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NXP |
MOSFET N-CH 100V 37A TO220AB
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 100V
- Current - Continuous Drain (Id) @ 25°C: 37A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: -
- Input Capacitance (Ciss) (Max) @ Vds: 2293pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 138W (Tc)
- Rds On (Max) @ Id, Vgs: 40 mOhm @ 40A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Supplier Device Package: TO-220AB
- Package / Case: TO-220-3
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Paket: TO-220-3 |
Lager6.816 |
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NXP |
IC REG LINEAR 2.5V 150MA 5TSOP
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2.5V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.25V @ 150mA (Typ)
- Current - Output: 150mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 35µA ~ 150µA
- PSRR: 75dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Transient Voltage
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: SC-74A, SOT-753
- Supplier Device Package: 5-TSOP
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Paket: SC-74A, SOT-753 |
Lager6.352 |
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NXP |
IC BUFFER 1.8V 25BIT SOT536
- Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
- Supply Voltage: 1.7 V ~ 1.9 V
- Number of Bits: 25, 14
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 96-LFBGA
- Supplier Device Package: 96-LFBGA (13.5x5.5)
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Paket: 96-LFBGA |
Lager6.320 |
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NXP |
IC OCTAL D TRANSP LATCH 20SOIC
- Logic Type: D-Type Transparent Latch
- Circuit: 8:8
- Output Type: Tri-State
- Voltage - Supply: 1 V ~ 5.5 V
- Independent Circuits: 1
- Delay Time - Propagation: 20ns
- Current - Output High, Low: 16mA, 16mA
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SO
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Paket: 20-SOIC (0.295", 7.50mm Width) |
Lager7.408 |
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NXP |
IC HEX INV SCHMITT TRIG 14TSSOP
- Logic Type: Inverter
- Number of Circuits: 6
- Number of Inputs: 6
- Features: Schmitt Trigger
- Voltage - Supply: 1 V ~ 5.5 V
- Current - Quiescent (Max): 20µA
- Current - Output High, Low: 12mA, 12mA
- Logic Level - Low: 0.3 V ~ 1.1 V
- Logic Level - High: 1.4 V ~ 3.85 V
- Max Propagation Delay @ V, Max CL: 18ns @ 5V, 50pF
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Supplier Device Package: 14-TSSOP
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
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Paket: 14-TSSOP (0.173", 4.40mm Width) |
Lager7.584 |
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NXP |
IC RGSTRD DVR 3-ST 20BIT 56TVSOP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 1
- Number of Bits per Element: 20
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 12mA, 12mA
- Voltage - Supply: 1.2 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-TFSOP (0.173", 4.40mm Width)
- Supplier Device Package: 56-TSSOP
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Paket: 56-TFSOP (0.173", 4.40mm Width) |
Lager7.344 |
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NXP |
IC BUFF NINE SCHMT TIG 20SOIC
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 9
- Number of Bits per Element: 1
- Input Type: Schmitt Trigger
- Output Type: Open Drain
- Current - Output High, Low: -, 4mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SO
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Paket: 20-SOIC (0.295", 7.50mm Width) |
Lager2.432 |
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NXP |
IC BUS SWITCH BUFF 4CH 16TSSOP
- Type: Buffer, ReDriver
- Applications: I2C
- Input: 2-Wire Bus
- Output: 2-Wire Bus
- Data Rate (Max): 1MHz
- Number of Channels: 4
- Delay Time: 100ns
- Signal Conditioning: -
- Capacitance - Input: -
- Voltage - Supply: 2.7 V ~ 5.5 V
- Current - Supply: 1µA
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Paket: 16-TSSOP (0.173", 4.40mm Width) |
Lager4.528 |
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NXP |
IC MPU MPC82XX 266MHZ 516BGA
- Core Processor: PowerPC G2_LE
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
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Paket: 516-BBGA |
Lager3.760 |
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NXP |
IC MPU M683XX 25MHZ 144QFP
- Core Processor: CPU32
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 25MHz
- Co-Processors/DSP: -
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 144-BQFP
- Supplier Device Package: 144-QFP (28x28)
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Paket: 144-BQFP |
Lager7.272 |
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NXP |
IC MPU M683XX 25MHZ 357BGA
- Core Processor: CPU32+
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 25MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Paket: 357-BBGA |
Lager5.712 |
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NXP |
IC MPU MPC82XX 400MHZ 516BGA
- Core Processor: PowerPC G2_LE
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
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Paket: 516-BBGA |
Lager6.304 |
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NXP |
IC MPU M683XX 25MHZ 100LQFP
- Core Processor: M68000
- Number of Cores/Bus Width: 1 Core, 8/16-Bit
- Speed: 25MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 5.0V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Paket: 100-LQFP |
Lager9.492 |
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NXP |
IC MPU Q OR IQ 800MHZ 425TEBGA
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 425-FBGA
- Supplier Device Package: 425-TEPBGA I (19x19)
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Paket: 425-FBGA |
Lager6.848 |
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NXP |
IC MPU MPC74XX 1.4GHZ 360FCCBGA
- Core Processor: PowerPC G4
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.4GHz
- Co-Processors/DSP: Multimedia; SIMD
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-BCBGA, FCCBGA
- Supplier Device Package: 360-FCCBGA (25x25)
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Paket: 360-BCBGA, FCCBGA |
Lager7.956 |
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NXP |
IC MCU 32BIT 512KB FLASH 144BGA
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 96
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 8x12b
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 144-LBGA
- Supplier Device Package: 144-MAPBGA (13x13)
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Paket: 144-LBGA |
Lager3.952 |
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NXP |
IC MCU 32BIT ROMLESS 256BGA
- Core Processor: ARM9?
- Core Size: 32-Bit
- Speed: 200MHz
- Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
- Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
- Number of I/O: 60
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 80K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 256-BGA
- Supplier Device Package: 256-BGA (17x17)
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Paket: 256-BGA |
Lager4.112 |
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NXP |
IC MCU 16BIT ROMLESS 68PLCC
- Core Processor: XA
- Core Size: 16-Bit
- Speed: 30MHz
- Connectivity: EBI/EMI, I2C, UART/USART
- Peripherals: PWM, WDT
- Number of I/O: 32
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x8b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 68-LCC (J-Lead)
- Supplier Device Package: 68-PLCC (24.23x24.23)
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Paket: 68-LCC (J-Lead) |
Lager6.752 |
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NXP |
IC MCU 32BIT ROMLESS 144LQFP
- Core Processor: Coldfire V2
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
- Peripherals: DMA, I2S, POR, Serial Audio, WDT
- Number of I/O: 34
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 96K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 4x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Paket: 144-LQFP |
Lager5.056 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 64MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 79
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 28x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Paket: 100-LQFP |
Lager3.456 |
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NXP |
KINETIS KL17: 48MHZ CORTEX-M0+ U
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: I²C, LINbus, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 20x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Paket: 64-LQFP |
Lager2.000 |
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NXP |
IC MCU 32BIT 128KB FLASH 48HVQFN
- Core Processor: ARM® Cortex®-M33
- Core Size: 32-Bit Single-Core
- Speed: 96MHz
- Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
- Number of I/O: 30
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 80K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 7x16b SAR
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-HVQFN (7x7)
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Paket: - |
Request a Quote |
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NXP |
IC MCU 16/32B 512KB FLASH 64LQFP
- Core Processor: ARM7®
- Core Size: 16/32-Bit
- Speed: 60MHz
- Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O: 45
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 40K x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
- Data Converters: A/D 14x10b SAR; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Paket: - |
Lager414 |
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NXP |
SAF7770EL
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 364-LFBGA
- Supplier Device Package: 364-LFBGA (15x15)
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Paket: - |
Request a Quote |
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NXP |
SYSTEM BASIS CHIP FS8430
- Applications: System Basis Chip
- Current - Supply: 15mA
- Voltage - Supply: 60V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Paket: - |
Lager399 |
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NXP |
S12 CORE,48K FLASH,AU
- Core Processor: S12
- Core Size: 16-Bit
- Speed: 25MHz
- Connectivity: IrDA, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 40
- Program Memory Size: 48KB (48K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 1.5K x 8
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Paket: - |
Request a Quote |
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NXP |
DIODE SCHOTTKY TO-236AB
- Diode Type: -
- Voltage - DC Reverse (Vr) (Max): -
- Current - Average Rectified (Io): -
- Voltage - Forward (Vf) (Max) @ If: -
- Speed: -
- Reverse Recovery Time (trr): -
- Current - Reverse Leakage @ Vr: -
- Capacitance @ Vr, F: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
- Operating Temperature - Junction: -
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Paket: - |
Request a Quote |
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NXP |
POWER MANAGEMENT IC, PRE-PROG, 3
- Applications: High Performance i.MX 8, S32x Processor Based
- Current - Supply: 200µA
- Voltage - Supply: 2.5V ~ 5.5V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-HVQFN (6x6)
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Paket: - |
Request a Quote |
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