NXP Produkte

BFU630F,115

NXP

TRANSISTOR NPN SOT343F

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 5.5V
• Frequency - Transition: 21GHz
• Noise Figure (dB Typ @ f): 0.75dB ~ 1.3dB @ 1.5GHz ~ 5.8GHz
• Gain: 13dB ~ 22.5dB
• Power - Max: 200mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 5mA, 2V
• Current - Collector (Ic) (Max): 30mA
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SOT-343F
• Supplier Device Package: 4-DFP

Paket: SOT-343F

PCF2111CT/1,112

NXP

IC LCD DRIVER 64SEG 40-VSOP

• Display Type: LCD
• Configuration: 64 Segment
• Interface: Serial
• Digits or Characters: -
• Current - Supply: 20µA
• Voltage - Supply: 2.25 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 40-BSOP (0.295", 7.50mm Width)
• Supplier Device Package: 40-VSOP

Paket: 40-BSOP (0.295", 7.50mm Width)

GTL2006PW,112

NXP

IC XLATR 13BIT GTL/LVTTL 28TSSOP

• Translator Type: Mixed Signal
• Channel Type: Unidirectional
• Number of Circuits: 1
• Channels per Circuit: 13
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: GTL
• Output Signal: LVTTL
• Output Type: Open Drain
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP

Paket: 28-TSSOP (0.173", 4.40mm Width)

74HCT4015D,112

NXP

IC DUAL 4BIT SHIFT REG 16-SOIC

• Logic Type: Shift Register
• Output Type: Push-Pull
• Number of Elements: 2
• Number of Bits per Element: 4
• Function: Serial to Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

Paket: 16-SOIC (0.154", 3.90mm Width)

74LV14N,112

NXP

IC HEX INV SCHMITT TRIG 14-DIP

• Logic Type: Inverter
• Number of Circuits: 6
• Number of Inputs: 6
• Features: Schmitt Trigger
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Max): 40µA
• Current - Output High, Low: 12mA, 12mA
• Logic Level - Low: 0.3 V ~ 1.1 V
• Logic Level - High: 1.4 V ~ 3.85 V
• Max Propagation Delay @ V, Max CL: 15ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Supplier Device Package: 14-DIP
• Package / Case: 14-DIP (0.300", 7.62mm)

Paket: 14-DIP (0.300", 7.62mm)

TDA18252HN/C1,518

NXP

IC DGTL CABLE SIL TUNER 48HVQFN

• Type: Silicon Tuner
• Applications: Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

Paket: 48-VFQFN Exposed Pad

MCZ33903BS5EKR2

NXP

IC SBC CAN HS 5.0V 32SOIC

• Applications: System Basis Chip
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

Paket: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

PCA82C251T/YM,118

NXP

IC CAN TXRX 24V 8SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 150mV
• Data Rate: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

Paket: 8-SOIC (0.154", 3.90mm Width)

MPC8544ECVTAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Paket: 783-BBGA, FCBGA

KMPC8379VRALG

NXP

IC MPU MPC83XX 667MHZ 689TEBGA

• Core Processor: PowerPC e300c4s
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (4)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

Paket: 689-BBGA Exposed Pad

KMPC8358EVRAGDGA

NXP

IC MPU MPC83XX 400MHZ 668BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 668-BBGA Exposed Pad
• Supplier Device Package: 668-PBGA-PGE (29x29)

Paket: 668-BBGA Exposed Pad

KMPC8543EVUANG

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

Paket: 783-BBGA, FCBGA

MPC8323VRAFDC

NXP

IC MPU MPC83XX 333MHZ 516BGA

• Core Processor: PowerPC e300c2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

Paket: 516-BBGA

MPC860DPZQ50D4R2

NXP

IC MPU MPC8XX 50MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (2), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

Paket: 357-BBGA

KMPC860DEVR80D4

NXP

IC MPU MPC8XX 80MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 80MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

Paket: 357-BBGA

MPC859DSLVR66A

NXP

IC MPU MPC8XX 66MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

Paket: 357-BBGA

MK30DN512ZVLQ10

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 102
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 46x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Paket: 144-LQFP

MCF51AC128CCLKE

NXP

IC MCU 32BIT 128KB FLASH 80LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 69
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (14x14)

Paket: 80-LQFP

MC9S08QE8CTG

NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

Paket: 16-TSSOP (0.173", 4.40mm Width)

MSC7115VM1000

NXP

DSP 16BIT W/DDR CTRLR 400-MAPBGA

• Type: SC1400 Core
• Interface: Host Interface, I2C, UART
• Clock Rate: 266MHz
• Non-Volatile Memory: External
• On-Chip RAM: 400kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

Paket: 400-LFBGA

MPR111EKR2

NXP

IC SENS PROXIMITY ANLG 54-SOIC

• Type: -
• Proximity Detection: -
• Number of Inputs: -
• LED Driver Channels: -
• Interface: -
• Resolution: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -
• Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOIC

Paket: 54-SOIC (0.295", 7.50mm Width) Exposed Pad

MC35FS4502CAE

NXP

FS4500

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

Paket: 48-LQFP Exposed Pad

S9S12G192F0MLF

NXP

16-BIT MCU S12 CORE 192KB FLAS

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 192KB (192K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 11K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Paket: 48-LQFP

S9S12G96ACLFR

NXP

16BIT 96K FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 3K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

Paket: 48-LQFP

MIMX8MM4CVTKZAA

NXP

IC MPU I.MX 8M MINI DUAL BGA

• Core Processor: ARM® Cortex®-A53
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.6GHz
• Co-Processors/DSP: ARM® Cortex®-M4
• RAM Controllers: DDR3L, DDR4, LPDDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: MIPI-DSI
• Ethernet: GbE
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
• Package / Case: 486-LFBGA, FCBGA
• Supplier Device Package: 486-FCBGA (14x14)

Paket: 486-LFBGA, FCBGA

LPC55S14JBD64K

NXP

IC MCU 32BIT 128KB FLASH 64HTQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 36
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 10x16b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

Paket: -

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S32K344NHT1MPBST

NXP

S32K344 ARM CORTEX-M7, 160 MHZ,

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit
• Speed: 160MHz
• Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
• Peripherals: DMA, I2S, Serial Audio, WDT
• Number of I/O: 218
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 24x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 172-QFP
• Supplier Device Package: 172-QFP (16x16)

Paket: -

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S9S12GN32J0MFT

NXP

IC MCU 16BIT 32KB FLASH 48TFQFN

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

Paket: -

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