.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Supplier Device Package: 25-WLCSP (2.09x2.09)

Paket: -

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MC32PF4210A4ESR2

NXP

PF4210

Applications: Audio, Video
Current - Supply: -
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: 0°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN-EP (8x8)

Paket: -

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NVT4558HKX

NXP

IC SIM CARD LEVEL TRANS XQFN10

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: -
Voltage - VCCA: 1.08 V ~ 1.98 V
Voltage - VCCB: 1.62 V ~ 3.6 V
Input Signal: -
Output Signal: -
Output Type: Open Drain
Data Rate: 10MHz
Operating Temperature: -40°C ~ 85°C (TA)
Features: -
Mounting Type: Surface Mount
Package / Case: 10-XFQFN
Supplier Device Package: 10-XQFN (1.4x1.8)

Paket: -

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FH32K116LFT0VLFR

NXP

S32K116 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

Paket: -

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