NXP Produkte

DC6M502X6/1218A,13

NXP

IC REG BCK PROG 0.5A SYNC 6WLCSP

• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Output Type: Programmable
• Number of Outputs: 1
• Voltage - Input (Min): 2.3V
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.2V, 1.8V
• Voltage - Output (Max): -
• Current - Output: 500mA
• Frequency - Switching: 6MHz
• Synchronous Rectifier: Yes
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 6-XFBGA, WLCSP
• Supplier Device Package: 6-WLCSP (1.36x0.96)

Paket: 6-XFBGA, WLCSP

74ABT32N,112

NXP

IC GATE OR 4CH 2-INP 14-DIP

• Logic Type: OR Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): 50µA
• Current - Output High, Low: 15mA, 20mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 3.4ns @ 5V, 50pF
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Supplier Device Package: 14-DIP
• Package / Case: 14-DIP (0.300", 7.62mm)

Paket: 14-DIP (0.300", 7.62mm)

74LV374PW,112

NXP

IC D-TYPE POS TRG SNGL 20TSSOP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 77MHz
• Max Propagation Delay @ V, Max CL: 19ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 16mA, 16mA
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Iq): 160µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)

Paket: 20-TSSOP (0.173", 4.40mm Width)

MCZ33290EF

NXP

IC SER LNK INTER ISO KLINE 8SOIC

• Applications: Automotive
• Interface: Serial
• Voltage - Supply: 8 V ~ 18 V
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC
• Mounting Type: Surface Mount

Paket: 8-SOIC (0.154", 3.90mm Width)

MPC8572LVTATLD

NXP

IC MPU MPC85XX 1.2GHZ 1023FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1023-BFBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

Paket: 1023-BFBGA, FCBGA

MPC8533EVTALF

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 90°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Paket: 783-BBGA, FCBGA

MPC8321CZQAFDC

NXP

IC MPU MPC83XX 333MHZ 516BGA

• Core Processor: PowerPC e300c2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

Paket: 516-BBGA

KMPC875ZT133

NXP

IC MPU MPC8XX 133MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 133MHz
• Co-Processors/DSP: Communications; CPM, Security; SEC
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: Cryptography
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

Paket: 256-BBGA

KMPC8349ZUAJF

NXP

IC MPU MPC83XX 533MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

Paket: 672-LBGA

MC7447ATHX1000NB

NXP

IC MPU MPC74XX 1.0GHZ 360FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-BCBGA, FCCBGA
• Supplier Device Package: 360-FCCBGA (25x25)

Paket: 360-BCBGA, FCCBGA

MCIMX6DP4AVT8AA

NXP

IC MPU I.MX6DP 852MHZ 624FCBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 852MHZ
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, DDR3L, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
• Ethernet: 10/100/1000 Mbps (1)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
• Package / Case: 624-FBGA, FCBGA
• Supplier Device Package: 624-FCBGA (21x21)

Paket: 624-FBGA, FCBGA

MC908JL8CDWE

NXP

IC MCU 8BIT 8KB FLASH 28SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 23
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 13x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

Paket: 28-SOIC (0.295", 7.50mm Width)

MCF5275CVM133

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 133MHz
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number of I/O: 69
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPBGA

Paket: 256-LBGA

S9S12G48F0MLH

NXP

IC MCU 16BIT 48KB FLASH 64LQFP

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Paket: 64-LQFP

S9S12ZVL16F0CLC

NXP

IC MCU 16BIT 32KB FLASH 32LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 19
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

Paket: 32-LQFP

MK10DN32VFM5

NXP

IC MCU 32BIT 32KB FLASH 32QFN

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 10x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

Paket: 32-VFQFN Exposed Pad

MK22FN256VLL12

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 33x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

Paket: 100-LQFP

MSC8144ETVT1000B

NXP

ENCRYPTION PACSUN R2.1 783FCBGA

• Type: SC3400 Core
• Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
• Clock Rate: 1GHz
• Non-Volatile Memory: External
• On-Chip RAM: 10.5MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.00V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Paket: 783-BBGA, FCBGA

MF1S5030DA8,118

NXP

MIFARE CLASSIC SMART CARD IC

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

OM5595,699

NXP

DEMO MIFARE 4 TAG SETS

• Type: Near Field Communication
• Frequency: -
• For Use With/Related Products: -
• Supplied Contents: 20 Tags

Paket: -

MC13234CHT

NXP

IC RF TXRX+MCU 802.15.4 48-VFLGA

• Type: TxRx + MCU
• RF Family/Standard: 802.15.4
• Protocol: -
• Modulation: O-QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 250kbps
• Power - Output: 2dBm
• Sensitivity: -93dBm
• Memory Size: 128kB Flash, 8kB RAM
• Serial Interfaces: I2C, SPI, UART
• GPIO: 32
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Receiving: 22.3mA ~ 34.2mA
• Current - Transmitting: 26.6mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-VFLGA, CSP

Paket: 48-VFLGA, CSP

MD7IC2755NR1

NXP

IC PWR AMP RF 2700MHZ TO-270-14

• Frequency: 2.7GHz
• P1dB: 44.8dBm (30W)
• Gain: 25dB
• Noise Figure: -
• RF Type: WiMax
• Voltage - Supply: 28V
• Current - Supply: 275mA
• Test Frequency: 2.7GHz
• Package / Case: TO-270-14 Variant, Flat Leads
• Supplier Device Package: TO-270 WB-14

Paket: TO-270-14 Variant, Flat Leads

PCA85162T/Q900/1HL

NXP

IC LCD DRIVER 32 SEG

• Display Type: LCD
• Configuration: 32 Segment
• Interface: I²C
• Digits or Characters: -
• Current - Supply: 80µA
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 95°C
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

MC7448VU800ND

NXP

32-BIT POWER ARCHITECTURE MPU 8

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

LS1043AXE8PQB

NXP

QORIQ 4XCPU 64-BIT ARM ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

Paket: -

SPC5748GSK0AVMJ2

NXP

TRIPLE CORE, 6M FLASH

• Core Processor: e200z2, e200z4, e200z4
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz/160MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 178
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

Paket: 256-LBGA

MC56F81648VLH

NXP

IC DSC 64KB/12KB LQFP64

• Type: -
• Interface: I2C, SCI, SPI
• Clock Rate: 100MHz
• Non-Volatile Memory: FLASH (64kB)
• On-Chip RAM: 12kB
• Voltage - I/O: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Paket: -

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NAFE71388B40BSE

NXP

IC 8-IN HIGH-SPEED 25V AFE

• Number of Bits: 24
• Number of Channels: 8
• Power (Watts): 135 mW
• Voltage - Supply, Analog: 2.97V ~ 3.63V
• Voltage - Supply, Digital: 2.97V ~ 3.63V
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-HVQFN (9x9)

Paket: -

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