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NXP |
MOSFET N-CH 100V 18A DPAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 100V
- Current - Continuous Drain (Id) @ 25°C: 18A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 21nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 633pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 79W (Tc)
- Rds On (Max) @ Id, Vgs: 90 mOhm @ 9A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: DPAK
- Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
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Paket: TO-252-3, DPak (2 Leads + Tab), SC-63 |
Lager3.904 |
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NXP |
MOSFET N-CH 60V 300MA SOT-23
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 60V
- Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs(th) (Max) @ Id: 2.5V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: -
- Input Capacitance (Ciss) (Max) @ Vds: 40pF @ 10V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 830mW (Ta)
- Rds On (Max) @ Id, Vgs: 5 Ohm @ 500mA, 10V
- Operating Temperature: -55°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: TO-236AB (SOT23)
- Package / Case: TO-236-3, SC-59, SOT-23-3
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Paket: TO-236-3, SC-59, SOT-23-3 |
Lager5.472 |
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NXP |
TRANS NPN 50V 0.15A SC-75
- Transistor Type: NPN
- Current - Collector (Ic) (Max): 150mA
- Voltage - Collector Emitter Breakdown (Max): 50V
- Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
- Current - Collector Cutoff (Max): 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 1mA, 6V
- Power - Max: 150mW
- Frequency - Transition: 100MHz
- Operating Temperature: 150°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SC-75, SOT-416
- Supplier Device Package: SC-75
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Paket: SC-75, SOT-416 |
Lager6.976 |
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NXP |
IC REG BUCK 1.2V 0.65A 6WLCSP
- Function: Step-Down
- Output Configuration: Positive
- Topology: Buck
- Output Type: Fixed
- Number of Outputs: 1
- Voltage - Input (Min): 2.3V
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 1.2V
- Voltage - Output (Max): -
- Current - Output: 650mA
- Frequency - Switching: 6MHz
- Synchronous Rectifier: Yes
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 6-XFBGA, WLCSP
- Supplier Device Package: 6-WLCSP (1.36x0.96)
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Paket: 6-XFBGA, WLCSP |
Lager4.400 |
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NXP |
IC LED DRIVER LIN DIM 25MA 8SO
- Type: Linear
- Topology: -
- Internal Switch(s): Yes
- Number of Outputs: 4
- Voltage - Supply (Min): 2.3V
- Voltage - Supply (Max): 5.5V
- Voltage - Output: -
- Current - Output / Channel: 25mA
- Frequency: 400kHz
- Dimming: I2C
- Applications: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager2.704 |
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NXP |
IC MCU LIN BATT MONITOR 48QFN
- Function: Battery Monitor
- Battery Chemistry: Multi-Chemistry
- Number of Cells: -
- Fault Protection: -
- Interface: CAN
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: 48-QFN (7x7)
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Paket: 48-VFQFN Exposed Pad |
Lager7.104 |
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NXP |
IC D-TYPE POS TRG SNGL 20TSSOP
- Function: Standard
- Type: D-Type
- Output Type: Non-Inverted
- Number of Elements: 1
- Number of Bits per Element: 8
- Clock Frequency: 250MHz
- Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
- Trigger Type: Positive Edge
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Current - Quiescent (Iq): 250µA
- Input Capacitance: 4pF
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
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Paket: 20-TSSOP (0.173", 4.40mm Width) |
Lager4.736 |
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NXP |
IC AMP AUDIO PWR 14W STER 9SIL
- Type: Class AB
- Output Type: 2-Channel (Stereo)
- Max Output Power x Channels @ Load: 14W x 2 @ 4 Ohm
- Voltage - Supply: 9 V ~ 28 V
- Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control
- Mounting Type: Through Hole
- Operating Temperature: -40°C ~ 85°C (TA)
- Supplier Device Package: 9-PDBS-EP
- Package / Case: 9-SIP Exposed Tab, Formed Leads
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Paket: 9-SIP Exposed Tab, Formed Leads |
Lager6.992 |
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NXP |
IC C2K 1.2GHZ 16CH VOIP 625BGA
- Function: -
- Interface: -
- Number of Circuits: -
- Voltage - Supply: -
- Current - Supply: -
- Power (Watts): -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Paket: - |
Lager4.416 |
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NXP |
IC DETECTOR MULT SWITCH 32-SOIC
- Applications: Switch Monitoring
- Interface: SPI Serial
- Voltage - Supply: 8 V ~ 26 V
- Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Supplier Device Package: 32-SOIC EP
- Mounting Type: Surface Mount
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Paket: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Lager6.976 |
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NXP |
IC MUX/DEMUX 4X1 16TSSOP
- Switch Circuit: SP4T
- Multiplexer/Demultiplexer Circuit: 4:1
- Number of Circuits: 2
- On-State Resistance (Max): 85 Ohm
- Channel-to-Channel Matching (ΔRon): 2 Ohm
- Voltage - Supply, Single (V+): 1 V ~ 6 V
- Voltage - Supply, Dual (V±): -
- Switch Time (Ton, Toff) (Max): 46ns, 32ns
- -3db Bandwidth: 200MHz
- Charge Injection: -
- Channel Capacitance (CS(off), CD(off)): 3.5pF
- Current - Leakage (IS(off)) (Max): 2µA
- Crosstalk: -60dB @ 1MHz
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Paket: 16-TSSOP (0.173", 4.40mm Width) |
Lager6.352 |
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NXP |
IC MPU MPC8XX 81MHZ 256BGA
- Core Processor: PowerPC
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 81MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: LCD, Video
- Ethernet: 10 Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
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Paket: 256-BBGA |
Lager4.752 |
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NXP |
IC MPU MPC8XX 80MHZ 357BGA
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 80MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10 Mbps (2), 10/100 Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
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Paket: 357-BBGA |
Lager2.800 |
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NXP |
IC MPU MPC74XX 400MHZ 360FCCLGA
- Core Processor: PowerPC G4
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-CLGA, FCCLGA
- Supplier Device Package: 360-FCCLGA (25x25)
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Paket: 360-CLGA, FCCLGA |
Lager5.824 |
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NXP |
IC MPU I.MX31 532MHZ 473MAPBGA
- Core Processor: ARM1136JF-S
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 532MHz
- Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
- RAM Controllers: DDR
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keyboard, Keypad, LCD
- Ethernet: -
- SATA: -
- USB: USB 2.0 (3)
- Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
- Operating Temperature: -20°C ~ 70°C (TA)
- Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
- Package / Case: 473-LFBGA
- Supplier Device Package: -
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Paket: 473-LFBGA |
Lager2.752 |
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NXP |
IC MPU MPC83XX 400MHZ 473MAPBGA
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (3)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 473-LFBGA
- Supplier Device Package: 473-MAPBGA (19x19)
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Paket: 473-LFBGA |
Lager4.864 |
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NXP |
IC MCU 8BIT ROMLESS 52PLCC
- Core Processor: HC11
- Core Size: 8-Bit
- Speed: 3MHz
- Connectivity: SCI, SPI
- Peripherals: POR, WDT
- Number of I/O: 38
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: 512 x 8
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 8x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 52-LCC (J-Lead)
- Supplier Device Package: 52-PLCC (19.1x19.1)
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Paket: 52-LCC (J-Lead) |
Lager21.600 |
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NXP |
IC MCU 32BIT 128KB FLASH 100LQFP
- Core Processor: ARM? Cortex?-M0+
- Core Size: 32-Bit
- Speed: 50MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: DMA, LCD, WDT
- Number of I/O: 68
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 12x16b, 4x24b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Paket: 100-LQFP |
Lager3.872 |
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NXP |
IC RTC CLK/CALENDAR I2C 8SO
- Type: Clock/Calendar
- Features: Alarm, Leap Year, Square Wave Output
- Memory Size: -
- Time Format: HH:MM:SS (12/24 hr)
- Date Format: YY-MM-DD-dd
- Interface: I2C, 2-Wire Serial
- Voltage - Supply: 0.9 V ~ 5.5 V
- Voltage - Supply, Battery: -
- Current - Timekeeping (Max): 0.6µA @ 3.3V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SO
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Paket: 8-SOIC (0.154", 3.90mm Width) |
Lager2.032 |
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NXP |
IC MIFARE SMART CARD 40HVQFN
- Type: -
- Frequency: -
- Standards: -
- Interface: -
- Voltage - Supply: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Paket: - |
Lager6.876 |
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NXP |
IC RF TRANSMITTER UHF 14-TSSOP
- Frequency: 315 ~ 434MHz, 868 ~ 928MHz
- Applications: General Data Transfer
- Modulation or Protocol: FSK, OOK
- Data Rate (Max): 10 kbps
- Power - Output: -3dBm
- Current - Transmitting: 11.6mA
- Data Interface: PCB, Surface Mount
- Antenna Connector: PCB, Surface Mount
- Memory Size: -
- Features: -
- Voltage - Supply: 1.9 V ~ 3.6 V
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
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Paket: 14-TSSOP (0.173", 4.40mm Width) |
Lager6.102 |
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NXP |
PF1550
- Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply: -
- Voltage - Supply: 3.8 V ~ 7 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-QFN (5x5)
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Paket: 40-VFQFN Exposed Pad |
Lager2.304 |
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NXP |
S08DZ 8-BIT MCU S08 CORE 128KB
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 87
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Paket: 100-LQFP |
Lager3.088 |
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NXP |
IC MCU 32BIT 2MB FLASH 176LQFP
- Core Processor: e200z4d, e200z0h
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz, 120MHz
- Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 16
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 5V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Paket: - |
Request a Quote |
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NXP |
POWER MANAGEMENT IC 3 BUCK REGS
- Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply: -
- Voltage - Supply: 4.1V ~ 6V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 40-VFQFN Exposed Pad
- Supplier Device Package: 40-HVQFN (5x5)
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Paket: - |
Request a Quote |
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NXP |
POWER-EFFICIENT MICROCONTROLLERS
- Core Processor: ARM® Cortex®-M4
- Core Size: 32-Bit
- Speed: 180MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O: 145
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 360K x 8
- Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
- Data Converters: A/D 12x12b SAR
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 180-TFBGA
- Supplier Device Package: 180-TFBGA (12x12)
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Paket: - |
Request a Quote |
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NXP |
K32 L2A 64LQFP
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit
- Speed: 72MHz
- Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
- Peripherals: DMA, LCD, PWM, WDT
- Number of I/O: 50
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (10x10)
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Paket: - |
Request a Quote |
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NXP |
IC MCU 16BIT 96KB FLASH 48LQFP
- Core Processor: S12Z
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
- Peripherals: DMA, LVD, POR, PWM, WDT
- Number of I/O: 28
- Program Memory Size: 96KB (96K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
- Data Converters: A/D 10x12b SAR; D/A 1x8b
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 48-LQFP
- Supplier Device Package: 48-LQFP (7x7)
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Paket: - |
Request a Quote |
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