NXP Produkte

MRF5S9150HR3

NXP

FET RF 68V 880MHZ NI-780

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 19.7dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.5A
• Power - Output: 33W
• Voltage - Rated: 68V
• Package / Case: NI-780
• Supplier Device Package: NI-780

Paket: NI-780

LD6806TD/12P,125

NXP

IC REG LINEAR 1.2V 200MA 5TSOP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.2V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.13V @ 200mA
• Current - Output: 200mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: 5-TSOP

Paket: SC-74A, SOT-753

PCA9410UKZ

NXP

IC REG BOOST 5V 0.5A SYNC

• Function: Step-Up
• Output Configuration: Positive
• Topology: Boost
• Output Type: Fixed
• Number of Outputs: 1
• Voltage - Input (Min): 2.5V
• Voltage - Input (Max): 5.25V
• Voltage - Output (Min/Fixed): 5V
• Voltage - Output (Max): -
• Current - Output: 500mA
• Frequency - Switching: 3MHz
• Synchronous Rectifier: Yes
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 9-UFBGA, WLCSP
• Supplier Device Package: 9-WLCSP (1.24x1.24)

Paket: 9-UFBGA, WLCSP

N74F3037D,512

NXP

IC GATE NAND 4CH 2-INP 16-SO

• Logic Type: NAND Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): -
• Current - Output High, Low: 67mA, 160mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2.4V
• Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Supplier Device Package: 16-SO
• Package / Case: 16-SOIC (0.295", 7.50mm Width)

Paket: 16-SOIC (0.295", 7.50mm Width)

74ABT541PW,112

NXP

IC BUFF/DVR TRI-ST 8BIT 20TSSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

Paket: 20-TSSOP (0.173", 4.40mm Width)

TDA19971AHN/C181Y

NXP

IC HDMI RECEIVER SGL 72HVQFN

• Type: Receiver
• Applications: TV
• Mounting Type: Surface Mount
• Package / Case: -
• Supplier Device Package: -

Paket: -

SC16C654BIBS,528

NXP

IC QUAD UART 64BYTE 48HVQFN

• Features: -
• Number of Channels: 4, QUART
• FIFO's: 64 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (6x6)

Paket: 48-VFQFN Exposed Pad

TJA1145T/FDJ

NXP

IC TRANSCEIVER CAN HS 14SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Full
• Receiver Hysteresis: 200mV
• Data Rate: -
• Voltage - Supply: 3.3 V ~ 5 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

Paket: 14-SOIC (0.154", 3.90mm Width)

MC8640DHX1250HC

NXP

IC MPU MPC86XX 1.25GHZ 1023BGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.25GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BCBGA, FCCBGA
• Supplier Device Package: 1023-FCCBGA (33x33)

Paket: 1023-BCBGA, FCCBGA

KMPC8349VVAJDB

NXP

IC MPU MPC83XX 533MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

Paket: 672-LBGA

MC9328MX21CVKR2

NXP

IC MPU I.MX21 266MHZ 289MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD
• Ethernet: -
• SATA: -
• USB: USB 1.x (2)
• Voltage - I/O: 1.8V, 3.0V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 289-LFBGA
• Supplier Device Package: -

Paket: 289-LFBGA

P5020NSN7MMB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 2.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

Paket: 1295-BBGA, FCBGA

SVF322R3K1CKU2

NXP

IC MCU 32BIT ROMLESS 176LQFP

• Core Processor: ARM? Cortex?-A5 + Cortex?-M4
• Core Size: 32-Bit Dual-Core
• Speed: 266MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
• Peripherals: LCD, SAI
• Number of I/O: 115
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 1.5MB
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP-EP (24x24)

Paket: 176-LQFP Exposed Pad

MC9S12XEQ384VAG

NXP

IC MCU 16BIT 384KB FLASH 144LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Paket: 144-LQFP

MC908AP64ACBE

NXP

IC MCU 8BIT 64KB FLASH 42PSDIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I2C, IRSCI, SCI, SPI
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 30
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 42-SDIP (0.600", 15.24mm)
• Supplier Device Package: 42-PSDIP

Paket: 42-SDIP (0.600", 15.24mm)

MC9S08DN32AVLF

NXP

IC MCU 8BIT 32KB FLASH 48LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Paket: 48-LQFP

MC9S12DG128CFUER

NXP

IC MCU 16BIT 128KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 59
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

Paket: 80-QFP

MC56F8365VFGE

NXP

IC MCU 16BIT 512KB FLASH 128LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number of I/O: 49
• Program Memory Size: 512KB (256K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 18K x 16
• Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 128-LQFP
• Supplier Device Package: 128-LQFP (14x20)

Paket: 128-LQFP

MC9S08GT16ACFDE

NXP

IC MCU 8BIT 16KB FLASH 48QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

Paket: 48-VFQFN Exposed Pad

MSC8144VT1000B

NXP

ENCRYPTION PACSUN R2.1 783FCBGA

• Type: SC3400 Core
• Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
• Clock Rate: 1GHz
• Non-Volatile Memory: External
• On-Chip RAM: 10.5MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.00V
• Operating Temperature: 0°C ~ 90°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Paket: 783-BBGA, FCBGA

HT2ICS2002W/V6F/RV

NXP

IC TRANSPONDER HITAG 2

• Type: RFID Transponder
• Frequency: 125kHz
• Standards: ISO 11784, ISO 11785
• Interface: -
• Voltage - Supply: 6.5V
• Operating Temperature: -55°C ~ 140°C
• Package / Case: Die
• Supplier Device Package: Wafer

Paket: Die

MKW30Z160VHM4

NXP

IC RF TXRX+MCU BLUETOOTH 32QFN

• Type: TxRx + MCU
• RF Family/Standard: Bluetooth
• Protocol: Bluetooth v4.1
• Modulation: GFSK
• Frequency: 2.4GHz
• Data Rate (Max): 1Mbps
• Power - Output: 5dBm
• Sensitivity: -91dBm
• Memory Size: 160kB Flash, 20kB SRAM
• Serial Interfaces: I2C, SPI, UART
• GPIO: 15
• Voltage - Supply: 1.45 V ~ 3.6 V
• Current - Receiving: 6.5mA ~ 15.4mA
• Current - Transmitting: 8.4mA ~ 18.5mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VFQFN

Paket: 32-VFQFN

TJA1052IT/2Y

NXP

DGTL ISOLATOR 2.5KV 2CH CAN 16SO

• Technology: Capacitive Coupling
• Type: CAN
• Isolated Power: No
• Number of Channels: 2
• Inputs - Side 1/Side 2: 1/1
• Channel Type: Unidirectional
• Voltage - Isolation: 2500Vrms
• Common Mode Transient Immunity (Min): 20kV/µs
• Data Rate: 5Mbps
• Propagation Delay tpLH / tpHL (Max): -
• Pulse Width Distortion (Max): -
• Rise / Fall Time (Typ): -
• Voltage - Supply: 3 V ~ 5.25 V
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SO

Paket: 16-SOIC (0.295", 7.50mm Width)

S9S12DG12W2CPVER

NXP

16-BIT MCU S12 CORE 128KB FLAS

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

Paket: 112-LQFP

SPC5603BF2CLL4

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 79
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 28K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

Paket: 100-LQFP

PNX9535E/V1,518

NXP

IC MEDIA PROCESSOR

• Applications: Multimedia
• Core Processor: TriMedia™
• Program Memory Type: -
• Controller Series: Nexperia
• RAM Size: -
• Interface: GPIO, Host Interface, I²C, PCI, USB, XIO
• Number of I/O: 8
• Voltage - Supply: 1.16V ~ 1.24V, 3.15V ~ 3.6V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 456-BGA
• Supplier Device Package: 456-PBGA (27x27)

Paket: 456-BGA

FD32K146HFT0VLHR

NXP

S32K146, M4F, FLASH 1M, RAM 128K

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

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TEA2017AAT-3Y

NXP

DCM/QR/CCM & MULTI MODE PFC + RE

• Applications: Digital Power Controller
• Voltage - Input: -
• Voltage - Supply: 36V
• Current - Supply: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

Paket: -

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