NXP Produkte

MRF7S21170HSR3

NXP

FET RF 65V 2.17GHZ NI-88OS

• Transistor Type: LDMOS
• Frequency: 2.17GHz
• Gain: 16dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.4A
• Power - Output: 50W
• Voltage - Rated: 65V
• Package / Case: NI-880S
• Supplier Device Package: NI-880S

Paket: NI-880S

MC33909N5AD

NXP

SBC SG 1 CAN 0 LIN HLQFP48

• Applications: System Basis Chip
• Current - Supply: 7mA
• Voltage - Supply: 3.5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

MCZ33395EWR2

NXP

IC MOTOR CONTROLLER PAR 32SOIC

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushless DC (BLDC)
• Function: Controller - Commutation, Direction Management
• Output Configuration: Pre-Driver - Half Bridge (3)
• Interface: PWM
• Technology: Power MOSFET
• Step Resolution: -
• Applications: General Purpose
• Current - Output: -
• Voltage - Supply: 5.5 V ~ 24 V
• Voltage - Load: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC

Paket: 32-SOIC (0.295", 7.50mm Width)

N74F138N,602

NXP

IC DECODER/DEMUX 3-8LINE 16DIP

• Type: Decoder/Demultiplexer
• Circuit: 1 x 3:8
• Independent Circuits: 1
• Current - Output High, Low: 1mA, 20mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

Paket: 16-DIP (0.300", 7.62mm)

74AHC259D-Q100J

NXP

IC ADDRESSABLE LATCH 8BIT 16SOIC

• Logic Type: D-Type, Addressable
• Circuit: 1 x 3:8
• Output Type: Standard
• Voltage - Supply: 2 V ~ 5.5 V
• Independent Circuits: 1
• Delay Time - Propagation: 10ps
• Current - Output High, Low: 8mA, 8mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

Paket: 16-SOIC (0.154", 3.90mm Width)

74LVCH244APW/AUJ

NXP

IC BUFFER/DVR 3-ST DUAL 20TSSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

Paket: 20-TSSOP (0.173", 4.40mm Width)

74ABT544D,623

NXP

IC TRANSCVR 3-ST 8BIT INV 24SOIC

• Logic Type: Transceiver, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

Paket: 24-SOIC (0.295", 7.50mm Width)

NX5DV330D,112

NXP

IC VIDEO MUX/DEMUX 1X2 16SOIC

• Applications: Video
• Multiplexer/Demultiplexer Circuit: 2:1
• Switch Circuit: -
• Number of Channels: 4
• On-State Resistance (Max): 10 Ohm
• Voltage - Supply, Single (V+): 4 V ~ 5.5 V
• Voltage - Supply, Dual (V±): -
• -3db Bandwidth: 300MHz
• Features: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

Paket: 16-SOIC (0.154", 3.90mm Width)

MPC857TZQ100B

NXP

IC MPU MPC8XX 100MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 100MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

Paket: 357-BBGA

MPC850DEVR50BU

NXP

IC MPU MPC8XX 50MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

Paket: 256-BBGA

MC711P2CFNE4

NXP

IC MCU 8BIT 32KB OTP 84PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: MI Bus, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 50
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• EEPROM Size: 640 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.21x29.21)

Paket: 84-LCC (J-Lead)

LPC4310FBD144,551

NXP

IC MCU 32BIT ROMLESS 144LQFP

• Core Processor: ARM? Cortex?-M4/M0
• Core Size: 32-Bit Dual-Core
• Speed: 204MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 83
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 168K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Paket: 144-LQFP

MCF51JU128VLH

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 48
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 17x12b, D/A 1x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Paket: 64-LQFP

MC9S08QE128CLD

NXP

IC MCU 8BIT 128KB FLASH 44LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

Paket: 44-LQFP

MM908E622ACPEK

NXP

IC QUAD HALF BRDG TRPL SW 54SOIC

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• RAM Size: 512 x 8
• Interface: SCI, SPI
• Number of I/O: 12
• Voltage - Supply: 9 V ~ 16 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOICW-EP

Paket: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

MC100ES6254FA

NXP

IC CLK BUFFER 2:3 3GHZ 32LQFP

• Type: Fanout Buffer (Distribution), Multiplexer
• Number of Circuits: 2
• Ratio - Input:Output: 2:3
• Differential - Input:Output: Yes/Yes
• Input: LVCMOS, LVPECL
• Output: LVPECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

Paket: 32-LQFP

KMZ43T,118

NXP

SENSOR LINEAR ANALOG 8SO

• Type: Linear
• Technology: Magnetoresistive
• Axis: X, Y
• Output Type: Analog Voltage
• Sensing Range: -
• Voltage - Supply: 5 V ~ 9 V
• Current - Supply (Max): -
• Current - Output (Max): -
• Resolution: -
• Bandwidth: -
• Operating Temperature: -40°C ~ 150°C (TA)
• Features: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

Paket: 8-SOIC (0.154", 3.90mm Width)

MMA6855BKWR2

NXP

ACCELEROMETER 120G 16QFN

• Type: Digital
• Axis: X
• Acceleration Range: ±120g
• Sensitivity (LSB/g): 4.096
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: SPI
• Voltage - Supply: 3.135 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (6x6)

Paket: 16-QFN Exposed Pad

MMA7456LT

NXP

ACCELEROMETER 2-8G I2C/SPI 14LGA

• Type: Digital
• Axis: X, Y, Z
• Acceleration Range: ±2g, 4g, 8g
• Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
• Sensitivity (mV/g): -
• Bandwidth: 62.5Hz ~ 125Hz
• Output Type: I2C, SPI
• Voltage - Supply: 2.4 V ~ 3.6 V
• Features: Adjustable Bandwidth, Selectable Scale
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-VFLGA
• Supplier Device Package: 14-LGA (3x5)

Paket: 14-VFLGA

MCZ33903DD5EK

NXP

SYSTEM BASIS CHIP 2 LIN 2X 5.0

• Applications: System Basis Chip
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

Paket: -

MCIMX6U1AVM10AD

NXP

I.MX 6DL ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

Paket: 624-LFBGA

FS32K142UFT0VLHT

NXP

S32K142 32-BIT MCU ARM

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 112MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Paket: 64-LQFP

LPC54S016JBD208E

NXP

32-BIT ARM CORTEX-M4

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number of I/O: 171
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 360K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

MC9S08AC60MFGER

NXP

S08AC 8-BIT MCU S08 CORE 60KB

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

Paket: 44-LQFP

LPC1751FBD80K

NXP

IC MCU 32BIT 32KB FLASH 80LQFP

• Core Processor: ARM® Cortex®-M3
• Core Size: 32-Bit Single-Core
• Speed: 100MHz
• Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 52
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
• Data Converters: A/D 6x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

Paket: -

LPC11E36FBD64-501

NXP

IC MCU 32BIT FLASH

• Core Processor: ARM® Cortex®-M0
• Core Size: 32-Bit Single-Core
• Speed: 50MHz
• Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
• Peripherals: -
• Number of I/O: 54
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: -
• Supplier Device Package: -

Paket: -

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FS32K142HFT0VLFT

NXP

S32K142, 256K FLASH, 32K RAM

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
• Number of I/O: 89
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 16x12b SAR; D/A 1x8b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Paket: -

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MC33FS6518CAER2

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

Paket: -

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